「polishing pressure」に関連した英語例文の一覧と使い方 - Weblio英語例文検索

HOUSEHOLD PRESSURE TYPE RICE POLISHING MACHINE例文帳に追加

家庭用圧力式精米機 - 特許庁

POLISHING VISIBLE DETECTION METHOD, POLISHING WORK PRESSURE MEASUREMENT METHOD, POLISHING DEVICE AND POLISHING TOOL例文帳に追加

研磨可視化検出方法、研磨加工圧測定方法、研磨装置および研磨工具 - 特許庁

PRESSURE ROLLER FOR APPLYING POLISHING PAD AND APPLYING METHOD OF POLISHING PAD WITH PRESSURE ROLLER IN DOUBLE-SIDED POLISHING DEVICE例文帳に追加

研磨パッド貼着用加圧ローラを備えた両面研磨装置及び研磨パッドの貼着方法 - 特許庁

To implement high pressure polishing and highly precise low pressure polishing in the same polishing apparatus.例文帳に追加

同一研磨装置において高圧研磨と高精度な低圧研磨とを実施できるようにする。 - 特許庁

To provide a polishing device and polishing method that can obtain a high polishing speed even in low-pressure polishing to perform flat polishing.例文帳に追加

低圧研磨においても、高い研磨速度が得られ、平坦研磨を行うことができる研磨装置及び研磨方法を、提供する。 - 特許庁

To maintain polishing pressure almost at a constant level through the entire polishing process.例文帳に追加

研磨工程全体を通じて研磨圧力をほぼ一定に保つ。 - 特許庁

Thus, at the polishing, the polishing sagging due to a pressure distribution of a polishing clock hardly occurs.例文帳に追加

これにより、研磨時、研磨布の圧力分布による研磨ダレが生じにくい。 - 特許庁

DOUBLE SIDED POLISHING DEVICE EQUIPPED WITH PRESSURE ROLLER FOR APPLYING POLISHING PAD, AND APPLYING METHOD OF POLISHING PAD例文帳に追加

研磨パッド貼着用加圧ローラを備えた両面研磨装置及び研磨パッドの貼着方法 - 特許庁

A polishing pressure corresponding to the depth of a recess is calculated by a polishing pressure calculating device 17 so as to obtain a constant polishing rate, a polishing pressure control 18 gives a polishing pressure to a carrier pressing mechanism 12, and a polishing operation is carried out with a calculated polishing pressure.例文帳に追加

一定の研磨速度が得られるように、凹部深さに応じた研磨圧力を研磨圧力演算装置１７にて算出し、研磨圧力制御部１８が、キャリア加圧機構１２に加えるべき研磨圧力を伝え、算出された研磨圧力にて研磨加工を行う。 - 特許庁

PRESSURE ROLLER FOR APPLYING POLISHING PAD AND APPLYING METHOD OF POLISHING PAD WITH PRESSURE ROLLER IN DOUBLE-SIDED POLISHING DEVICE例文帳に追加

両面研磨装置における研磨パッド貼着用加圧ローラ及び加圧ローラによる研磨パッドの貼着方法 - 特許庁

To equip with a contact pressure spring stably without polishing the contact pressure spring.例文帳に追加

接圧ばねに対して研磨を施すことなく上記接圧ばねを安定に備える。 - 特許庁

POLISHING PAD HAVING PRESSURE-RELIEF CHANNEL例文帳に追加

圧力逃がし通路を有する研磨パッド - 特許庁

PRESSURE CONTROL DEVICE ON POLISHING DEVICE例文帳に追加

研磨装置における圧力制御装置 - 特許庁

PRESSURE SURFACE PLATE AND SINGLE-SIDE POLISHING APPARATUS USING THE SAME例文帳に追加

加圧定盤およびそれを用いた片面研磨装置 - 特許庁

AIR PRESSURE TYPE POLISHING METHOD AND DEVICE THEREFOR例文帳に追加

エアー加圧式研磨方法及びその装置 - 特許庁

PLANE SURFACE POLISHING DEVICE FURNISHED WITH REVERSING MECHANISM FOR PRESSURE PLATE例文帳に追加

加圧プレート用反転機構を備えた平面研磨装置 - 特許庁

FLOOR FACE DISPOSED TYPE ULTRAHIGH PRESSURE POLISHING CUTTING DEVICE例文帳に追加

床面配置型超高圧研磨切断装置 - 特許庁

To provide a chemical mechanical polishing method capable of polishing at a high polishing speed and with reduced dishing, even in conditions that a contact pressure between a surface to be polished of a wafer and a polishing pad and the rotational speed of a polishing table are low in polishing the wafer.例文帳に追加

ウェハを研磨する際に、ウェハの被研磨面と研磨パッドの接触圧と定盤の回転数が低い条件であっても高研磨速度でディッシングを低減した研磨が可能な化学的機械的研磨方法を提供すること。 - 特許庁

