「substrate solution」に関連した英語例文の一覧と使い方(3ページ目) - Weblio英語例文検索

The microorganisms adhered to the substrate 31 by dipping the substrate 31 into a solution of the microorganism and reducing the inside of the cavities in the substrate are brought to be the microorganisms immobilized on the substrate.例文帳に追加

また、該担体を微生物溶液に浸けて、該担体内部の空洞内部を減圧にすることで微生物を該担体に付着させた担体固定化微生物。 - 特許庁

The amount of dissolved oxygen in the fluorine compound-containing resist stripping solution is ≤3 ppm, accordingly the stripping solution can strip a resist from a substrate bearing copper without corroding the copper.例文帳に追加

溶存酸素量が３ｐｐｍ以下である、銅配線基板向けフッ素化合物含有レジスト剥離液。 - 特許庁

A developing solution supplied from a developing solution discharging nozzle is piled up on a substrate held in a standstill state (S101).例文帳に追加

静止保持された基板に現像液吐出ノズルから供給される現像液を液盛りする（Ｓ１０１）。 - 特許庁

A substrate is washed in a processing solution with an ultrasonic wave while the temperature of the processing solution is ≤18°C.例文帳に追加

処理溶液の温度が１８℃以下である状態で、処理溶液内で基板の超音波洗浄が行われる。 - 特許庁

To provide an application apparatus and an application method by which a coating solution is applied onto a substrate while preventing oxidation of the coating solution.例文帳に追加

塗布液の酸化を防止しながら基板に塗布を行う塗布装置および塗布方法を提供する。 - 特許庁

Subsequently, the substrate P is immersed in the etching solution E, and a wet etching treatment is applied to the substrate P.例文帳に追加

続いて、基板Ｐ等をエッチング溶液Ｅに浸し、基板Ｐ等に対してウェットエッチング処理を施す。 - 特許庁

The electrolytic solution 17 is sealed between the upper substrate 11 and the lower substrate 12 by a sealing material 18.例文帳に追加

電解液１７は、シール材１８により上側基板１１と下側基板１２間に封止されている。 - 特許庁

ELECTRON SOURCE SUBSTRATE MANUFACTURING DEVICE, METAL PARTICULATE MATERIAL CONTAINED SOLUTION, ELECTRON SOURCE SUBSTRATE, AND PICTURE DISPLAY DEVICE例文帳に追加

電子源基板製造装置，金属微粒子材料含有溶液，電子源基板，及び画像表示装置 - 特許庁

PREPROCESSING SOLUTION FOR POLISHING WIRING SUBSTRATE, POLISHING METHOD, PROCESS AND APPARATUS FOR MANUFACTURING WIRING SUBSTRATE例文帳に追加

配線基板研磨用前処理液、研磨方法、配線基板製造方法及び配線基板製造装置 - 特許庁

A wiping off member 552 wipes off the coating solution applied on the substrate P by abutting on the substrate P.例文帳に追加

拭取部材５５２は、基板Ｐと当接することによって、その基板Ｐに塗布された塗布液を拭き取る。 - 特許庁

Since the solution-repelling part 2a is higher in solution repellency to the coating solution than other parts of the surface of the substrate 20a, excess of the coating solution accumulated inside the solution-repelling part 2a is allowed to escape outside in response to centrifugal force.例文帳に追加

撥液部２ａは、基板２０ａの一方の面における他の部分に比べて塗布液に対する撥液性が高いため、遠心力に応じて撥液部２ａの内側に溜まる余分な塗布液を外側に逃がす。 - 特許庁

In this case, when the developing solution spreading over both the peripheral edge of the substrate and the feed nozzle runs out, the developing solution is less returned, and a flow of developing solution is restrained from being formed, and the developing solution ripples less.例文帳に追加

この場合、基板の周縁部と供給ノズルとに跨る現像液が液切れしたときの液の寄り戻しが低減され、基板表面の現像液の流れ、波立ちが抑えられる。 - 特許庁

To provide a substrate processor preventing or suppressing: dropping of a processing solution from a discharge port of a processing solution nozzle; and crystallization of the processing solution in the processing solution nozzle.例文帳に追加

処理液ノズルの吐出口からの処理液のぼた落ち、および処理液ノズルにおける処理液の結晶化を防止または抑制することができる基板処理装置を提供する。 - 特許庁

The resultant substrate is immersed in phosphoric acid solution to remove the silicon nitride film 3 on the front surface.例文帳に追加

りん酸溶液に浸漬して表面のシリコン窒化膜３を除去する。 - 特許庁

Sulfuric acid and a hydrogen peroxide solution are allowed to act on the surface of a glass substrate.例文帳に追加

