裏カバー６の膨出部６２のパチンコ機裏面と対向する面には、制御回路基板Ｓ１〜Ｓ６が配置されている。例文帳に追加

The control circuit boards S1-S6 are disposed on the surface, which is opposed to the back surface of the Pachinko machine, at the inflated portion 62 of the back cover 6. - 特許庁

いす（１）を構成する背もたれ（２）の表面（３）の裏側に裏面（４）を設け、裏面（４）に凹凸部（５）を設け、背もたれ（２）は軸（６）を中心に回転させることで表面（３）と裏面（４）が入れ替わるようにする。例文帳に追加

A rear face 4 is provided on the rear side of a front face 3 of a backrest 2 composing a chair 1, a rugged part 5 is provided on the rear face 4 and by rotating the backrest 2 with a shaft 6 as a center, the front face 3 and the rear face 4 are exchanged. - 特許庁

これにより、荷台２を搬送するために第１搬送路６の裏面側に第１搬送路６に沿って回転軸を設置する必要が無いので、第１搬送路６の裏面側にスペースを得ることができる。例文帳に追加

Thereby, since it is not required that a rotation shaft is installed on a back surface side of the first conveying passage 6 along the first conveying passage 6 in order to convey the load-carrying platforms 2, the space can be obtained on the back surface side of the first conveying passage 6. - 特許庁

該引出し体６の裏面には、引出し体６の往復移動に伴って回転すべき複数の車輪が配備されている。例文帳に追加

A plurality of wheels to be rotated along with the reciprocation of the drawer body 6 are disposed on the backside of the drawer body 6. - 特許庁

裏面と表面にそれぞれ電極５，６が形成されたチップコンデンサ１を、第１の回路基板１１の上に裏面の電極６が第１の回路パターン１５と電気的に接続されるように配置する。例文帳に追加

A chip capacitor 1 is equipped with electrodes 5 and 6, which are each formed on its rear and front, and the capacitor 1 is arranged on the first circuit board 11 so as to electrically connect the electrode 6 formed on its rear to the first circuit pattern 15. - 特許庁

誘電体基体表面の高周波回路４，５の回路パターン形成領域と誘電体基体裏面との間の誘電体基体部分には誘電体層１４ｂ，１４ｃ間の位置に回路用接地電極１６を形成する。例文帳に追加

A circuit-grounding electrode 16 is formed at a position between dielectric layers 14b and 14c, on a portion of the substrate 6, between the circuit pattern forming region of the circuits 4, 5 on the surface of the substrate 6 and the backside of the substrate 6. - 特許庁

これら目地部の隙間にエポキシ樹脂等の充填材を注入し、裏面の段差部６側の周回隙間へ回り込ませて遮蔽する。例文帳に追加

A filler such as epoxy resin is filled in these joint clearances for shielding after bringing around to the circulating clearance on the stepped part 6 side of the back face. - 特許庁

更に一つの表外面と一つの裏外面（４，６）並びに一つの外面に、特に裏外面（６）に取り付けられる一つの電子回路装置（１４）を備えるそのような本状書類が記載される。例文帳に追加

Furthermore, a book-like document having one electronic circuit device (14) attached onto one outer surface among one front outer surface and one back outer surface (4 and 6), particularly to the back outer surface (6) is disclosed. - 特許庁

可撓性の裏面材によって複数の長尺状木質片２を巻回可能に連結するとともに、裏部材が接着される各長尺状木質片２の裏面側に、その裏面側を開放したパイプ埋設用の凹溝を形成し、この凹溝内に温水パイプ６が埋設される連結床材を備えている。例文帳に追加

A plurality of long wooden pieces 2 are connected to be wound by a flexible back material, and the back of each long wooden piece 2 to which the back material is bonded is provided with a connecting floor material where a recessed groove whose back side is opened is formed and a hot water pipe 6 is buried in the recessed groove. - 特許庁

段差部３，４を布線回路板１の表裏両側に設け、板部９を布線回路板の厚さ方向中央に位置させ、板部の表裏両側にバスバー回路板５，６を配置する。例文帳に追加

The level difference parts 3 and 4 are provided on the surface and rear of the wiring circuit board 1, the plate part 9 is located in the center of the wiring circuit board in the thickness direction, and the bus bar circuit boards 5 and 6 are arranged on the surface and rear of the plate part. - 特許庁

