「金メッキする」に関連した英語例文の一覧と使い方(4ページ目) - Weblio英語例文検索

金属アレルギーを誘発する虞のあるニッケルメッキに替えて、光沢が良く白色優美であり耐食性、厚付け性にすぐれ優れた白色光沢メッキを施すことができるパラジウム合金メッキ液を提供することである。例文帳に追加

To provide a palladium alloy plating solution capable of applying white, bright plating good in glosiness, white and beautiful and excellent in corrosion resistance and thickening property instead of nickel plating having anxity of inducing metal allergy. - 特許庁

生産性に優れ、しかも電極にビームリードボンディングによって接合させる際に、初期及び加熱後において電極との高い接合強度を有するビームリードの金メッキ方法を提供する。例文帳に追加

To provide the gold plating method of a beam lead having high joining strength with an electrode in an initial period and after heating at the time of joining the electrode by beam lead bonding with excellent productivity. - 特許庁

ワイヤループへの振動の洩れに起因する波形歪みを解消し、かつ基板の電極上の金メッキ層を薄くしてもワイヤボンディングの引張強度を確保できる圧電部品を提供する。例文帳に追加

To obtain a piezoelectric component that eliminates waveform distortion caused by leakage of vibration to a wire loop and where a tensile strength of wire bonding can be ensured even when a thin gold plating layer is employed for electrodes on a substrate. - 特許庁

硬化物の可撓性や半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、有機溶剤又は希アルカリ溶液で現像ができ、ソルダーレジスト用及び層感絶縁層用に適する樹脂組成物を提供する。例文帳に追加

To provide a resin composition giving a cured product having excellent flexibility, soldering heat-resistance, thermal aging resistance and electroless gold plating resistance, developable with organic solvent or dilute alkali solution and suitable for solder resist and interlaminar insulation layer. - 特許庁

この亜硫酸金ナトリウム溶液は金電気メッキ浴で使用するのに有用であり、純粋で軟質な金メッキ膜を必要とする用途で使用できる。例文帳に追加

The gold sodium sulfite solution is useful for being used for gold electroplating and is used for applications necessary for a pure and soft gold plated film. - 特許庁

現像性に優れ、硬化物は可撓性、半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、ソルダーレジスト用及び層間絶縁層用に特に適する樹脂を提供する。例文帳に追加

To provide a resin having excellent developability, giving a cured material having excellent flexibility, soldering heat-resistance, thermal deterioration resistance and electroless gold plating resistance and especially useful for a solder resist and an interlayer insulation film. - 特許庁

現像性に優れ、硬化物の可撓性、半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、ソルダーレジスト用及び層間絶縁層用に特に適する樹脂を提供する。例文帳に追加

To provide a resin excellent in development property, flexibility of cured products, heat resistance to soldering, resistance to thermal degradation and resistance to electroless gold plating and especially suitable for solder resists and for interlayer insulation films. - 特許庁

硬化物の可撓性や半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、有機溶剤又は希アルカリ溶液で現像ができ、ソルダーレジスト用及び層間絶縁層用に適する樹脂組成物を提供する。例文帳に追加

To provide a resin composition giving a cured body excellent in flexibility and resistance to the heat of soldering, thermal deterioration and electroless gold plating, developable with an organic solvent and a dilute alkali solution and suitable for a soldering resist and an interlayer dielectric. - 特許庁

硬化物の可撓性や半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、有機溶剤又は希アルカリ溶液で現像ができ、ソルダーレジスト用及び層間絶縁層用に適する樹脂組成物を開発する。例文帳に追加

To provide a resin composition which gives a cured product excellent in flexibility, soldering heat resistance, heat deterioration resistance, electroless gold plating resistance and is developable by an organic solvent or a dilute alkali solution and suitable for a solder resist and an interlaminar insulating layer. - 特許庁

硬化物の可撓性や半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、有機溶剤又は希アルカリ溶液で現像ができ、ソルダ−レジスト用及び層間絶縁層用に適する樹脂組成物を提供する。例文帳に追加