ガラス基板の表面に硫酸及び過酸化水素水を作用させる。 - 特許庁

TRANSPARENT-FILM-FORMED SUBSTRATE, COATING SOLUTION FOR FORMATION OF TRANSPARENT FILM, AND DISPLAY DEVICE例文帳に追加

透明被膜付基材、透明被膜形成用塗布液、および表示装置 - 特許庁

REMOVAL METHOD OF CONTAMINANT OF INTEGRATED CIRCUIT SUBSTRATE USING CLEANING SOLUTION例文帳に追加

洗浄溶液を用いた集積回路基板の汚染物質の除去方法 - 特許庁

POLISHING SOLUTION AND SUBSTRATE FOR SEMICONDUCTOR INTEGRATED CIRCUIT POLISHED BY USING SAME例文帳に追加

研磨液及びそれを用いて研磨された半導体集積回路用基板 - 特許庁

To conduct this method, the substrate is dipped in citric acid or a hydrogen peroxide solution.例文帳に追加

これを行うには、クエン酸・過酸化水素溶液に基板を浸漬させる。 - 特許庁

To simultaneously bring a chemoluminescent substrate solution into contact with any spot.例文帳に追加

化学発光基質溶液がどのスポットにも同時に接触できるようにする。 - 特許庁

To perform uniform development by supplying a developing solution over the entire surface of the substrate.例文帳に追加

基板全面に現像液を液盛りして現像処理を均一に行う。 - 特許庁

A developing solution supply nozzle 21 supplies a developing solution to a main surface of a substrate W while traveling from one end to the other end of the substrate W.例文帳に追加

現像液供給ノズル２１が基板Ｗの主面一端側から他端側にかけて移動しつつ、該基板Ｗに現像液を供給する。 - 特許庁

A developing solution feed nozzle 20 is moved from one end of a substrate W to the other to feed a developing solution onto the entire main surface of the substrate W.例文帳に追加

現像液供給ノズル２０が基板Ｗの一端側から他端側に移動して、基板Ｗの主面全体に現像液を供給する。 - 特許庁

To provide a spin coating apparatus capable of preventing a coating solution from turning around to the rear face of a rectangular substrate at the time of applying the coating solution to the rectangular substrate.例文帳に追加

矩形基板に塗布液を塗布する際に、矩形基板の裏面への塗布液の回り込みを防止することのできる回転塗布装置を提供すること。 - 特許庁

A solution film made of a resist solution is formed on a substrate W by scan coating and depressurized and dried until the solution film is turned into a semi-solid condition in a dry chamber 6.例文帳に追加

基板Ｗ上にスキャン塗布にてレジスト液の液膜を形成し、乾燥チャンバ６内にて液膜が半固形状態に達するまで減圧乾燥させる。 - 特許庁

After the pre-treatment solution is deposited in the aperture, the substrate is immersed in a plating solution, and at least a part of the pre- treatment solution is left in the aperture at the same time.例文帳に追加

前処理溶液をアパーチャに堆積させた後、基板はめっき溶液中に浸漬され、同時に前処理溶液の少なくとも一部はアパーチャ内に残る。 - 特許庁

The plating apparatus 20 includes a substrate rotating/holding mechanism 110 for holding rotation of a substrate 2, and a plating solution supply mechanism 30 for supplying the plating solution 35 to the substrate 2.例文帳に追加

めっき処理装置２０は、基板２を回転保持する基板回転保持機構１１０と、基板２にめっき液３５を供給するめっき液供給機構３０と、を備えている。 - 特許庁

It is also preferable that a pre-wet liquid is applied to the surface of the substrate in order to raise leakage nature of the substrate to the solution before the solution is supplied to the center section of the substrate.例文帳に追加

また前記溶液を基板の中心部に供給する前に、当該溶液に対して基板の漏れ性を高めるためにプリウエット液を基板の表面に塗布してもよい。 - 特許庁

To provide a liquid processing apparatus which is capable of cleaning the side face of a substrate, preventing bubbles from being trapped in a developing solution, and restraining the developing solution from creeping to the rear surface of the substrate while the substrate is subjected to processing.例文帳に追加

処理中に、被処理基板の側面を洗浄すると共に、処理液の泡噛みを防止し、かつ、被処理基板の裏面への処理液の回り込みを阻止すること。 - 特許庁

A plating processing apparatus 20 includes: a substrate rotating/holding mechanism 110 for rotatably holding a substrate 2; and a plating solution supply mechanism 30 for supplying a plating solution 35 to the substrate 2.例文帳に追加

めっき処理装置２０は、基板２を回転保持する基板回転保持機構１１０と、基板２にめっき液３５を供給するめっき液供給機構３０と、を備えている。 - 特許庁

The specific resistance of a solution 6 containing the chemical solution employed for the chemical solution cleaning of the semiconductor substrate 2 and cleaning water employed for the cleaning of the semiconductor substrate 2 cleaned by the chemical solution is measured to obtain the time duration differentiation of the value of measurement.例文帳に追加

半導体基板２の薬液洗浄に用いられた薬液、および薬液洗浄された半導体基板２の洗浄に用いる洗浄水を含む溶液６の比抵抗を測定し、その測定値を時間微分した値を求める。 - 特許庁

A device comprises a tank 3 for removing the peeling solution which allows a substrate 1 etched and sprayed with peeling solution to pass through, and a pair of rollers 7 and 7, for removing the peeling solution from the surface of the substrate 1, being arranged in the tank 3 for removing the peeling solution.例文帳に追加