基板４の表面４Ａには回路素子を設けると共に、裏面４Ｂには回路素子に接続された基材側電極６を設ける。例文帳に追加

The surface-mounted component are provided with a circuit element on the surface 4A of a substrate 4 and a substrate-side electrode 6 which is connected to the circuit element and formed on the rear surface 4B of the substrate 4. - 特許庁

第１の筐体３にヒンジ部６に対して表裏反転自在に回転させる第１回転軸１０を設ける。例文帳に追加

A first casing 3 includes a first rotary shaft 10 rotating to be freely inverted to the front and back to a hinge part 6. - 特許庁

誘電体基体表面の高周波回路４，５の回路パターン形成領域と誘電体基体裏面間の誘電体基体部分には横穴１４，１５を形成する。例文帳に追加

Lateral holes 14, 15 are formed on a portion of the substrate 6, between the circuit pattern forming region of the circuits 4, 5 on the front surface of the substrate 6 and the backside of the substrate 6. - 特許庁

ここにあった内裏は江戸時代だけで8回再建されており（うち6回は火災焼失による再建）、現存する建物は江戸末期の安政2年（1855年）、平安様式にならって再建されたもので安政内裏と呼ばれるものである。例文帳に追加

During the Edo period, the Dairi was reconstructed eight times (six of them were caused by destruction by fire), and the existing building is called Ansei Dairi, which was reconstructed in accordance with the Heian style in 1855.発音を聞く  - Wikipedia日英京都関連文書対訳コーパス

カメラ用回路基板１の一方の面（裏面）の端部に、フレキシブルプリント基板６との接続用の接続パターンを形成する。例文帳に追加

A connection pattern for connection to a flexible printed board 6 is formed at an end of one side (rear side) of the circuit board 1 for camera. - 特許庁

そして、係合体７は、その係合体７を壁表Ｐ１側から貫通孔１ａを通って壁裏Ｐ２側へと挿入可能な回避位置と、壁裏係合部７ａが周縁部壁裏面１ｃと対向する対向位置とに、ボルト部材６の回動操作によって移動可能となっている。例文帳に追加

The engaging body 7 can move to an avoidance position allowing the engaging body 7 to pass through the through-hole 1a and be inserted into a wall back P2 side from a wall surface P1 side and an opposing position where the wall back engaging part 7a opposes to a wall rear surface 1c of the peripheral fringe part by the turning operation of the bolt member 6. - 特許庁

また、ハウジング２の裏面側には、弾性シート７と、その弾性シート７によって覆われる回路基板６とが配設されている。例文帳に追加

In addition, the rear of the housing 2 is provided with an elastic sheet 7 and a circuit board 6 covered with the elastic sheet 7. - 特許庁

フレキシブルプリント基板４の裏面側に、カメラ用回路基板１との接続部４ａに対応して補強部材６を設ける。例文帳に追加

A reinforcement member 6 is provided on the back surface side of the flexible print board 4, in combination with the joint portion 4a of the circuit board 1 for the camera. - 特許庁

ハウジング２には複数の点灯部５がそれぞれ設けられ、該ハウジング２の裏面側には、弾性シート７及び回路基板６が配設されている。例文帳に追加

A plurality of lighting parts 5 are installed respectively in a housing 2 and an elastic sheet 7, and a circuit board 6 are installed on the rear side of the housing 2. - 特許庁

絶縁ケース１の開口部に絶縁樹脂を充填して回路基板の裏面側に絶縁樹脂層６を形成する。例文帳に追加

The opening of the insulating case 1 is packed with insulating resin, and an insulating resin layer 6 is formed on the back side of the circuit board. - 特許庁

また、固定部材７は、壁３の裏面３ｂに固定される固定部７ａと、ボックス本体６を回動可能に支持する支持部７ｂとを備える。例文帳に追加

The fixed member 7 comprises a fixed part 7a fixed to the rear face 3b of the wall 3, and a support part 7b supporting the box body 6 turnably. - 特許庁

回動しない間、基盤収納ケースは蓋３４がされた状態で特殊螺子３６４によって、遊技盤６の裏面６ａに固定される。例文帳に追加

While they are not turned, the board storage case is fixed to the back surface 6a of a game board 6 by a special screw 364 in the state that a lid 34 is put on. - 特許庁

半導体パッケージ１は、表裏両面に形成された電極部６、９の配線網を有する回路基板３をパッケージ基体として具備する。例文帳に追加

The semiconductor package 1 has a circuit board 3 having the wiring network of electrodes 6, 9 formed on both front and rear surfaces as a package substrate. - 特許庁