To provide a polishing liquid which is used for platinum group metals and capable of polishing a metal film at a low polishing pressure, at a high polishing speed and in good selectivity to a substrate when a CMP is applied to a film of the platinum group metal, and to provide a method for polishing with the polishing liquid.例文帳に追加

白金族金属膜にＣＭＰを適用した際、低研磨圧力で高い研磨速度と下地に対する選択的な金属膜研磨性を持った白金族金属用研磨液及びそれを用いた研磨方法を提供する。 - 特許庁

The polishing device for polishing the surface of the polished object 15 such as a steam turbine blade with an abrasive belt 40, is provided with a polishing pressure control device 30 for carrying out polishing based on past polishing data which is normal polishing pressure data causing no polishing burn.例文帳に追加

被研磨物１５例えば蒸気タービン翼の表面を研磨ベルト４０により研磨する研磨装置において、過去の研磨データであって、研磨焼けの生じない正常な研磨圧データに基いて研磨を行なう研磨圧制御装置３０を備えたものである。 - 特許庁

To provide a polishing pressure measuring method and polishing device that visually measure and monitor various information in a progress state of the polishing, and can accurately perform analysis and evaluation of the polishing process during polishing, measurement and adjustment of polishing pressure and pressure distribution, or the like.例文帳に追加

研磨の進行状態における種々の情報を可視化計測、監視するとともに、研磨加工中の研磨プロセスの分析評価、研磨圧、圧力分布の測定調整等を高精度で行なうことができる研磨加工圧測定方法及び研磨装置を提供すること。 - 特許庁

This method has a first correction-polishing process (step S3) for conducting correction polishing while pressing a polishing tool onto the worked face by the first pressure, and a second correction-polishing process (step S6) for conducting correction polishing while pressing the polishing tool onto the worked face by the second pressure different in its value from that of the first pressure.例文帳に追加

研磨工具を第１の圧力で加工面に押し付けながら補正研磨を行う第１補正研磨工程（ステップＳ３）と、研磨工具を第１の圧力と異なる値の第２の圧力で加工面に押し付けながら補正研磨を行う第２補正研磨工程（ステップＳ６）とを有する。 - 特許庁

As a result, the polishing pressure is controlled with high accuracy to improve the polishing quality.例文帳に追加

その結果、研磨圧力を高精度に制御して研磨品質を向上させることができる。 - 特許庁

To perform a high accuracy polishing with a uniform pressure distribution by preventing a polishing tool from an attitude change etc.例文帳に追加

研磨工具の姿勢変化等を防ぎ、均一な圧力分布で高精度な研磨を行なう。 - 特許庁

To provide a polishing apparatus which can polish the central portion of a bevel of a substrate by high polishing pressure.例文帳に追加

基板のベベル部の中央部を高い研磨圧力で研磨することができる研磨装置を提供する。 - 特許庁

If the polishing pressure falls too much, the polishing head is brought close to the work to polish.例文帳に追加

研磨圧が下がり過ぎると、研磨ヘッドをワークに近づけて研磨圧を上げて研磨する。 - 特許庁

To provide a substrate polishing device capable of polishing the under surface of the substrate with efficient productivity while ensuring uniformity in a polishing pressure surface.例文帳に追加

研磨圧面内均一性を確保しつつ効率的な生産性で基板の下面を研磨することができる基板研磨装置を提供する。 - 特許庁

To provide a polishing pad capable of ensuring polishing performance even at low pressure polishing machining and enhancing flatness of an object to be polished.例文帳に追加

低圧研磨加工でも研磨性能を確保し被研磨物の平坦性を向上させることができる研磨パッドを提供する。 - 特許庁

Therefore, compensation can be carried out to changes in polishing pressure and polishing characteristics, so that accurate polishing rate estimation is enabled.例文帳に追加

したがって、研磨圧力の変動、研磨特性の変動などに対する補償が行なえるようになり、精度の高い研磨レートの予測が可能となる。 - 特許庁

To provide a polishing pad capable of reducing influence of vibration from a polishing machine and improving flatness of a material to be polished even in a case of low-pressure polishing.例文帳に追加

研磨機からの振動の影響を低減し、低圧研磨でも被研磨物の平坦性を向上させることができる研磨パッドを提供する。 - 特許庁

To provide a method of polishing a semiconductor substrate capable of obtaining a steady, high polishing rate while maintaining polishing characteristics, by making a surface state of a CMP polishing pad appropriate using an existing CMP polishing pad and an existing polishing agent in a low-pressure polishing process.例文帳に追加

ＣＭＰ用研磨パッドの表面状態を適正化し、低圧研磨プロセスにおいて、既存のＣＭＰ用研磨パッド及び研磨剤を用いて、研磨特性を維持しながら、安定して高い研磨速度を得られる半導体基板の研磨方法を提供する。 - 特許庁

In the polishing device 30, polishing is performed under the condition within a non-preston region where the polishing speed is not proportional to the product of pressure for pressing the wafer W on the polishing surface 32 and relative speed of the polishing surface 32 and the wafer W.例文帳に追加