To provide a resin composition which gives cured items excellent in flexibility and resistances to soldering heat, heat degradation, and electroless gold plating, can be developed with an organic solvent or a dilute alkali solution, and is suitable for solder resists and interlayer insulation layers. - 特許庁

本発明の要旨は、アルカリマンガン電池正極缶用のメッキ鋼板であって、缶内面になる面の表層に０．１〜１μｍのＦｅ−Ｎｉ合金メッキ層を有することを特徴とするものである。例文帳に追加

In the plated steel sheet for the positive electrode can of the alkali manganese battery, the surface layer of the side to be used as the inside face of the can is provided with an Fe-Ni alloy plated layer of 0.1 to 1 μm. - 特許庁

硬化物の可撓性やはんだ耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、有機溶剤や希アルカリ溶液で現像ができ、ソルダーレジスト用及び層間絶縁層用に特に適する樹脂組成物を提供する。例文帳に追加

To provide a resin composition which is excellent in flexibility and resistance to the heat of soldering, thermal deterioration and electroless gold plating of a cured material, developable with an organic solvent and a dilute alkali solution and especially suitable for a soldering resist and an interlayer dielectric. - 特許庁

表面に、錫７０〜９９質量％、残部亜鉛および不可避的不純物からなり、片面あたりの厚みが４〜５０μｍの錫−亜鉛合金メッキ層２を有する鋼板を、連続に成形して鋼帯とする。例文帳に追加

A steel plate having a tin-zinc alloy coating layer 2 which comprises 70-99 mass% tin with the balance zinc and inevitable impurities and has a thickness per one side of 4-50 μm, formed on its surface is continuously formed into a steel strip. - 特許庁

硬化物の可撓性や半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ希アルカリ溶液で現像ができ、ソルダーレジスト用及び層間絶縁層用に適する樹脂組成物を提供する。例文帳に追加

To provide a resin composition which gives a cured item excellent in flexibility and resistances to soldering heat, heat degradation, and electroless gold plating, can be developed with a dilute alkali solution, and is suitable for a solder resist and an interlayer insulation layer. - 特許庁

毒性がなくかつ公害発生の心配も皆無な表面強化被覆層として鉄−リン合金メッキ層を具備するとともに耐刷力に優れた新規なグラビア製版ロール及びその製造方法を提供する。例文帳に追加

To provide a new gravure platemaking roll having an iron-phosphor alloy plated layer as a surface reinforcing coating layer with neither toxicity nor risk of causing environmental pollution, and having excellent plate wear, and a method of manufacturing the gravure platemaking roll. - 特許庁

硬化物の可撓性やハンダ耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、有機溶剤又は希アルカリ溶液で現像ができ、ソルダーレジスト用及び層間絶縁性用に適する樹脂組成物を提供する。例文帳に追加

To obtain a resin composition capable of giving cured products with high flexibility, soldering heat resistance, heat deterioration resistance and electroless gold plating resistance, developable with an organic solvent or a dilute alkaline solution, and suitable for solder resists and interlaminar electrical insulation. - 特許庁

Ｘ線よりも取り扱いが簡単で装置が安価な装置を利用して、鉄亜鉛合金メッキ鋼板表層のＦｅ量を測定する方法を提供する。例文帳に追加

To realize the method for measuring an Fe quantity in a steel plate surface layer plated with iron-zinc alloy by using an inexpensive device handled easily as compared with an X-ray. - 特許庁

特定の合金メッキ層をスチール基材表面に形成することによって、表面の仕上りを均一化した美麗な、防錆性の高い屋根用部材を提供する。例文帳に追加

To provide a beautiful, highly rust preventive roofing member in which surface finish is uniformized by forming a specific alloy plating layer on the surface of a base material made of steel. - 特許庁

簡便な構成で、レーザ反射率が高い金メッキや銅などの様々な接合材料をも、高速かつ高品質・高安定に接合することを目的とする。例文帳に追加

To join even various joining materials such as gold plating and copper having high laser reflectivity in high speed, high quality, and high stability with a simple structure. - 特許庁