次に、回路ブロック５を含む長尺基板１の主面上および裏面上にレジスト６を形成する。例文帳に追加

Next, resist 6 is formed on the main surface and the rear surface of the long-length substrate 1 including circuit blocks 5. - 特許庁

第１コンベア５及び第２コンベア６を回転移動させてバイアスゴムシート３の表裏を反転させる。例文帳に追加

The obverse-reverse of the bias rubber sheet 3 are reversed by rotatably moving the first conveyor 5 and the second conveyor 6. - 特許庁

光集積チップ２は、バイアホール５に発光部６と受光部７が収まる位置で、回路基板３の裏面に取り付けられる。例文帳に追加

The optical integrated chip 2 is attached to the rear surface of the circuit substrate 3 on the position where the light emitting part 6 and the light receiving part 7 are settled in the via hole 5. - 特許庁

中蓋３の裏面に摺接しつつ掻き落し部材１５が撹拌部材６と一体に回転し、中蓋に付着した収容物を掻き落す。例文帳に追加

A scraping member 15 rotates with the agitating member 6 while slidably contacting the reverse surface of the inner lid 3 to scrape the housed content adhering to the inner lid. - 特許庁

修正車２８は分針軸６を中心に回転自由に支持されていて、日の裏車１６が備え付けられている。例文帳に追加

Since the correction wheel 28 is supported so that it can be rotated freely with a minute hand shaft 6 as a center, and a day minute wheel 16 is mounted. - 特許庁

モータ５の回転軸６は中空体により構成され、その内部に裏面洗浄用のバックリンスノズル９が挿入され、ウェーハチャック２を貫通してウェーハＷの裏面側に突出している。例文帳に追加

The axis 6 of rotation of the motor 5 is constituted by a hollow object, and a back rinse nozzle 9 for backside cleaning is inserted in the interior of the hollow object, penetrates the wafer chuck 2 and protrudes onto a back side of the wafer W. - 特許庁

接着剤５を塗布した裏打ち板１０を、回転テーブル６に設けた支持・上昇部材８，９上に載置する。例文帳に追加

The backing plate 10 coated with an adhesive 5 is placed on supporting and rising members 8 and 9 disposed on the turn table 6. - 特許庁

電子回路チップの発熱はランド部６からサーマルビアを経てベース基板の裏面側へ伝導し、熱伝導部材から第２サーマルビアを経てベース基板の裏面側へ伝導する。例文帳に追加

Heat generated by the electronic circuit chip is conducted to the back side of the base substrate through a thermal via from the land section 6, and is conducted to the back side of the base substrate through a second thermal via from the thermal conductivity member. - 特許庁

サセプタ５を裏面中央部では支持せず、回転軸６から放射状に分岐されるスポーク７の先端部の垂直ピン７ｂを用いて、周縁部裏面でのみ支持する。例文帳に追加

A susceptor 5 is supported only at the circumferential part of the back face by using vertical pins 7b at the tip ends of spokes 7 radially branched from a rotary shaft 6 in place of supporting the susceptor at the center of the back face. - 特許庁

裏面には複数条の溝５を略全面に刻んでモルタルとの食い付きをよくし、裏面各辺のエッジ部に切り欠きを設けて周縁を周回する段差部６を形成する。例文帳に追加

A plurality of grooves 5 are recessed on the back face to improve a bite into mortar, and the edge part of each side of the back face is provided with a cutout to form a stepped part 6 circulating the peripheral edge. - 特許庁

絶縁層１と絶縁層１の表面に形成された回路パターン４とを具備する回路基板６に電子部品８を表面実装し、電子部品８が表面実装された回路基板６の絶縁層１裏面を加熱溶融して回路基板６を放熱器に溶着させる。例文帳に追加

The electronic component 8 is surface-mounted on a circuit board 6 including an insulating layer 1 and a circuit pattern 4 formed on a surface of the insulating layer 1, and the backside of the insulating layer 1 on the circuit board 6 with the electronic component 8 surface-mounted is heated and melted to weld the circuit board 6 to a heat sink. - 特許庁

ペットの足上と足裏を洗浄するのに給水手段からの水流で足上洗浄ブラシ５と足裏洗浄ブラシ１０とに接続された足上用タービン６と足裏用タービン１１とを回転させ一度にペットの足四足を洗浄するペット足洗浄器である。例文帳に追加

The pet paw washer washes four paws of the pet at a time with water stream from a water feeding means for washing upper surfaces and soles of paws of the pet by rotating an upper turbine 6 and a sole turbine 11 respectively connected to an upper washing brush 5 and a sole washing brush 10. - 特許庁