この研磨装置３０においては、ウェハＷを研磨面３２に対して押圧する圧力と、研磨面３２とウェハＷとの相対速度との積に研磨速度が比例しない非プレストン領域内の条件下で研磨を行う。 - 特許庁

When polishing pressure is applied, a difference is produced in a pressing force applied to polishing particles between the polishing object and the polishing pad 10 to make the polishing particles easy to move.例文帳に追加

研磨圧がかけられたときに、被研磨物および研磨パッド１０間で研磨粒子にかかる押圧力に差が生じ、研磨粒子が移動しやすくなる。 - 特許庁

When polishing pressure is applied, difference is caused in pressing force applied to polishing particles between the processing surface of the material to be polished and the polishing surface P of the polishing pad 10 so that the polishing particles are easily moved.例文帳に追加

研磨圧がかけられたときに、被研磨物の加工面および研磨パッド１０の研磨面Ｐ間で研磨粒子にかかる押圧力に差が生じ、研磨粒子が移動しやすくなる。 - 特許庁

The substrate polishing method is a method of polishing a substrate with a polishing agent containing abrasive particles and an additive agent which gives a polishing pressure-dependent inflection point to a polishing speed.例文帳に追加

本発明は、酸化珪素膜、金属等の埋め込み膜の余分な成膜層の除去及び平坦化を効率的、高レベルに、かつプロセス管理も容易に行うことができる研磨法を提供するものである。 - 特許庁

In the method for performing chemical-mechanical polishing while a polishing pad is pressed to a semiconductor wafer, the polishing temperature is controlled at 15-70°C, the polishing pressure is controlled at 0.1-2.0 psi, and chemical-mechanical polishing is performed thereby.例文帳に追加

研磨パッドが半導体ウェハに押し当てられて化学的機械的研磨する方法であって、研磨温度が１５〜７０℃に制御されると共に、研磨圧力が０．１〜２．０ｐｓｉに制御されて化学的機械的研磨が行なわれる。 - 特許庁

To provide a chemical mechanical polishing method capable of performing low-erosion polishing at high polishing speed even if the contact pressure between a surface to be polished in a wafer and a polishing pad, and the speed of a surface plate are low, when polishing the wafer.例文帳に追加

ウェハを研磨する際に、ウェハの被研磨面と研磨パッドの接触圧と定盤の回転数が低い条件であっても高研磨速度で低エロージョンの研磨が可能な化学的機械的研磨方法を提供すること。 - 特許庁

To provide a method of polishing a metal film which is for electrochemical mechanical polishing capable of flattening the metal film or the like of a semiconductor device and forming wiring while keeping high polishing speed even when polishing pressure is lowered, and to provide a substrate polishing body.例文帳に追加

半導体デバイスの金属膜等を、研磨圧力を低下させても高い研磨速度を維持しながら平坦化して配線形成できる電気化学的機械的研磨用の金属膜の研磨方法及び基板研磨体を提供する。 - 特許庁

A local pressure on the polishing surface P is absorbed to the urethane foamed body 2 side and the equalized polishing pressure is applied to the object to be polished.例文帳に追加

研磨面Ｐでの局所的な圧力がウレタン発泡体２側に吸収され被研磨物に均等化された研磨圧力が掛けられる。 - 特許庁

A polishing liquid introducing port 3 communicates with the gap 8a and the supply pressure of the liquid 16 is higher than the supply pressure of the polishing liquid 11.例文帳に追加

研磨液導入穴３と軸受の隙間８ａとは連通しており、液体１６の供給圧力は、研磨液１１の供給圧力より高くする。 - 特許庁

The ratio k of a polishing rate in the case that processing pressure is 13.8 kPa to a polishing rate in the case that processing pressure is 0.7 kPa is set to 10≤k≤100.例文帳に追加

加工圧力が１３．８ｋＰａのときの研磨速度と、加工圧力が０．７ｋＰａのときの研磨速度との比ｋを、１０≦ｋ≦１００とする。 - 特許庁

To provide a wafer polishing equipment wherein adjustments of ring pressure and plate pressure are facilitated and polishing conditions can be changed with superior workability.例文帳に追加

リング圧、プレート圧の調整が容易で、研磨条件の変更を作業性よく行えるウエーハの研磨装置を提供する。 - 特許庁

COMPOSITION AND METHOD FOR LOW DOWNFORCE PRESSURE POLISHING OF COPPER例文帳に追加

銅の低ダウンフォース圧力研磨のための組成物及び方法 - 特許庁

Hardness of the urethane sheet 2 is enhanced, and the large cell 3a is deformed by polishing pressure.例文帳に追加

ウレタンシート２の硬度が高まり、研磨圧で大セル３ａが変形する。 - 特許庁

The hardness of the resin sheet 2 is increased and the large cells 3a are deformed by polishing pressure.例文帳に追加

樹脂シート２の硬度が高まり、研磨圧で大セル３ａが変形する。 - 特許庁