「component reliability」に関連した英語例文の一覧と使い方(8ページ目) - Weblio英語例文検索

Thus, such an electronic component has an effect of ensuring mounting reliability of the electronic component becoming increasingly miniaturized, practically usefully for electronic components mainly used for communication apparatuses.例文帳に追加

このことにより、本発明にかかる電子部品は、小型化が進む電子部品の実装信頼性を確保できるという効果を有し、主として通信機器に用いられる電子部品において有用である。 - 特許庁

To provide a substrate for a gas sensor used for measurement of a component concentration of gas including a specific component, having a small size, excellent responsiveness and high reliability, and drivable with a low power consumption.例文帳に追加

特定の成分を含有するガスの成分濃度の測定に用いられ、小型で優れた応答性と高信頼性を有するとともに低消費電力で駆動できるガスセンサ用基板を提供すること。 - 特許庁

To provide a method and an apparatus for mounting an electronic component which can extend the life of the electronic component by reducing strain in solder and then improving the reliability of a joining part of the solder.例文帳に追加

はんだに発生する歪みを低減させることで、はんだの接合部分の信頼性を向上させ、電子部品の長寿命化を実現できる電子部品実装方法及び装置を提供すること。 - 特許庁

To provide a switching element module for an inverter device which improves the reliability of a soldered portion of an electronic component and operates stably in high-frequency switching to eliminate generated heat from the electronic component.例文帳に追加

電子部品の半田付け部の信頼性を上げることでき、高周波スイッチングに対して安定に動作し、電子部品の発熱を有効に除去することができるインバータ装置用のスイッチング素子モジュール。 - 特許庁

To improve reliability and quality of mounting by removing foreign matter, such as a chip component having fallen by mistake and dust, when a component is picked up by a nozzle of a movable head and mounted on a substrate.例文帳に追加

移動自在なヘッドのノズルで部品をピックアップして、基板上に搭載する際に、間違って落ちたチップ部品やゴミ等の異物を排除して、搭載の信頼性や品質の向上を図る。 - 特許庁

To mount an electronic component on a printed wiring board in higher reliability by effectively controlling displacement due to thermal damage of electronic component and heat of printed wiring board and also oxidation of land of the printed wiring board.例文帳に追加

電子部品の熱損傷やプリント基板の熱による変位、プリント基板のランド部の酸化等を有効に抑制して、高い信頼性をもって電子部品をプリント基板に実装できるようにする。 - 特許庁

To improve an apparatus for fitting an additional component to the back of signatures of a book so as to enable the unerring placement of the additional component with a high reliability by a simple structure and realize a high processing speed.例文帳に追加

付加部材を本の中身の背に取り付ける装置を、簡単な構造で、高い信頼性で、間違いなく付加部材を載せるのを保証し、高い処理速度を可能にするように改良する。 - 特許庁

To provide a mounted component which is composed of a printed board and components that are mounted on the board and improved in reliability, by protecting the main electronic components out of the components against a shock from the outside, and to provide an electronic apparatus mounted with the mounted component inside.例文帳に追加

本発明は、実装部品の中で主要となる電子部品を外部からの衝撃から保護し、信頼性の向上を図った実装部品およびそれを内蔵した電子機器を提供する。 - 特許庁

To provide a wiring board exhibiting high reliability at the joint of conductive members and a bonding method thereof, a mounting and bonding method of a mounting component, an electronic component, a circuit board and an electronic apparatus.例文帳に追加

導電部材同士の接合部の信頼性が高い配線基板及びその接合方法、実装部品の実装及び接合方法、電子部品、回路基板並びに電子機器を提供することにある。 - 特許庁

To provide a wiring board where a mounting place for electronic component is compact especially in thickness direction and the electric connec tion to the electronic component is ensured as well as an improved reliability.例文帳に追加

電子部品の装着箇所を、特に厚さ方向にコンパクト化し、かつ電子部品の電気的接続を確実に確保するとともに、信頼性の向上をも図った配線基板を提供すること。 - 特許庁

To provide an electronic component 107 which has a hybrid laminated structure including a ceramic substrate 101 and has an excellent anti-shock property and a high electric connection reliability of secondary mounting, and also to provide an electronic component-mounted device.例文帳に追加

セラミック基板１０１を含む異種積層構成において、耐衝撃性に優れ、二次実装の電気接続信頼性の高い電子部品１０７および電子部品搭載装置を製造する。 - 特許庁

To provide the electronic apparatus which enhances the reliability of an electronic component by allowing a conductive member connected with the terminal of the electronic component, to abut on a heat dissipation plate, thereby enhancing the heat dissipation properties.例文帳に追加

電子部品の端子に接続する導電部材を放熱プレートに当接させることで放熱性を向上させ、電子部品の信頼性を向上させることができる電子機器を提供すること。 - 特許庁

To provide a circuit board which can restrain a short circuit between electronic component installation electrodes and between wiring patterns when the electronic components are mounted, and an electronic component mounted body of high reliability which uses the circuit board.例文帳に追加