硬化物の可撓性や半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、有機溶剤又は希アルカリ溶液で現像ができ、ソルダーレジスト用及び層間絶縁層用に適する樹脂組成物を提供する。例文帳に追加

To obtain a resin composition giving a hardened material excellent in flexibility, thermal resistance for soldering, resistance to thermal deterioration, and durability in electroless metal plating, capable of being developed with an organic solvent or a dilute alkaline solution, suitable for a solder resist and a layer insulation. - 特許庁

硬化物の可撓性や半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ希アルカリ溶液で現像ができ、ソルダーレジスト用及び層間絶縁層用に適する樹脂組成物を提供する。例文帳に追加

To obtain a resin composition which give a cured material excellent in flexibility, resistance to soldering heat, heat deterioration resistance, and resistance to electroless gilding, allows development with a dilute alkali solution, and is suitable for a soldering resist and an interlaminar insulating layer. - 特許庁

硬化物の可撓性や半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、有機溶剤又は希アルカリ溶液で現像ができ、ソルダーレジスト用、層間絶縁層用に適する樹脂組成物を提供する。例文帳に追加

To obtain a resin composition which gives a cured item excellent in flexibility and resistances to soldering heat, heat degradation, and nonelectrolytic gold plating, can be developed with an organic solvent or a dilute alkali solution, and is suitable for a solder resist and an interlayer insulation layer. - 特許庁

光感度に優れ、屈曲性、密着性、鉛筆硬度、耐溶剤性、耐酸性、耐熱性、耐金メッキ性等に優れた感光性樹脂組成物及びそれを含有する硬化物を提供する。例文帳に追加

To provide a photosensitive resin composition having excellent photosensitivity, and further having excellent flexibility, adhesion, pencil hardness, solvent resistance, acid resistance, heat resistance, resistance to gold plating or the like; and to provide a cured product comprising the resin composition. - 特許庁

硬化物の可撓性や半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、有機溶剤又は希アルカリ溶液で現像ができ、ソルダーレジスト用及び層間絶縁層用に適する樹脂組成物を提供する。例文帳に追加

To provide a resin composition excellent in flexibility, and restances to solder heat resistance, thermal deterioration, and non-electrolytic gold plating, and capable of developing with an organic solvent or a dilute alkaline solution and suitable for a solder resist and an insulating layer between layers. - 特許庁

ＦＺＰ１００の中央部分１０２および周辺部分１０３には、直接光の影響を避け集光された光のみが試料１０６を照射するようにするために金メッキによるＸ線不透過処理が施されている。例文帳に追加

X-ray non-transmission processing by gold plating is executed in the central portion 102 and a peripheral portion of the FZP 100 to irradiate a sample 106 with only light condensed while avoiding an influence of direct light. - 特許庁

硬化物の可撓性や半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、有機溶剤又は希アルカリ溶液で現像ができ、ソルダーレジスト用及び層間絶縁層用に適する樹脂組成物を提供する。例文帳に追加

To obtain a resin composition excellent in the flexibility of its cured body and in the resistance of the body to the heat of soldering, thermal deterioration and electroless gold plating, developable with an organic solvent or a dilute alkali solution and suitable for a soldering resist and for an interlayer dielectric. - 特許庁

また、上記の（Ａ）成分と（Ｂ）成分と（Ｃ）成分とを含有する被覆層を少なくとも片面に皮膜付着量として０．２〜５．０ｇ／ｍ^2有するクロムを含有しない表面処理アルミニウム・亜鉛系合金メッキ鋼板である。例文帳に追加

The chromium-free surface treated aluminum-zinc based alloy plated steel sheet is obtained by providing a covering layer containing the above (A) components, (B) components and (C) components at least on one side by 0.2 to 5.0 g/m^2 as a film coating weight. - 特許庁

