「plating current」に関連した英語例文の一覧と使い方(3ページ目) - Weblio英語例文検索

To provide a recycling method for a gold plating solution by which current efficiency or a current density is remarkably recovered, and adsorption of the components (i.e., gold salt, conduction salt, a complexing agent and a crystal control agent) in the gold plating solution is suppressed, and a film having a crystal structure same as that in the initial gold plating solution can be formed.例文帳に追加

電流効率又は電流密度範囲を著しく回復され、金めっき液の成分（即ち、金塩、伝導塩、錯化剤及び結晶調節剤）の吸着が抑制され、かつ当初の金めっき液と変わらない結晶構造の皮膜を生成可能な、金めっき液の再生処理方法を提供すること。 - 特許庁

To provide an automatic plating apparatus which reduces plating failures due to the contamination of a washing solution and a plating solution, properly and uniformly holds a current density in an electrolytic solution in the periphery of an article to be plated, and can form an adequately plated film on the article to be plated.例文帳に追加

水洗液やめっき液の混入によるめっき不良を低減し、被めっき物の周囲における電解液中の電流密度を適正に均一に保持し、良好なめっき処理を行なうことができる自動めっき装置を提供する。 - 特許庁

To provide a copper-tin alloy plating bath, a non-nickel and non-cyan plating bath, capable of forming a copper-tin alloy plating film having a silver-white appearance closely resemble with a nickel plating in a color tone and having excellent denseness in wide current density region and having an easy draining processability and being friendly to the environment.例文帳に追加

非ニッケル及び非シアンのめっき浴から色調がニッケルめっきに酷似した銀白色の外観及び緻密性に優れた銅−錫合金めっき皮膜を広い電流密度領域において形成することができ、排水処理性が容易で環境に優しい銅−錫合金めっき浴を提供する。 - 特許庁

The film deposition control section 22 stores the correlation data between the state parameters of the plating solution and plating film deposition conditions for controlling the bottom-up amount or the like in groove wiring to be constant, and determines film deposition conditions such as a plating current value or the like by comparing the parameters showing the state of a plating solution practically used with the correlation data.例文帳に追加

成膜制御部２２は、溝配線におけるボトムアップ量等を一定にするためのめっき液状態パラメータとめっき成膜条件との相関データを記憶しており、実際に使用されるめっき液の状態を示すパラメータをこの相関データと照合して、めっき電流値等のめっき成膜条件を決定する。 - 特許庁

This is constituted as the battery joining to the electrode plate group by applying non-electrolyzed nickel plating to a contact position of the electrode plate group with the current collector.例文帳に追加

集電体と極板群の接触箇所に無電解ニッケルメッキを施し、極板群と接合した電池として構成する。 - 特許庁

An electrodeless plating layer 30a, 30b is formed on the outer surface of both end parts of a glass lamp container 10 as a current conductor layer.例文帳に追加

ガラスランプ容器１０の両端部の外表面に電流導体層として無電解メッキ層３０ａ，３０ｂを形成する。 - 特許庁

The method requires one additional processing step to solve the problem during a plating step, without changing the current manufacturing step of the water supply equipment, nickel-plating step or chromium-plating step at all, and further without devising plating conditions to prevent the inner surface from being nickel-plated or masking a target to be plated to prevent a plating solution from infiltrating inside.例文帳に追加

現状の給水器具製造工程やニッケルめっき工程やクロムめっき工程を全く変更することなく、また、ニッケルめっきが内面につきまわらないようにめっき条件を工夫したり、めっき液が内面に入らないように被めっき物にマスキングしたりするなどの手間が必要なく、めっき工程中に１つの処理工程が増えるのみで本課題が解決できる。 - 特許庁

To provide a method of controlling electroplating current capable of providing uniform plating by arbitrarily setting load-bearing rates and usage priority order of a plurality of plating cells with respect to adjustable speed of material to be plated.例文帳に追加

被メッキ材の加減速に対して、複数のメッキセルの負荷分担率及び使用優先順位を任意に設定して、均一目付を得ることが可能な電気メッキ電流制御方法を提供する。 - 特許庁

To provide a plating liquid providing a plating film having little cracks, excellent corrosion resistance, high hardness, excellent wear resistance and a smooth, dense, glossy appearance at current density in a wide range.例文帳に追加

広範囲な電流密度において、クラックが少なく、耐食性に優れ、硬度が高く、耐摩耗性が優れ、平滑で緻密な光沢外観を有するめっき皮膜を与えるめっき液を提供すること。 - 特許庁

