「生磨」に関連した英語例文の一覧と使い方 - Weblio英語例文検索

学生は読書の技能を磨くべきだ。例文帳に追加

Students should develop their reading skills.  - Tanaka Corpus

パテ研磨用サンドペーパー再生器。例文帳に追加

REGENERATOR FOR PUTTY GRINDING SANDPAPER - 特許庁

研磨用スラリー再生装置例文帳に追加

POLISHING SLURRY REGENERATION APPARATUS - 特許庁

研磨スラリーの再生システム例文帳に追加

REPRODUCING SYSTEM FOR ABRASIVE SLURRY - 特許庁

セリウム系研磨剤の再生方法例文帳に追加

METHOD FOR REGENERATING CERIUM-BASED ABRASIVE - 特許庁

研磨布表面の再生用治具例文帳に追加

JIG FOR REGENERATION OF POLISHING CLOTH SURFACE - 特許庁

管を更生する吸引研磨法例文帳に追加

SUCTION POLISHING METHOD REGENERATING PIPE - 特許庁

研磨用スラリーの再生方法例文帳に追加

THE RECLAIMING METHOD OF POLISHING SLURRY - 特許庁

本発明は、被研磨物の研磨面に研磨パッドの溝が転写することにより発生する研磨痕を緩和することができる研磨装置を提供する。例文帳に追加

To provide a polishing apparatus which relaxes a polishing trace generated by the transfer of grooves of a polishing pad to the polishing surface of a polished object. - 特許庁

研磨能力に優れ、被研磨面に研磨傷を発生させず、かつ分散安定性が良好な、化学機械研磨用の研磨剤を提供する。例文帳に追加

To provide a polishing agent for chemical machanical polishing that is superior in polishing capacity, generates no scratch on a surface to be polished and has superior dispersion stability. - 特許庁

ダイヤモンド研磨工具、ダイヤモンド研磨工具の作成方法、ダイヤモンド研磨工具の再生方法例文帳に追加

DIAMOND POLISHING TOOL, METHOD FOR PREPARING DIAMOND POLISHING TOOL AND METHOD FOR REPRODUCING DIAMOND POLISHING TOOL - 特許庁

単一の研磨機で粗研磨と仕上げ研磨を可能として、生産効率の向上を実現する。例文帳に追加

To enhance the productivity by enabling a single polishing machine to carry out both rough polishing and finish-up polishing. - 特許庁

これにより、研磨時、研磨布の圧力分布による研磨ダレが生じにくい。例文帳に追加

Thus, at the polishing, the polishing sagging due to a pressure distribution of a polishing clock hardly occurs. - 特許庁

研磨中に発生する異物が飛散することなく研磨を行うことができる研磨材を提供する。例文帳に追加

To provide an abradant which is capable of polishing without scattering foreign matter occurring during the polishing. - 特許庁

研磨装置とその方法、及び研磨液再生装置とその方法例文帳に追加

POLISHING APPARATUS AND METHOD THEREOF, AND POLISHING LIQUID RECOVERING APPARATUS AND METHOD THEREOF - 特許庁

歯磨き布を押える手間をかけずに、衛生的かつ安全に歯磨きする。例文帳に追加

To hygienically and safely brush teeth without requiring labor for pressing a dentifrice cloth. - 特許庁

多量の銅系金属を研磨する場合であっても、研磨パッドへの研磨生成物の付着を抑え、研磨操作を中断することなく１度の研磨操作で良好に研磨し得る化学的機械的研磨用スラリーを提供する。例文帳に追加

To provide a slurry for chemical mechanical polishing which inhibits the adhesion of polished products to polishing pads and yields fine polished products via a single polishing operation without interrupting the polishing operation, even when polishing a large amount of copper metals. - 特許庁

分散安定性と研磨能力に優れ、かつ研磨傷の発生せず、化学的機械研磨による精密研磨に適した研磨用砥粒、研磨用水性分散液、及び研磨剤を提供する。例文帳に追加

To provide abrasive grains for polishing, aqueous dispersion for polishing and an abrasive material, which are excellent in dispersion stability and polishing ability and suitable for fine polishing by chemical machine polishing without generating polishing scratches. - 特許庁

被研磨膜と研磨パッドとの摩擦が小さく、研磨後の表面に生じる欠陥を低減して、大きな研磨速度で被研磨膜を研磨でき、しかも廃液の環境負荷の小さな化学的機械的研磨方法を提供する。例文帳に追加

To provide a chemical and mechanical polishing method by which friction between a film to be polished and a polishing pad is sufficiently small to reduce defects on the surface after polishing, the film to be polished can be polished at a high polishing speed and moreover, the impact of waste liquid to environment is small. - 特許庁

被研磨物１５例えば蒸気タービン翼の表面を研磨ベルト４０により研磨する研磨装置において、過去の研磨データであって、研磨焼けの生じない正常な研磨圧データに基いて研磨を行なう研磨圧制御装置３０を備えたものである。例文帳に追加

