「低温硬化性接着剤」に関連した英語例文の一覧と使い方 - Weblio英語例文検索

耐熱接着性ならびに貯蔵安定性および低温硬化性に優れる湿気硬化性一液型ウレタン系接着剤組成物を提供する。例文帳に追加

To provide a moisture-curing one-pack type urethane adhesive composition that has excellent heat-resistant adhesion, storage stability and cold-curing properties. - 特許庁

低温かつ短時間で硬化でき、更に、ポリイミドに対する接着性に優れる熱硬化性接着剤組成物の提供。例文帳に追加

To provide a thermosetting adhesive composition which is curable at a low temperature and in a short time and excellent in adhesiveness to polyimide. - 特許庁

低温短時間接続性に優れた電子部品用熱硬化性接着剤組成物を提供する。例文帳に追加

To provide a thermosetting adhesive composition for electronic components excellent in bonding property at a low temperature in a short time. - 特許庁

低温硬化性、高接着力、高信頼性を満足する絶縁性接着剤フィルム及び異方導電性接着フィルムを提供する。例文帳に追加

To provide an insulating adhesive film satisfying low-temperature curability, a high adhesive force and high reliability, and to provide an anisotropically electroconductive adhesive film. - 特許庁

低温での加熱硬化が可能で、高い接続信頼性を有する接着剤を提供すること。例文帳に追加

To provide an adhesive which is heat curable at low temperature while having high connecting reliability. - 特許庁

このように、本発明の接着剤は低温、硬化型であり、かつ、保存性が高い。例文帳に追加

As a result, the adhesive of the present invention is low- temperature curing type and has high shelf life. - 特許庁

低温、短時間の条件で硬化し、かつ、接続信頼性の高い接着剤を得る。例文帳に追加

To obtain an adhesive curable under conditions of a low temperature and a short time, and having high connection reliability. - 特許庁

低温、短時間の条件で硬化し、かつ、保存性の高い接着剤を得る。例文帳に追加

To obtain an adhesive having a high storage stability and hardening in a short time under a low temperature. - 特許庁

また、含浸用の接着剤樹脂としては、硬化速度や低温時の硬化性、耐候性、配合作業性に優れたＭＭＡ系樹脂が最も好ましい。例文帳に追加

As the adhesive resin for the impregnation, an MMA-based resin, which is excellent in curing speed, curability at a low temperature, weatherability and mixing workability, is most preferable. - 特許庁

ゴム、金属またはプラスチック用の接着剤に好適であり、低温域での硬化性にも優れた硬化性樹脂組成物の提供。例文帳に追加

To provide a curable resin composition which is suited for an adhesive for a rubber, a metal or a plastic and excels in curability in a low temperature range as well. - 特許庁

室温保存性、低温硬化性、流動性および接着性に優れた精密部品用接着剤組成物を提供すること。例文帳に追加

To provide an adhesive composition for precision parts which excels in room temperature storability, low-temperature curability, flowability, and adhesive properties. - 特許庁

本発明は樹脂粒子に主硬化剤を含浸させることで、潜在性硬化剤粒子の主硬化剤含有量が多くなっており、接着剤が低温で硬化する。例文帳に追加

In the invention, the content of a main hardening agent of the latent hardening agent particle is increased by impregnating resin particles with the main hardening agent, and an adhesive is hardened at a low temperature. - 特許庁

貯蔵安定性及び低温硬化における接着強度（低温硬化性）に優れるエポキシ樹脂組成物とすることができるエポキシ樹脂用硬化剤組成物を提供すること。例文帳に追加

To provide a curing agent composition for an epoxy resin, which can make an epoxy resin composition excellent in storage stability and adhesive strength in low-temperature curing (low-temperature curability). - 特許庁

この一液型熱硬化性接着剤組成物は、貯蔵安定性に優れ、また、柔軟なフィルムに対する接着性と、硬いフィルムに対する接着性とを兼ね備え、さらに、低温硬化性にも優れる。例文帳に追加

This one-component type thermosetting adhesive composition is excellent in storage stability, has adhesion to a soft film as well as adhesion to a hard film, and is excellent in low-temperature curability. - 特許庁

貯蔵安定性に優れると共に、可使時間が長く、低温硬化性に優れ、夏季と冬季での接着剤の切り替えが不必要であり、通年使用可能な湿気硬化型ウレタン接着剤組成物を提供する。例文帳に追加

To provide a moisture-curing type urethane adhesive composition excellent in storage stability, having long pot life, excellent in a low-temperature curing property and making changeover of adhesive in summer season and winter season unnecessary and being useable all year. - 特許庁