電子部品を実装する際に、電子部品設置用電極間や、配線パターン間の短絡を抑制可能な回路基板、およびそれを用いた信頼性の高い電子部品実装体を提供する。 - 特許庁

To deposit an alloy thin film whose alloy film composition is uniform and film thickness precision is high by a vacuum deposition method, in an electronic component comprising an alloy thin film, and to provide an electronic component having high reliability.例文帳に追加

合金薄膜を有する電子部品等において、真空蒸着法により、合金膜組成が均一で、かつ膜厚精度の高い合金薄膜を形成し、信頼性の高い電子部品を提供する。 - 特許庁

To provide a package for electronic component which eliminates the adverse influence of a flash on the characteristics of the electric component, even if it has higher reliability by airtightly sealing a metal base and a metal cap by resistance welding.例文帳に追加

金属ベースと金属キャップを抵抗溶接により気密封止し、スプラッシュが発生しても電子部品の特性に悪影響をおよぼさない、より信頼性の高い電子部品のパッケージを提供する。 - 特許庁

To provide a mounted structural body for raising reliability in connection between a wiring board and an electronic component by reliably filling a resin up to the outer circumference of the electronic component, and to provide a method of manufacturing the mounted structural body.例文帳に追加

電子部品の外周まで樹脂を確実に充填し、配線基板と電子部品との接続信頼性を向上できる実装構造体とその製造方法を提供することを目的とする。 - 特許庁

To facilitate positioning between an electronic component and a lead terminal, to more improve electric reliability between the electronic component and the lead terminal as compared with a conventional product, and to improve the yield of an electronic device.例文帳に追加

電子部品とリード端子との位置合わせを容易にし、電子部品とリード端子との電気的な信頼性を従来のものよりも高めるとともに、電子装置の歩留まりを向上させること。 - 特許庁

To provide a package substrate capable of making a mounting area smaller, capable of being made thinner, moreover, being less apt to be impaired of reliability for electrical connection to a combined electronic component, and having superior reliability as a whole.例文帳に追加

実装面積を小さくでき、薄型化を図ることができ、しかも組み合わされている電子部品との電気的接続の信頼性が損なわれ難く、かつ全体としての信頼性が優れたパッケージ基板を提供する。 - 特許庁

To provide a method for manufacturing an electronic component and communications device capable of improving yield and productivity and providing reliability for a long time.例文帳に追加

歩留まりを改善でき生産性向上につながり、長期的信頼性も得られる電子部品の製造方法、通信装置を提供する。 - 特許庁

To improve mounting reliability of a surface mounting component package, equipped with a substrate member including an external electrode and made of glass, to a circuit board.例文帳に追加

外部電極を有するガラスよりなる基板部材をもつ表面実装部品パッケージの回路基板への実装信頼性を向上させる。 - 特許庁

To execute efficient heat radiation to an electronic component of a photoelectric wiring module mounted on a mounting board, and to improve reliability.例文帳に追加

実装基板上に搭載した光電配線モジュールの電子部品に対して効率良い放熱を行うことができ、信頼性の向上をはかる。 - 特許庁

To attain high reliability and cost reduction by reducing component cost and power consumption and performing light output level control of a highly accurate transponder portion.例文帳に追加

部品コスト及び消費電力の低減や、高精度なトランスポンダ部の光出力レベル制御を行い、高信頼かつ低コスト化を実現する。 - 特許庁

To provide a prepreg for a printed wiring board having high connection reliability to a mounting component because of a low coefficient of thermal expansion and being excellent in heat resistance.例文帳に追加

低い熱膨張率により実装部品との高い接続信頼性を有し、耐熱性に優れたプリント配線板用プリプレグを提供する。 - 特許庁

To provide a light-emitting component which has satisfactory heat radiation property and ensures high reliability by using an LED of high luminance and high output as a light source.例文帳に追加

放熱性が良好であり、高輝度及び高出力のＬＥＤを光源とする、信頼性の高い発光部品を提供すること。 - 特許庁

To provide a mounting structure and mounting method for an electronic component fitted with bumps which can raise the reliability after mounting.例文帳に追加

実装後の信頼性を向上させることができるバンプ付電子部品の実装構造および実装方法を提供することを目的とする。 - 特許庁

To contribute to high-reliability mounting by effectively reducing curvature of a substrate caused when an electronic component such as a semiconductor device is mounted and so on.例文帳に追加

半導体素子等の電子部品の実装時などに発生し得る基板の反りを有効に低減し、高信頼度の実装に寄与すること。 - 特許庁

To provide a resin multilayered module and a method of manufacturing the resin multilayered module which can secure connection reliability of a chip-type electronic component.例文帳に追加

チップ型の電子部品の接続信頼性を確保することができる樹脂多層モジュール及び樹脂多層モジュールの製造方法を提供する。 - 特許庁

To enhance reliability by preventing occurrence of poor suction or mounting of a component resulting from malfunction caused by noise produced when a head is elevating or lowering.例文帳に追加