To provide a plating bath which can enhance the uniformity and the like of a plated film in a wide range of current density, impart an adequate appearance and soldering characteristics to the plated film, and prevent the aggregation among electroconductive media and among articles to be plated, in a barrel-plating process.例文帳に追加

広い電流密度範囲での均一性等の向上と、良好な皮膜外観やハンダ付け性を達成し、バレルメッキに際して、導電性媒体や被メッキ物同士の凝集を防止する。 - 特許庁

Thus, the surface to be plated in each process is limited to an area on which the plating liquid flow and the current density are more uniform, by plating the surface of the substrate part by part.例文帳に追加

被処理基板面を一部ずつメッキすることにより、各工程でメッキを施す面はメッキ液の流れおよび電流密度がより均一になる範囲に限定されたものとすることができる。 - 特許庁

A mark can be directly displayed on the plated product, based on the fact that plating will not adhere to the printed part because no current flows in the printed part, while plating adheres to the surface of the other part.例文帳に追加

したがって、印刷部には電気が流れないので、めっきが付かず、それ以外の表面にはめっきが付くことを利用して、めっき品に直接マークを表示することができるようになる。 - 特許庁

The current density is practically uniformized between an electroless plating layer and a circuit which are positioned at a part of the substrate 1 near a power source and an electroless plating layer and a circuit which are situated at a part far from the power source.例文帳に追加

基板１の電源に近い部分に位置する無電解メッキ層や回路と電源から遠い部分に位置する無電解メッキ層や回路との間で電流密度をほぼ均一にすることができる。 - 特許庁

Further, electrolytic plating of copper which uses the metal film for forming wiring 7a as a plating current path is carried out to form a column-shaped electrode 8 on the upper surface of the metal film for forming wiring 7a in an opening 24 of the plating resist film for forming column-shaped electrode 23.例文帳に追加

次に、配線形成用金属膜７ａをメッキ電流路とした銅の電解メッキを行なうことにより、柱状電極形成用メッキレジスト膜２３の開口部２４内の配線形成用金属膜７ａの上面に柱状電極８を形成する。 - 特許庁

For example, by performing the gold plating under the conditions that gold plating liquid temperature is 60 to 65 degrees and gold plating current density is 0.4 to 0.8 A/dm^2, the formation of the bump having a surface condition free from a level difference is made possible regardless of the level difference in a polyimide film as a substrate.例文帳に追加

例えば金めっき液温度を６０〜６５度、金めっき電流密度を０．４〜０．８Ａ／ｄｍ^２の条件で金めっきを行うことで、バンプ表面状態が下地であるポリイミド膜の段差に関係なく表面段差の無いバンプの形成が可能になる。 - 特許庁

To provide a spot welding electrode capable of suppressing welding and alloying with plating metal, preventing cracks, and prolonging the lifetime even when performing the spot welding of a plated steel plate with Zn plating or Zn alloy plating thereon under a large current.例文帳に追加

ＺｎめっきまたはＺｎ合金めっきを施しためっき鋼板を大電流下でスポット溶接にする際にあっても、めっき金属との溶着・合金化を抑え、亀裂の発生を防止して長寿命化を可能としたスポット溶接用電極を提供する。 - 特許庁

The negative electrode current collector for the dry cell has a surface of wire rod made of iron formed in a prescribed shape by forging process on which a plating treatment is applied, and the plating is made of two layer structure of which the inner layer is made by copper plating and the outer layer is by galvanization.例文帳に追加

鍛造加工により所定形状に形成された鉄製の線材の表面にメッキ処理が施されており、前記メッキが、内層が銅メッキ、外層が亜鉛メッキの二層構造とされていることを特徴とする乾電池用負極集電体である。 - 特許庁

The method for enhancing the thickness uniformity of the plated film, particularly, for decreasing the thickness distribution in the plane includes controlling the distribution of the plating current by passing the plating current to any one plate or two plates of the two or more plates of tabular anodes.例文帳に追加

そして、２枚以上の板状アノード電極の内、いずれか１枚にめっき電流を流し、若しくは、２枚両方にめっき電流を流すことにより、めっき電流分布を調整し、もって、めっき厚みの均一性、特に面内バラツキを小さくする。 - 特許庁

By the plating layer 14, the contact corrosion current flowing through the space between the disk rotor 11 and the hub 12 is made stable over a long period, and moreover, the contact corrosion current is made small.例文帳に追加