エッチング処理および剥離液散布がなされた基板１を通す剥離液除去槽３と、この剥離液除去槽３内に設けられ基板１の表面から剥離液を除去する一対のローラ７，７とを備える。 - 特許庁

An etching solution is applied by a spray on a substrate having the unnecessary layer to be removed, and the etching solution applied by the spray is held on this substrate for a predetermined time, and next, an etching solution of the same composition is applied on the substrate by the spray.例文帳に追加

除去すべき不要層を有する基板の上にエッチング溶液をスプレー塗布し、スプレー塗布したエッチング溶液を所定時間この基板上に保持しておき、次いで、同一組成のエッチング溶液を基板の上にスプレー塗布する。 - 特許庁

A substrate treatment device has an installation stand on which a substrate is installed, a supply source of a solution comprising the oxide source, a means for giving pressure to the solution, and a supply nozzle for jetting the solution by pressure to the substrate surface.例文帳に追加

また、基板を設置する設置台と、酸化源を含む溶液の供給源と、溶液に圧力をかける手段と、圧力のかかった溶液を基板表面に噴出する供給ノズルとを有する基板処理装置である。 - 特許庁

To provide a substrate processing method and a substrate processing apparatus improving the inplane uniformity of substrate processing by a chemical solution.例文帳に追加

薬液による基板処理の面内均一性を向上することができる基板処理方法および基板処理装置を提供する。 - 特許庁

A cellulose ester solution is cast on a substrate by a cast die, and a web cooled and made to gel on the substrate is stripped off from the substrate.例文帳に追加

セルロースエステル溶液を流延ダイにより支持体に流延し、支持体上で冷却ゲル化したウェブを支持体からはぎ取る。 - 特許庁

Then, a medical solution is supplied from a medical solution nozzle 142 to the peripheral section of a rotating substrate surface Wf, thus supplying the medical solution to all regions of the peripheral section of the substrate surface Wf.例文帳に追加

そして、回転する基板表面Ｗｆの周縁部に薬液ノズル１４２から薬液を供給することで基板表面Ｗｆの周縁部のすべての領域に薬液が供給される。 - 特許庁

An 'old' treating solution (esp., the treating solution in a lower layer) that has deteriorated in treatment effect on the substrate is scattered off, due to spinning of the substrate while feeding of the treating solution is temporarily interrupted.例文帳に追加

基板上にある処理効果の低下した、いわば古い処理液（特に、下層の処理液）は、処理液の供給が一時的に中断している間に、基板の回転に伴って振り切られる。 - 特許庁

A control unit 59 controls the substrate processing apparatus to supply hydrophobizing solution into a processing tank 1 in order to replace pure water in the processing tank 1 with the hydrophobizing solution and to reform a substrate W with the hydrophobizing solution.例文帳に追加

制御部５９は、処理槽１に疎水化溶液を供給させて、処理槽１内の純水を置換させるとともに、疎水化溶液により基板Ｗの改質処理を行わせる。 - 特許庁

The solution is subjected to spin casting, the solvent is vaporized from the sol solution while the substrate is fast rotated, and the sol solution is gelled to form a silica thin film doped with a cyanine dye H-associated product on the substrate.例文帳に追加

スピンキャスティングを行い、基板の高速回転中にゾル溶液中から溶剤を蒸発させ、ゾル溶液をゲル化させ、シアニン色素Ｈ会合体ドープシリカ薄膜を基板上に形成する。 - 特許庁

AQUEOUS SOLUTION FOR CLEANING AND REMOVING IMPURITY ON INTEGRATED CIRCUIT SUBSTRATE SURFACE, AND CLEANING PROCEDURE USING THE SAME SOLUTION例文帳に追加

集積回路の基板表面の不純物を除去するための洗浄水溶液及びこれを用いた洗浄方法 - 特許庁

The material solution which is liquid at room temperature is atomized and then vaporized, and the vaporized material solution is supplied onto the substrate.例文帳に追加

常温で液体の材料溶液を霧状にした後気化させ、該気化した材料溶液を基板上に供給する。 - 特許庁

At least a pair of electrodes 20a and 20b is placed in the plating solution 5, and a substrate P is immersed in the plating solution 5.例文帳に追加

めっき液５中に少なくとも一対の電極２０ａ，２０ｂを配し、めっき液５中に基材Ｐを浸漬する。 - 特許庁

An aqueous cerium nitrate solution and an aqueous hexamethylenetetramine (HMT) solution are mixed together to be applied onto a substrate.例文帳に追加

硝酸セリウム水溶液とヘキサメチレンテトラミン（ＨＭＴ）水溶液を混合した後、当該混合液を基板に塗布する。 - 特許庁

The method of coating the solution, in which the solution is applied on the substrate by the ink jet system, consists of the processes of excitation-treating a plate face to be coated with the solution in the substrate, and of applying the solution on the excitation-treated plate face of the substrate by the ink jet system.例文帳に追加

基板に溶液をインクジェット方式によって塗布する溶液の塗布方法において、上記基板の上記溶液が塗布される板面を励起処理する工程と、上記基板の励起処理された板面に上記溶液をインクジェット方式によって塗布する工程とを備えている。 - 特許庁