The polishing device for polishing the surface of the polished object 15 such as a steam turbine blade with an abrasive belt 40, is provided with a polishing pressure control device 30 for carrying out polishing based on past polishing data which is normal polishing pressure data causing no polishing burn. - 特許庁

シリコンウエハーの研磨用シートとしてより優れた研磨速度と、高度の研磨精度を有し生産性に優れた研磨用シートを得ること。例文帳に追加

To obtain a sheet for polishing that has an excellent polishing speed, high-grade polishing accuracy, and superior productivity as the sheet for polishing a silicon wafer. - 特許庁

研磨対象面を上向き姿勢で研磨加工する研磨装置において、パッドスクレーピングの発生を抑止し研磨レートの不均一性を改善する。例文帳に追加

To improve unevenness of a polishing rate by restraining generation of pad scraping in a polishing device for polishing a polishing target surface at an upward posture. - 特許庁

また、グリーンボールの研磨装置１は、研磨により生じた研磨粉を上記研磨面から除去する吸引部材４０をさらに備えている。例文帳に追加

The polishing device 1 of the green ball 1 also includes a suction member 40 for removing polishing power generated by polishing from the polishing surface. - 特許庁

過研磨条件を算出する過研磨条件算出装置３０は、試験パターンに対する研磨結果から、過研磨が発生する条件を求める。例文帳に追加

An excessive polishing condition calculation device 30 which calculates an excessive polishing condition acquires a condition under which excessive polishing occurs, based on the results of polishing with a test pattern. - 特許庁

研磨を繰り返すと、研磨定盤と研磨パッドとの間に、気泡が発生し、研磨パッドが盛り上がる。例文帳に追加

To solve such a problem that a polishing pad becomes swollen due to cells formed between a polishing surface plate and a polishing pad after repeating polishing. - 特許庁

生産性を向上した研磨装置、研磨パッド、研磨液、膨潤処理液および研磨方法を提供する。例文帳に追加

To provide a polishing device having the enhanced productivity, a polishing pad, a polishing agent, a swelling treatment agent and a polishing process. - 特許庁

研磨面側に所定形状の凹部を有し、被研磨面におけるスクラッチの発生が抑えられる化学機械研磨用の研磨パッドを提供する。例文帳に追加

To provide a polishing pad for chemical mechanical polishing having a recessed part of a specified shape on a polishing surface side and capable of restraining a scratch on a polished surface. - 特許庁

研磨面が摩耗しても常に新しい研磨面が創生され、安定した研磨性能が得られる研磨ホイールを提供する。例文帳に追加

To provided a polishing wheel which always creates a new polishing surface even when the polishing surface is worn, and realizes a stable polishing performance. - 特許庁

研磨面側に所定形状の凹部を有し、被研磨面におけるスクラッチの発生が抑えられる化学機械研磨用の研磨パッドを提供する。例文帳に追加

To provide a polishing pad for chemomechanical polishing having recesses of a prescribed form on the polishing surface side to be capable of restricting generation of scratches in a subject surface. - 特許庁

研磨テープの厚さにバラツキがあっても、研磨不足や過剰研磨が生じないテープ研磨装置を実現する。例文帳に追加

To provide a tape polishing device without causing a shortage of polishing and excessive polishing even if there is a variation in the thickness of a polishing tape. - 特許庁

ウェハ毎に研磨量を過剰研磨や過少研磨が生じないように精度良く制御することのできる研磨方法を提供する。例文帳に追加

To provide a polishing method by which the polishing amount is accurately controlled for each wafer so that it may not be done excessively or insufficiently. - 特許庁

研磨液の飛散を生じることなく、研磨面を広く有効に活用でき、研磨シートの寿命が長く、研磨傷の発生が抑制されて高い研磨精度を確保できる研磨機を提供する。例文帳に追加

To provide a polishing machine free to effectively use its polishing surface extensively without causing splash of polishing liquid, long in longevity of its abrasive sheet and capable of restraining generation of polishing flaws and securing high polishing precision. - 特許庁

著しい応力緩和を発生させず、研磨前に研磨布積層体を研磨スラリーに長時間浸漬する必要もなく、研磨中に研磨スラリーによる膨潤変形を生じることのない研磨布積層体を形成可能な研磨布固定粘着テープ、及び研磨布積層体を提供する。例文帳に追加

To provide an abrasive cloth-fixing pressure-sensitive tape that is capable of forming an abrasive cloth laminate body that causes no marked stress relaxation in no need of many-hour immersion of the abrasive slurry before the abrasion and causes no swelling deformation due to the abrasive slurry during the abrasion and provide an abrasive cloth laminated body. - 特許庁

長尺金属シートを連続で研磨する研磨装置において金属シート面に研磨剤を均一に付着させ、研磨手段の研磨方向を改良することにより研磨面に目立つ筋目の発生を解消する。例文帳に追加

To eliminate production of noticeable stripes on a polishing surface by improving the polishing direction of a polishing means by uniformly attaching an abrasive material on a metal sheet surface on a polishing device to continuously polish a lengthy metal sheet. - 特許庁