メッキ層１４により、ディスクロータ１１及びハブ１２間に流れる接触腐食電流が長期に渡って安定すると共に、その接触腐食電流が小さなものとなる。 - 特許庁

The difference in the voltage when an electrolytic cell 2 is operated at different two current levels is monitored by repeatedly measuring with a probe in a short time at a second level while plating is performed at a first current level.例文帳に追加

電解セル中での写真定着溶液からの銀の回収が、望ましくない副次効果を最小にしながら、高い電流効率を維持するよう制御される。 - 特許庁

To prevent an electromagnetic force which is generated by an electric current and an ion current passing from an anode to a cathode in a liquid, from disturbing a hydrogen absorption or an attachment (plating and the like) of atoms or molecules.例文帳に追加

陽極から陰極へと液中を流れる電流及びイオン流によって生ずる電磁力により、水素吸蔵や原子、分子の付着（メッキ等）が妨げられないようにする。 - 特許庁

To provide the method of manufacturing a TAB tape carrier for obtaining a solder ball connection pad that has been plated uniformly without any partial concentration of current regardless of high-current-density plating.例文帳に追加

高電流密度でメッキを行っても部分的な電流の集中がなく、均一にメッキされた半田ボール接続パッドが得られるＴＡＢテープキャリアの製造法を提供する。 - 特許庁

To solve the problem that copper corrodes and current does not flow in a copper interconnection when CMP (Chemical and Mechanical Polishing) is carried out using slurry chemically changing a copper plating film.例文帳に追加

銅めっき膜を化学的に変化させるスラリーを用いてＣＭＰすると、銅が腐食して、銅配線に電流が流れなくなる。 - 特許庁

To obtain an alkali secondary cell with improved adhesion of a plating on a current collector material, improved discharging characteristics, and easy assembly.例文帳に追加

集電材のニッケルめっきの密着性を向上し、組み立てが容易で高率放電特性を向上しうるアルカリ２次電池を得る。 - 特許庁

To provide a substrate plating apparatus that can uniformize primary current distribution between cathode and anode and can be reduced in size.例文帳に追加

陰極と陽極との間の一次電流分布を均一にでき、且つメッキ装置を小型化できる基板メッキ装置を提供すること。 - 特許庁

To provide an electroplating head giving a uniform current distribution to the whole of a wafer and giving a uniform plating thickness, and to provide a method for operating the same.例文帳に追加

ウェーハ全体に均一な電流分布を与え、均一なメッキ厚を与える電気メッキヘッド及びその操作方法を提供する。 - 特許庁

To provide a substrate plating apparatus in which a primary current distribution between a cathode and an anode can be uniformed and which can be downsized.例文帳に追加

陰極と陽極との間の一次電流分布を均一にでき、且つメッキ装置を小型化できる基板メッキ装置を提供する。 - 特許庁

At the time of applying electrolytic plating to each bonding pad 3, the bonding pad 3 is fed with a current from the power supply 8 through the electrode 7.例文帳に追加

各ボンディングパッド３に電解メッキを施す際に電源８から電極７を介してボンディングパッド３に電流が供給される。 - 特許庁

To provide a plating device where the variation of electric current flowing through a workpiece at the inside of a drum therein and the state of a plating liquid at the inside of the drum are reproduced, and testing can be performed regarding the influence of them on the formation of a plating film.例文帳に追加

バレルめっき装置のドラム内部の被処理物に流れる電流の変動、および、バレルめっき装置のドラム内部のめっき液の状態を再現して、これらがめっき皮膜の形成に及ぼす影響について試験を行うことができるめっき装置を提供する。 - 特許庁

To provide a method of fabricating a substrate with a high density and high reliability, by forming a resist pattern through coating of a photosensitive material on an electroless copper plating layer, exposure to light and development, and then preparing a bump pad by pulse plating and direct current plating of the resist pattern.例文帳に追加

無電解銅鍍金層に感光材を塗布した後に露光現像してレジストパターンを形成してパルス鍍金と直流鍍金をしてバンプパッドを形成させることにより高密度で高信頼性の基板を製造するフリップチップバンプパッド形成方法及びその構造に関する。 - 特許庁

To provide an electric aluminum plating bath which has no risk of explosion even when it is brought into contact with air or water and can be operated at a plating temperature at which production of vapor of AlCl_3 is reduced, and with which production of black deposits is suppressed even in plating work at a high current density.例文帳に追加