１５０℃程度の低温でも流動性および反応性を有し、かつ高い接着強度と接着信頼性を有する熱硬化性接着剤および接着シートを提供すること。例文帳に追加

To provide a thermosetting adhesive and an adhesive sheet having flowability and reactivity at low temperature such as 150°C and having high bond strength and adhesive reliability. - 特許庁

低温下においてもオレフィン系樹脂に対して優れた密着性を有する湿気硬化型反応性ホットメルト接着剤を提供する。例文帳に追加

To provide a moisture-curing type reactive hot-melt adhesive having excellent adhesiveness to an olefin-based resin even at low temperatures. - 特許庁

保存性と低温速硬化性の両立が可能なフィルム状接着剤及びこれを用いた接続部材を提供する。例文帳に追加

To provide a filmy adhesive having both of preservability and low-temperature rapid curability: and to provide an adhesive member using the adhesive. - 特許庁

一液性エポキシ樹脂で、保存安定性が良好であり、かつ比較的低温で硬化性が良好で接着強度にも優れている熱硬化型粘接着剤組成物を提供する。例文帳に追加

To provide a heat curing type pressure-sensitive adhesive composition which is one-pack epoxy resin composition having excellent storage stability while having excellent curability at relatively low temperature and superior adhesive strength. - 特許庁

熱硬化性樹脂と、導電性粒子と、自己発熱可能な物質とを含む導電性接着剤を用いることにより、自己発熱可能な物質を発熱させて熱硬化性樹脂の硬化を促進させ、硬化時間を短縮し、かつ硬化温度を低温化させる。例文帳に追加

This conductive adhesive containing a thermosetting resin, conductive particles and a substance capable of generating heat by itself is used to allow the substance to generate heat by itself to thereby accelerate the cure of the thermosetting resin, shorten the cure time and lower the curing temperature. - 特許庁

人造大理石に対して高剥離強度であり、しかも、低温でも速硬化性に優れた人造大理石用接着剤組成物を提供する。例文帳に追加

To provide an adhesive composition for artificial marble exhibiting high peel strength to the artificial marble and excellent in rapid curability even at low temperatures. - 特許庁

貯蔵安定性に優れ、かつ、比較的低温で短時間に硬化させることができる電子部品接合用接着剤を提供する。例文帳に追加

To provide an adhesive for bonding electronic parts which is excellent in storage stability and can be curable at a relatively low temperature and for a short time. - 特許庁

低温硬化性に優れるとともに常温での貼り付け可能時間が長く、多様な条件下で使用可能な接着剤組成物を提供する。例文帳に追加

To provide an adhesive composition that has excellent low-temperature curability, a long possible time of adhesion at a normal temperature and is usable under various conditions. - 特許庁

低温かつ短時間で硬化して優れた接着性を示し、劣化を引き起こす成分を含まない硬化性樹脂組成物であって、特に有機ＥＬ素子の封止用接着剤として有用な組成物を提供すること。例文帳に追加

To obtain a curable resin composition that is cured at a low temperature in a short time, exhibits excellent adhesiveness and does not contain a component to cause degradation and is useful as an adhesive for sealing especially an organic EL element. - 特許庁

有機溶剤を含まず、いずれの被着体をも接着することが可能であり、低温〜常温硬化性を有し、且つ低粘度で作業性、接着性に優れた新規コンタクト接着剤を提供する。例文帳に追加

To provide a new contact adhesive which contains no organic solvent, can bond any adherend, has curability at a low to ordinary temperature, and is excellent in workability and adhesiveness because of low viscosity. - 特許庁

低温での硬化が可能であると共に、高温高湿の環境下でも接着性および接続性に優れた接着剤組成物、およびこれを含有する異方導電性接着剤の実現。例文帳に追加

To provide an adhesive composition curable at a low temperature and excellent in adhesiveness and electroconnectivity even in a high temperature and humidity environment and an anisotropically electroconductive adhesive containing the adhesive composition. - 特許庁

低温貼付性、熱時流動性、及び加熱硬化後の信頼性のいずれの点でも十分に良好な接着剤組成物、並びにそれを用いたフィルム状接着剤、接着シート及び半導体装置を提供すること。例文帳に追加

To provide an adhesive composition that is sufficiently good in any of low-temperature adhesiveness, fluidity when heated, and reliability after heat curing, and a film-shaped adhesive, an adhesive sheet, and a semiconductor device using the same. - 特許庁