硬化物の可撓性や半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、有機溶剤又は希アルカリ溶液で現像ができ、ソルダーレジスト用及び層間絶縁層用に適する樹脂組成物を提供する。例文帳に追加

To provide a resin composition which gives a cured produce excellent in flexibilyty, soldering heat resistance, heat deterioration resistance and electroless gold plating resistance and is developable with an organic solvent or a dilute alkaline solution and suitable for a solder resist and an interlayer insulating layer. - 特許庁

端子部２と接点部３とを設けて形成され、表面に金メッキを施した半田付け端子１、及び半田付け端子１の端子部２を半田付けする前の前処理方法に関する。例文帳に追加

This is related to a pretreatment method before soldering the soldering terminal 1 formed by installing the terminal part 2 and the contact part 3 and by applying the gilding on the surface and before soldering the terminal part 2 of the soldering terminal 1. - 特許庁

各絞り羽根１の表面には、少なくともNiとＰを含有する合金メッキが施されているので、絞り羽根１の摺動時の磨耗により剥がれ落ちて、光学系を汚染することがない。例文帳に追加

Alloy plating containing at least Ni and P is applied on the surface of each aperture blade 1, thereby the lubricant does not come off by the abrasion arising when the aperture blade 1 slides and the optical system is not soiled by the lubricant. - 特許庁

硬化物の可撓性や半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、有機溶剤又は希アルカリ溶液で現像ができ、ソルダーレジスト用及び層間絶縁層用に適する樹脂組成物を提供する。例文帳に追加

To provide a resin composition which can furnish a cured product with excellent flexibility, soldering heat resistance, heat deterioration resistance and electroless gold deposition resistance, can be developed by an organic solvent or a dilute alkaline solution, and is suitable for a solder resist and an interlayer dielectric layer. - 特許庁

ＴＡＢ用テ−プのー搬部銅箔リ−ドに薄金メッキを施しながら、ＩＣバンプとの金属接合の必要なリ−ドパタ−ン部は、メッキ厚を厚くする事によりボンデングの信頼性を確保する。例文帳に追加

A thin gold plating is applied to the general copper foil lead parts of a TAB tape, while lead patterned parts which are required a metal bonding to IC bumps are reduced in their plating thickness, whereby the reliability of a bonding of the tape is ensured. - 特許庁

硬化物の可撓性や半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、有機溶剤又は希アルカリ溶液で現像ができ、ソルダーレジスト用及び層間絶縁層用に適する樹脂組成物を提供する。例文帳に追加

To provide a resin composition which can provide a cured product excellent in flexibility, soldering-heat resistance, heat deterioration resistance, electroless gold plating resistance, and is developable by an organic solvent or a dilute alkali solution and suitable for a solder resist and an interlayer insulating layer. - 特許庁

感光性に優れ、硬化物の可撓性や半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、希アルカリ溶液で現像ができ、ソルダーレジスト用及び層間絶縁層用に適する樹脂組成物を提供する。例文帳に追加

To obtain a resin composition which excels in photosensitivity, excels in the flexibility and soldering heat resistance, resistance to heat deterioration, and electroless gold plating resistance of cured products, can be developed with a dilute alkali solution, and is suited in use for solider resists and interlaminar insulating layers. - 特許庁

硬化物の可撓性や半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、希アルカリ溶液で現像ができ、ソルダーレジスト用及び層間絶縁層用に適する樹脂組成物を提供する。例文帳に追加

To provide a resin composition excellent in flexibility, and resistances to solder heat, thermal deterioration, and non-electrolytic gold plating, and capable of developing with a dilute alkaline solution and suitable for a solder resist and an insulating layer between layers. - 特許庁

硬化物の可撓性や半田耐熱性、耐熱劣化性、無電解スズ、金メッキ耐性に優れ希アルカリ溶液で現像ができ、ソルダーレジスト用及び層間絶縁層用に適する樹脂組成物を提供する。例文帳に追加

