back side backsideとは 意味・読み方・使い方

After a GaAs substrate 101 is processed from the back side thereof, a grounding conductor 106 is provided on the backside of the GaAs substrate 101a.例文帳に追加

ＧａＡｓ基板１０１を裏面側から加工した後、ＧａＡｓ基板１０１ａの裏面に接地導体１０６を設ける。 - 特許庁

In the fastener 2, one end side is attached into a screw hole 100 of the placement board 1 from the back face side, and a string 20 is turned to the surface side, while the other end side is engaged with the backside of the mounting table plate 1.例文帳に追加

緊締具２は、一端側を載置台板１のネジ孔１００に裏面側から取り付け、紐状体２０を表面側に掛け回して、他端側を載置台板１の裏面に係合して取り付けられる。 - 特許庁

The facing material 3 having the back side with the V-shaped folding groove is folded at a part, corresponding to a corner part of a core material 2, from the front side and backside of the core material 2 to a side end surface 2a of the core material 2.例文帳に追加

裏面にＶ字状の折曲溝を有する化粧材３を、芯材２の表面側及び裏面側から芯材２の側端面２ａまで芯材２の角部に対応する部分で折り曲げる。 - 特許庁

There was a big difference between Daimon and Hitatare or Suo: family crests were dyed out at ten parts of Daimon, including larger family crests at the back, right and left front sides, back side of each sleeve, and the backside of the hakama and smaller crests at two places on the front part of the hakama.発音を聞く 例文帳に追加

大きめの家紋を背中と両胸、袖の後ろ側、袴の尻の部分、小さめの家紋を袴の前側に2カ所、合計10カ所に染め抜いた点が直垂や素襖との大きな違いである。 - Wikipedia日英京都関連文書対訳コーパス

Each segment (14) has a backside (20) faced to the back plate (12) and an interface surface (18) in an opposite side of the back plate (12), and the interface surface (18) is engaged with the billet (40) during forging.例文帳に追加

各セグメント（１４）は、バックプレート（１２）に面した背面（２０）と、バックプレート（１２）と反対側に境界面（１８）を有しており、境界面（１８）は鍛造時にビレット（４０）と係合する。 - 特許庁

A Japanese paper sheet 24, a crash 25 and a back-lining reinforcing paper sheet 26 such as a kraft paper sheet are stuck on the back of contents 2 of a book, wherein pieces of the printed paper (the single sheet with the front side and the backside) are collated, in this order by means of a bond.例文帳に追加

印刷された紙（裏表一枚もの）をページ順に揃えた本の中身２の背に和紙２４、寒冷紗２５、クラフト紙等背固め補強紙２６の順にボンドで貼る。 - 特許庁

The axis 6 of rotation of the motor 5 is constituted by a hollow object, and a back rinse nozzle 9 for backside cleaning is inserted in the interior of the hollow object, penetrates the wafer chuck 2 and protrudes onto a back side of the wafer W.例文帳に追加

モータ５の回転軸６は中空体により構成され、その内部に裏面洗浄用のバックリンスノズル９が挿入され、ウェーハチャック２を貫通してウェーハＷの裏面側に突出している。 - 特許庁

The touch panel layer 3 has a transparent conductive film 31 directly formed on the back side 21 of the glass board 2, and a lead electrode 32 formed on the backside 21 so as to make contact with the transparent conductive film 31, and a transparent conductive layer 33 formed on the backside 21 so as to cover the transparent conductive film 31.例文帳に追加

タッチパネル層３は、ガラス基板１の裏側面２１に直接形成された透明導電膜３１と、透明導電膜３１に接触するように裏側面２１に形成されたリード電極３２と、透明導電膜３１を覆うように裏側面２１に形成された透明保護層３３とを有する。 - 特許庁