低温短時間で硬化させた場合であっても、十分な接着性及び接続信頼性を得ることを可能とする接着剤組成物、それを用いた回路接続用接着剤及び接続体を提供すること。例文帳に追加

To provide an adhesive composition which ensures sufficient adhesiveness and connection reliability even when the composition is cured at a low temperature in a short time, and to provide an adhesive for circuit connection and a connected product, using the same. - 特許庁

硬化前は適度な粘弾性を有し、弱い圧力で圧着することができ、有色、無色を問わず低温、且つ短時間の加熱により硬化を完了させることができ、硬化後は高い凝集力により優れたクリープ性や剥離性を有する硬化型粘接着剤組成物、硬化型粘接着剤、及びこれを用いた粘接着シートを提供する。例文帳に追加

To obtain a heat curable pressure-sensitive adhesive composition, a heat curable pressure-sensitive adhesive, and to prepare a pressure-sensitive adhesive sheet, which have a proper viscoelasticity and adhering by a weak pressure before curing and capable of completely curing at a low temperature in a short time irrespectively of colored or not colored, and have an excellent creeping property and peelability causing high cohesive power after curing. - 特許庁

耐溶剤性、耐薬品性、耐熱性、低温特性、低透湿性、電気絶縁性に優れ、短時間の加熱で基材に対して良好な接着性を示し、耐酸性が向上した硬化物を与える接着剤組成物を提供する。例文帳に追加

To provide an adhesive composition providing a cured product which is excellent in solvent resistance, chemical resistance, heat resistance, low-temperature properties, low moisture permeability and electric insulation, exhibiting good adhesiveness for a base material by short-time heating, and improved in acid resistance. - 特許庁

接着剤の硬化反応速度を容易に制御することができ、低温、低圧の接着条件で高い導通信頼性と接着力を得ることができる異方性導電フィルムを提供する。例文帳に追加

To provide an anisotropic electroconductive film capable of readily controlling a curing reaction rate of an adhesive and obtaining high reliability of conduction and adhesive force under low-temperature and low-pressure conditions. - 特許庁

接着剤の硬化反応速度を容易に制御することができ、低温、低圧の接着条件で高い導通信頼性と接着力を得ることができる異方性導電フィルムを提供する。例文帳に追加

To provide an anisotropic conductive film that makes it possible to easily control the curing reaction rate of adhesives and that can give a high conduction reliability and a high adhesive force under low-temperature and low-pressure adhesion conditions. - 特許庁

電子部品を配線基板にＮＣＦ接合するための絶縁性接着剤として、低温速重合硬化性に優れ、良好な接続信頼性を実現できる、ラジカル重合性のアクリル系絶縁性接着剤を提供する。例文帳に追加

To provide a radical polymerizable acrylic insulative adhesive which is excellent in low-temperature quick polymerization curability and allows achievement of good connection reliability as an insulative adhesive for NCF-joining an electronic component to a wiring board. - 特許庁

熱硬化性樹脂による高い接続信頼性を有し、かつ、低温短時間硬化性と貯蔵安定性を両立でき、更には、基板への貼付性の良好な回路接続用フィルム接着剤を提供すること。例文帳に追加

To provide a filmy adhesive for circuit connection having high connection reliability based on a thermosetting resin, satisfying both of low-temperature quick curability and storage stability, and showing good sticking property to a substrate. - 特許庁

熱硬化性樹脂による高い接続信頼性を有し、かつ、低温短時間硬化性と貯蔵安定性を両立でき、更には、基板への貼付性の良好なフィルム接着剤を提供すること。例文帳に追加

To provide a filmy adhesive having high connection reliability based on a thermosetting resin, satisfying both of low-temperature quick curability and storage stability, and showing good sticking property to a substrate. - 特許庁

低温での加工性（低温貼付性）、及び、耐リフロー性を高度に満足することができ、かつダイボンド後の組立工程で受ける熱履歴による十分な硬化性も達成できる接着剤組成物を提供すること。例文帳に追加

To provide an adhesive composition that highly satisfies low temperature processability (low temperature adhesiveness) and reflow resistance, and is sufficiently cured by a thermal history received in an assembling process after die bonding. - 特許庁

低温硬化性と貯蔵安定性とを高度に両立することが可能なエポキシ樹脂用マイクロカプセル型潜在性硬化剤及びその製造方法、一液性エポキシ樹脂組成物、エポキシ樹脂硬化物、接着剤、接合用フィルム、導電性材料並びに異方導電性材料を提供する。例文帳に追加

