face-meltingとは 意味・読み方・使い方

To provide a snow melting system without wasteful power usage due to excessive heating and melting residue due to insufficient heating by automatic heating and completion while monitoring a temperature of a snow melting face in the snow melting system melting falling and accumulating snow on a parking space and an approach.例文帳に追加

駐車場やアプローチに降り積もる雪を融かす融雪装置において、融雪面の温度を監視しながら、自動で加熱終了することで、過剰な加熱による無駄な電力使用や、加熱不足による融かし残しのない融雪装置を提供する。 - 特許庁

The slug scattered during melting and refining, and scattered and accumulated on the upper face of the film 3 is locked on the upward inclined face 3a.例文帳に追加

溶解精錬中で飛散してフイン３の上面に飛散堆積したスラグは、上向き傾斜面３ａに係止される。 - 特許庁

This electron beam melting method comprises arranging a main material Q to be melted and a preliminary material P to be melted in an electron beam melting furnace, at first, melting the preliminary material with the electron beam in a reduced pressure to form a molten metal face, and them melting the material Q in the melting furnace with the electron beam, while holding the reduced pressure condition.例文帳に追加

電子ビーム溶解炉内に本溶解材Ｑと予備溶解材Ｐとを配置し、先ず予備溶解材を減圧下で電子ビーム溶解して溶湯面を形成した後、減圧状態を保持したまま溶解炉内において本溶解材Ｑを電子ビーム溶解する。 - 特許庁

The molding treatment for forming the peaks 13 is carried out at a temperature lower than the melting point of the front face sheet 2.例文帳に追加

凸部１３の賦型処理は表面シート２の融点よりも低い温度でおこなわれる。 - 特許庁

To provide a face-like heater for a snow melting device contriving the reduction of a snow melting time and energy saving by electricity saving by displaying optimum snow melting performance on the snow falling characteristic of a cold district.例文帳に追加

寒冷地の降雪特性に最適な融雪性能を発揮して、融雪時間の短縮と、節電による省エネルギーを図った融雪装置用の面状発熱体の提供を目的とする。 - 特許庁

At a snowfall, a control means 3 gives a snow melting heat quantity to a snow melting panel 2 with a heating means, the temperature of the upper face of the snow melting panel 2 quickly rises, and snow is melted in a short time.例文帳に追加

降雪時には制御手段３が加熱手段にて融雪用熱量を融雪パネル２に与えて、融雪パネル２の上面は温度が速やかに上昇するので、短時間に融雪が行える。 - 特許庁

A low melting point metal having the melting point of ≤350°C is fused and is applied on a rotating semiconductor substrate to deposit a metallic thin film on the face of the semiconductor substrate.例文帳に追加

融点が３５０℃以下の低融点金属を溶融させ、回転させた半導体基板に塗布し、半導体基板面に金属の薄膜を形成する。 - 特許庁

To prevent melting of the rear face treatment layer of a semiconductor wafer by a method, wherein after polishing surface of the semiconductor wafer, the polished face of the wafer is cleaned and then is mirror-polished and thereafter subjecting it to a prescribed rear face treatment to the rear face of the semiconductor wafer.例文帳に追加

研削後の洗浄時にウェーハ裏面処理層が溶損せず、しかも表面研削時に半導体ウェーハを傷つけにくい高平坦度ウェーハの製造方法を提供する。 - 特許庁