To obtain a resin composition which gives a cured material excellent in flexibility, resistance to soldering heat, heat aging resistance and resistances to electroless tinning and gilding, can realize the development with a dilute alkaline solution, and is suitable for a soldering resist and an interlaminar insulating layer. - 特許庁

硬化物の可撓性や半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、有機溶剤又は希アルカリ溶液で現像ができ、ソルダーレジスト用及び層間絶縁層用に適する樹脂組成物を提供する。例文帳に追加

To provide a resin composition which excels in the flexibility, solder heat resistance, resistance to heat deterioration, and resistance to electroless gold plating of a cured article, can be developed with an organic solvent or a dilute alkali solution, and is suited for a solder resist and an interlaminar insulating layer. - 特許庁

感光性に優れ、硬化物の可撓性や半田耐熱性、耐熱劣化性、無電解金メッキ耐性に優れ、希アルカリ溶液で現像ができ、ソルダーレジスト用及び層間絶縁層用に適する樹脂組成物を提供する。例文帳に追加

To obtain a resin composition which is excellent in photosensitivity, gives a cured material excellent in flexibility, resistance to soldering heat, heat aging resistance, resistance to electroless gilding, can realize the development with a dilute alkaline solution, and is suitable for a soldering resist and an interlaminar insulating layer. - 特許庁

が、外型と中型がずれないようにするための工夫、鋳造後の表面の仕上げ、螺髪の取り付け、鍍金（金メッキ）など、他にも多くの工程があたものと思われる。例文帳に追加

It is supposed that there were many other processes such as some techniques to prevent gaps between the outside and inside molds, finishing surface after casting, installing of tightly-curled hair knots and the plating with gold.  - Wikipedia日英京都関連文書対訳コーパス

アノード電極１５には多孔質の白金ペースト電極が用いられ、カソード電極１６には水素及び水素同位体のガスを透過する白金メッキ電極が用いられる。例文帳に追加

A porous platinum paste electrode is used for the anode 15 and a platinum-plated electrode of permeating the gases of hydrogen and the hydrogen isotope is used for the cathode 16. - 特許庁

ニッケル・タングステン系合金メッキ用の陽極として使用する電極であって、ニッケルを重量比で５０〜８０％含有し、残部が実質的にタングステンであるニッケル・タングステン合金電極。例文帳に追加

This nickel-tungsten alloy electrode is an electrode to be used as the anode for nickel-tungsten-base alloy plating and contains nickel at 50 to 80% by weight and consists of the balance substantially tungsten. - 特許庁

あるいは、金メッキをしていないベリリウム銅のコンタクトピン母材の表面に、ニッケルまたはチタンのスパッタをし、次にタングステン、クロムまたはチタンのスパッタをして薄膜で被覆する。例文帳に追加

Alternatively, nickel or titanium is spattered on the surface of a contact pin base material of beryllium copper not plated with gold, and then the thin film is covered by sputtering tungsten, chromium or titanium. - 特許庁

バンプ電極２０は、電気的接続領域１５上に形成された無電解金属メッキ層１３と、無電解金属メッキ層１３を被覆する無電解金メッキ層１４とを含む。例文帳に追加

The bump electrode 20 comprises an electroless metal plated layer 13 formed on the electric connection region 15, and electroless gold plated layer 14 covering the electroless metal plated layer 13. - 特許庁

これにより、金メッキ層及びニッケルメッキ層によって被覆された配線に対してはんだ付けが行われた場合に、はんだとニッケルメッキ層との密着力を向上することができる。例文帳に追加

Thus, when soldering is performed to the wiring which is covered with the gold plating layer and nickel plating layer, the tight fitting between the solder and nickel plating layer is improved. - 特許庁

単結晶シリコン材から異方性エッチングによって曲がり板ばね形状の部材を形成し、その表面に金メッキをしてシリコン製ばね電極１を製造する。例文帳に追加

A member of a curved leaf spring shape is formed from a single crystal silicon material by anisotropic etching, and the silicon spring electrode 1 is manufactured by gilding its surface. - 特許庁