To provide a microcapsule type latent curing agent for epoxy resin highly compatible in both cold curability and stability in storage and a method for producing the same, one-pack epoxy resin composition, cured product of the epoxy resin, adhesive, film for bonding, conductive material, and anisotropically conductive material. - 特許庁

耐溶剤、耐薬品、耐熱、低温、低透湿、電気特性に優れ、機械的強度と接着特性の向上が両立しうる硬化物を与える接着剤組成物の製造方法。例文帳に追加

To provide a method for producing an adhesive composition giving a cured material excellent in solvent resistance, chemical resistance and heat resistance, and low temperature, low moisture permeability and electric characteristics, and improving both mechanical strength and adhesion characteristics simultaneously. - 特許庁

本発明が解決しようとする課題は、優れた低温硬化性を有し、高温高湿度下で十分な貼付可能時間を有する湿気硬化性ポリウレタン樹脂系接着剤を提供することである。例文帳に追加

To provide a moisture-curing polyurethane resin-based adhesive having excellent low-temperature curability and having an enough time available for application at a high temperature and high humidity. - 特許庁

微細回路同士の電気的接続において、特に低温短時間での接続も可能で、且つ、接着性、接続信頼性、保存安定性、リペア性にも優れる加熱硬化型異方導電性接着剤を提供する。例文帳に追加

To provide a thermosetting bonding agent of the anisotropic conduction type capable of estabilishing electrical connection between microstructural circuits even under low-temperature short-work conditions, excellent in bonding strength, connection reliability, preservation stability, and in repairability. - 特許庁

基材との密着性に優れ、硬化物が低温から高温までの広い温度範囲において優れた柔軟性を有し、構造用接着剤として好適な硬化性樹脂組成物及びそれを含有してなる自動車構造用接着剤を提供する。例文帳に追加

To provide a curable resin composition, which is excellent in the adhesiveness with a substrate and is preferable as a structural adhesive and forms a cured matter having an excellent flexibility in a wide temperature range between low and high temperatures; and to provide an automotive structural adhesive containing the composition. - 特許庁

エポキシ樹脂を包むマイクロカプセル２を異方導電接着剤１に分散して硬化剤３と隔離し、その内包量、粒径、強度を調整すれば、熱圧着時まで安定した保存性を示すとともに、熱圧着時には低温、短時間で硬化する異方導電接着剤１を得ることができる。例文帳に追加

The micro-capsules 2 enwrapping the epoxy resin are dispersed in the anisotropic electroconductive adhesive 1 and isolated from the hardening agent, and the content, particle size, and strength are adjusted, and thereby the resultant adhesive 1 can be preserved stably till the time of hot pressure attachment, and at that time, hardens at low temperatures in a short time. - 特許庁

微細な回路を持つ基板に対する充填性、低温でのラミネート性能、低弾性率かつ接着性、耐熱性に優れた硬化物となり得る接着剤組成物、それを含む接着フィルム及び該接着フィルムを用いた半導体装置の製造方法を提供する例文帳に追加

To provide an adhesive composition providing a cured product having excellent properties for filling a substrate having a fine circuit, laminate properties at low temperature, low modulus, adhesiveness and heat resistance; and to provide an adhesive film including the composition, and a method for producing a semiconductor device by using the adhesive film. - 特許庁

十分な低温速硬化性を有し、且つ活性光線の照射直後の硬化反応が抑制された接着剤組成物、それを用いたフィルム状接着剤及び回路接続材料、並びにその回路接続材料を用いた回路部材の接続構造及びその製造方法を提供すること。例文帳に追加

To provide an adhesive composition having a satisfactory low temperature rapid curability and restrained in the curing reaction immediately after the irradiation of active rays; to provide a film-like adhesive and a circuit connecting material using it; to provide a connecting structure of a circuit member using the circuit connecting material; and to provide its manufacturing method. - 特許庁

十分な低温速硬化性を有し、且つ活性光線の照射直後の硬化反応が抑制された接着剤組成物、それを用いたフィルム状接着剤及び回路接続材料、並びにその回路接続材料を用いた回路部材の接続構造及びその製造方法を提供すること。例文帳に追加

To provide an adhesive agent composition showing a sufficiently rapid curing property at low temperatures and suppression of curing reaction immediately after being irradiated by active ray as well, and also to provide a film-type adhesive agent and a circuit connecting material using the same, a connecting structure of circuit materials using the above circuit connecting materials and a preparation process of the above structure. - 特許庁