そして、係合体７は、その係合体７を壁表Ｐ１側から貫通孔１ａを通って壁裏Ｐ２側へと挿入可能な回避位置と、壁裏係合部７ａが周縁部壁裏面１ｃと対向する対向位置との間を、ボルト部材６の操作によって移動可能となっている。例文帳に追加

The engaging body 7 can move between an avoidance position allowing the engaging body 7 to pass through the through-hole 1a and be inserted into the wall back P2 side from a wall surface P1 side and an opposing position where the wall back engaging part 7a opposes to the wall rear surface 1c of the peripheral fringe part by the operation of the bolt member 6. - 特許庁

回路基板３の裏面には、表裏両面の電極部６、９とそれぞれ配線網を介して接続された金属バンプ２が外部接続端子として形成されている。例文帳に追加

A metal bump 2 connected to the electrodes 6, 9 on both the front and rear surfaces via the wiring network is formed as an external connection terminal on the back of the circuit board 3. - 特許庁

トレッドゴム１０の終端部１２を裏当てアーム４とローラ６とで挟持した後、成形ドラム１を回転させ、裏当てアーム４を揺動させ、トレッドゴム１０の終端部１２を始端部１１に近づけて接着させる。例文帳に追加

After the end 12 of the rubber 10 is sandwiched between the arm 4 and the roller 6, the drum 1 is rotated, the arm 4 is oscillated, the end 12 of the rubber 10 is approached to the end 11 and adhered to the end 11. - 特許庁

掛着部１３を枠本体６を巻回してレンズ枠２の裏面側に回し、レンズ枠２の外周面の溝内に掛着させ、レンズ枠２と枠本体６とを一体に連結する。例文帳に追加

The hooking portions 13 are turned to the rear surface sides of the lens frames 2 by winding the frame bodies 6 and are hooked into the grooves on the outer peripheral surfaces of the lens frames 2, by which the lens frames 2 and the frame bodies 6 are integrally connected. - 特許庁

電子回路４が表面に形成されたチップ６の裏面に、少なくともこの裏面に対応する形状および寸法の接着フィルム９が貼着され、裏面全面が接着フィルム９で覆われた半導体チップ５とする。例文帳に追加

To the back of a chip 6 on which an electronic circuit 4 is formed on its surface, an adhesive film 9 with a shape and dimension corresponding to at least the back is adhered, and the entire face of the back is coated with the adhesive film 9 to form a semiconductor chip 5. - 特許庁

鍵盤部５を覆う回動自在な鍵盤蓋６の裏面６ｃで回動支点部付近に鍵盤蓋６の長手方向に延在する指逃がし用凹部２０を設ける。例文帳に追加

The rear surface 6c of the freely turnable fallboard 6 covering a keyboard section 5 is provided with a recessed part 20, for allowing the fingertips to escape, which extends in the longitudinal direction of the fallboard 6 near a turning fulcrum. - 特許庁

半導体チップ１に裏面電極７を設けて、表面側に設けた回路集積部１１の配線１２と裏面電極７とを、ビアホール５内に設けた金属層６を介して電気的に接続する。例文帳に追加

A back electrode 7 is provided on a semiconductor chip 1, and a wiring 12 of a circuit integrated part 1 provided on a front surface is connected electrically to the back electrode 7 via a metal layer 6 provided inside a via hole 5. - 特許庁

配線回路基板１Ａの使用時に、折り返し部１１を谷折して、補強部９の第４補強板１０の裏面と第２接続部６の第２補強板１９の裏面とが接触するように、補強部９を第２接続部６に積層する。例文帳に追加

A turning part 11 is bent inward to laminate the reinforced part 9 on a second joint 6, so as to bring the rear surface of the fourth reinforcing plate 10 of a reinforcing part 9 into contact with the rear surface of the second reinforcing plate 19 of the second joint 6 when the wiring circuit board 1A is in use. - 特許庁

右側タイヤ大４、ホイル６、ホイルウケ大２の裏側に取り付けた電気モーター１により各タイヤ大、小を回して、タイヤ大４″、ホイル大６″、ホイルウケ大２″の固定板１０の裏側の固定ウケ１６に固定されている発電モーター３を発電する。例文帳に追加

The large tires and the small tires are rotated with the motor 1 installed on the rear side of the right side large tire 4, the large wheel 6 and the large wheel receiver 2 to generate the generator motor 3 fixed to the fixing receiver 16 on the rear side of the fixing plate 10 of the large tire 4", the large wheel 6" and the large wheel receiver 2". - 特許庁