ポリイミド膜を、短時間で、高い平坦性を維持し、且つ研磨傷の発生を抑制して化学的機械的研磨により研磨しうる研磨用組成物、及び該研磨用組成物を用いた研磨方法を提供する。例文帳に追加

To provide a polishing composition capable of maintaining a polyimide film with a high planarity in a short time and capable of polishing the polyimide film by a chemical-mechanical polishing by suppressing the occurrence of a polishing hurt, and to provide a polishing method using the polishing composition. - 特許庁

研磨液を研磨工具と被加工面の間に介在させて研磨加工を施す研磨装置において、研磨工具が研磨液に水没して浮力を発生するのを防ぐ。例文帳に追加

To prevent occurrence of buoyancy caused by a polishing tool submerged in a polishing liquid, in a polishing apparatus that performs a polishing work by interposing a polishing liquid between the polishing tool and a surface to be processed. - 特許庁

研磨圧がかけられたときに、被研磨物の加工面および研磨パッド１０の研磨面Ｐ間で研磨粒子にかかる押圧力に差が生じ、研磨粒子が移動しやすくなる。例文帳に追加

When polishing pressure is applied, difference is caused in pressing force applied to polishing particles between the processing surface of the material to be polished and the polishing surface P of the polishing pad 10 so that the polishing particles are easily moved. - 特許庁

研磨スラリーの滞留を可及的に抑制して研磨効率の向上を図ると共に、研磨パッドの全域に亘って均一に研磨スラリーを行き渡らせて研磨ムラの発生を抑止できるガラス物品用研磨具を提供する。例文帳に追加

To provide a glass products grinder capable of improving the grinding efficiency by restricting stay of the grinding slurry to the utmost and capable of restricting the generation of unevenness of grinding by evenly distributing the grinding slurry over the whole range of a grinding pad. - 特許庁

化学的機械研磨法を用いた研磨装置において、研磨剤の消費量を低減可能で、研磨剤の粒径拡大化による被研磨対象物に発生するスクラッチを低減可能な研磨装置を提供する。例文帳に追加

To reduce a consumption amount of abrasive and reduce scratch generating in an object to be polished due to the expansion of a grain diameter of abrasive in a polishing device employing a chemical and mechanical polishing method. - 特許庁

ウエハ１の被研磨層１６に対しての化学機械研磨の際に、被研磨層１６に対しての研磨布４を用いての研磨と同時に、被研磨層１６に対して電解めっきにより膜生成をおこなう。例文帳に追加

When a layer to be polished 16 in a wafer 1 is chemically and mechanically polished, the layer to be polished 16 is polished by using polishing cloth 4 and a film is generated on the layer to be polished 16 by electrolytic plating. - 特許庁

研磨装置への供給前に研磨スラリー中の凝集砥粒数を確実に低減し、研磨処理後の被研磨物の研磨面におけるスクラッチの発生を低減できる化学機械研磨方法を提供すること。例文帳に追加

To provide a chemical machine polishing method for positively reducing the number of cohesive abrasive grains in a polishing slurry before supplied to the polishing device and causing less scratches on the polished surface of a material after polished. - 特許庁

また、研磨に伴い研磨試料作成治具１に降りかかる研磨粉・研磨材も溝５に取り込まれ、保持台２の表面に研磨粉・研磨材が付着しにくいので、保持台２の表面荒れが発生しにくくなる。例文帳に追加

In addition, since abrasive powder/abrasive material which fall on the grinding sample preparation jig 1 during grinding are trapped in the groove 5 and they are not likely to stick to the surface of the holding base 2, a surface roughness of the holding base 2 is not likely to appear. - 特許庁

研磨が完了すると、精白米、研磨材、および研磨により発生した糠と粉砕米と米粉を分離し、研磨した精白米を、研磨材と混合して所定の圧力を加えながら所定回数繰り返し研磨する。例文帳に追加

When the grinding is completed, the polished rice, the grinding material and the bran, crushed rice and rice powder which are generated by the grinding are separated from each other, the polished rice which is ground is mixed with the grinding material and the grinding is repeated by the prescribed number while applying a prescribed pressure to the polished rice and the grinding material. - 特許庁

研磨面を介して内部に研磨粒子が進入不能でも研磨傷の発生を抑制し研磨レートを確保しつつ被研磨物の平坦性を向上させることができる研磨パッドを提供する。例文帳に追加

To provide a polishing pad capable of improving flatness of an object to be polished while preventing occurrence of polishing flaws and improving a polishing rate even if polishing particles cannot enter inside through a polishing surface. - 特許庁

研磨パッドの研磨面に生じる凹凸を効果的に解消し、被研磨基板の被研磨面を精度良く平坦に研磨でき、且つ研磨パッドの寿命を長くできるポリッシング装置を提供することを目的とする。例文帳に追加

To provide a polishing device capable of effectively eliminating the unevenness produced on the polishing surface of a polishing pad and prolonging the life of the polishing pad as well as polishing the subject polished surface of a subject polished base with high accuracy and flatness. - 特許庁