ヘッド昇降時におけるノイズによる誤動作等に起因した部品吸着・装着不良の発生を未然に防止して信頼性を高める。 - 特許庁

To provide an effective method of manufacturing a substrate and an electronic component which is excellent in electrical reliability without executing an electroless plating process or the like.例文帳に追加

無電解めっき等の工程を行うことなく、電気的信頼性が高く、効率的な基板及び電子部品の製造方法を提供する。 - 特許庁

To prevent an electric wire of a sensor component such as a thermistor from interfering with a sheet metal or the like on an outer side of a battery at low cost, with superior workability, and with reliability.例文帳に追加

サーミスタ等のセンサ部品の電線がバッテリ外側の板金等に干渉することを低コストで作業性良く確実に防止する。 - 特許庁

To provide a compact electronic component storage package capable of joining firmly a lid body, and an electronic device of excellent reliability.例文帳に追加

蓋体を強固に接合することができる小型の電子部品収納用パッケージおよび信頼性に優れた電子装置を提供すること。 - 特許庁

To provide a component mounting substrate that is improved in solder mounting and reliability as a substrate, and a method of manufacturing the same.例文帳に追加

はんだ実装および基板としての信頼性向上を実現することが可能な部品実装基板およびその製造方法を提供すること。 - 特許庁

To provide a package for housing electronic component elements having a high airtight reliability in low price, capable of corresponding to reduction in weight and size of cell phones and such.例文帳に追加

携帯電話等の軽薄短小化に対応でき、気密信頼性の高い安価な電子部品素子収納用パッケージを提供する。 - 特許庁

To provide an electronic component and its manufacturing method with a method and a structure more simplified than the conventional art and higher reliability.例文帳に追加

従来技術より簡単な方法かつ簡単な構造を有し、高い信頼性の電子部品及びその製造方法を提供すること。 - 特許庁

To provide a laminated electronic component capable of exhibiting high insulation and enhanced reliability, even if a dielectric layer is made thin, and to provide its producing process.例文帳に追加

誘電体層を薄層化しても高い絶縁性を有し信頼性を向上できる積層型電子部品およびその製法を提供する。 - 特許庁

To improve the reliability of a mechanical component formed by fixing two parts, at least one of which is formed of a resin, with an anaerobic adhesive.例文帳に追加

少なくとも一方が樹脂材料で形成された二部品を嫌気性接着剤で固定してなる機械部品の信頼性向上を図る。 - 特許庁

To manufacture a component built-in substrate which is compact and high in reliability by forming an interlayer connection conductor having a small aperture and high straightness.例文帳に追加

口径が小さくストレート性が高い層間接続導体を形状し、小型化で信頼性の高い部品内蔵基板部品を製造する。 - 特許庁

To provide an irreversible circuit component that is structured to provide ease of assembling and handling, has high reliability and is inexpensive and to provide a communication unit.例文帳に追加

組み立てや取り扱いの容易な構造を有するとともに、低コストで信頼性の高い非可逆回路素子及び通信装置を提供する。 - 特許庁

To provide an improved wiring substrate, and its manufacturing method, wherein the occurrence of stress between an electronic component and a substrate is suppressed while connection reliability is maintained.例文帳に追加

電子部品と基板との応力発生を抑制し、接続信頼性を維持・向上した配線基板及び製造方法を提供する。 - 特許庁

To provide an electronic component device, with which sufficient bonding reliability can be provided even when flip chip mounting of a surface acoustic wave(SAW) device on a substrate is performed.例文帳に追加

本発明は、ＳＡＷデバイスを基体にフリップチップ実装しても十分な接合信頼性が得られる電子部品装置を提供する。 - 特許庁

To provide a component built-in substrate which does not necessitate troublesome work upon manufacturing without spoiling the reliability of connection.例文帳に追加

本発明は、接続信頼性を損なうことなく、製造時に煩雑な作業を不要とする、部品内蔵基板を提供することを目的とする。 - 特許庁

According to the arrangement, bonding strength is enhanced between an acoustic matching member and other component member and the reliability can be enhanced in a humid atmosphere.例文帳に追加

これにより、音響整合部材と他の構成部部材の接着強度の向上と、多湿雰囲気での信頼性向上が実現できる。 - 特許庁

To provide a lamp bulb form fluorescent lamp capable of preventing the emission efficiency and reliability of an electronic component of a lighting circuit from being deteriorated even if it is miniaturized.例文帳に追加

小型化しても発光効率や点灯回路の電子部品の信頼性の低下を防止できる電球形蛍光ランプを提供する。 - 特許庁

To manufacture a thin-film multi-layered type laminated ceramic electronic component which has high reliability by deterring structural defects such as inter-layer peeling and a short circuit.例文帳に追加

層間剥離や短絡等の構造欠陥の発生を抑制し、高信頼性を有する、薄膜多層の積層セラミック電子部品を製造する。 - 特許庁

To provide a numerously dividable wiring board which can be tested after electronic component mounting and before division thereof and has excellent mounting reliability.例文帳に追加

電子部品実装後に分割前に一括で電気的テストができ、また実装信頼性に優れた多数個取り配線基板を提供すること。 - 特許庁