本発明は、空気や水と接触した場合にも爆発の危険性がなく、高電流密度作業でも黒色析出物の発生もなく、ＡｌＣｌ_3の蒸気の発生も少ないめっき温度で操作できる電気アルミニウムめっき浴を提供することを目的とする。 - 特許庁

At the time when a steel sheet is subjected to chromium plating by an electroplating line provided with many passes, a plating bath obtained by adding a halide and a sulfide as auxiliaries to chromic acid is used, further, a network electrode composed of PbO_2 is used, and plating is performed as electric current is controlled per pass.例文帳に追加

多数のパスを備えた電気めっきラインにより鋼板にクロムめっきを行うに際し、クロム酸に助剤としてハロゲン化物及び硫化物を添加しためっき浴を用いるとともに、ＰｂＯ_２からなる網状電極を用い、かつ個別パス毎に電流制御しながらめっきを行う。 - 特許庁

To provide a new tin-silver alloy plating bath for rackless plating with which a tin-silver plating film having a stable composition little changing with a change in current density can be formed when fine parts are subjected to tin-silver alloy plating treatment in bulk collectively by a rackless system, and various problems occurring when the conventional tin-silver plating bath is used can be solved.例文帳に追加

ラックレス方式によって微小部品を大量に一括してスズ−銀合金めっき処理する際に、電流密度変化に伴うめっき皮膜組成の変化が非常に少なく安定した組成のスズ−銀合金めっき皮膜を形成でき、しかも、従来のスズ−銀めっき浴を用いる場合の各種の問題点を解消できる新規なラックレスめっき用スズ−銀合金めっき浴を提供する。 - 特許庁

In order to locate the recess on the side of the metal wiring layer, after the current density of an intermediate process is made lower than a current density of before/after process to form a plating layer of a fine metal crystal when depositing the metal wiring layer by plating, the recess can be obtained by carrying out an etching treatment.例文帳に追加

金属配線層の側面に窪みを設けるには、金属配線層をメッキにより析出させるに際して、中間工程の電流密度を前後の工程の電流密度よりも低くして微細金属結晶のメッキ層とした後、エッチング処理を行うことにより得られる。 - 特許庁

By flowing such a comparatively large current, concentration of a welding current takes place successively on projections of small contact resistance among a plurality of projections, melting metallic plating layers (Ag and Cu plating layers) at the tip end contact part of the projections and exposing the base metal (Fe plate).例文帳に追加

このような比較的大電流を流すことにより、複数の突起部のうち、接触抵抗の小さい突起に順次、溶接電流の集中が起こり、突起部の先端接触部の金属めっき被覆層（Ａｇめっき層とＣｕめっき層）が溶融して金属母材（Ｆｅ板）が露出する。 - 特許庁

(2) In the electroplating process, an average cathode current density of all plating baths is controlled within 1-3 A/dm^2 and a ratio of maximum value to minimum value of the cathode current density in each plating bath is controlled within 1-5, and further a film carrying speed is adjusted within 80-300 m/h.例文帳に追加

（２）前記電気めっき工程において、全めっき槽の平均陰極電流密度を１〜３Ａ／ｄｍ^２に、及び各めっき槽内での陰極電流密度の最小値に対する最大値の比を１〜５に制御するとともに、フィルムの搬送速度は、８０〜３００ｍ／ｈに調整する。 - 特許庁

At this time, the relations between the amounts of feeding the conductive media 40 and the energizing current values, the thicknesses of the plating films, etc., are previously determined and from these relations, the amounts of feeding the conductive media and energizing current values necessary for obtaining the thicknesses etc., of the desired plating films are determined.例文帳に追加

このとき、予め、導電性メディア４０の投入量および通電電流値とめっき被膜の厚みなどとの関係を求めておき、これらの関係から、所望のめっき被膜の厚みなどを得るために必要な導電性メディア投入量および通電電流値を決定する。 - 特許庁

To provide an electroplating device capable of increasing the supply of a plating liquid to the surface of a substrate to cope with high current density and obtaining thick and uniform plating film thickness in a short time.例文帳に追加

基板表面へのめっき液の供給を増加できて高電流密度に対応でき、短時間で厚く均一なめっき膜厚が得られる電解めっき装置及び電解めっき方法を提供すること。 - 特許庁

In the method, tin-zinc alloy electroplating is performed under the conditions where the temperature of a plating liquid is 30 to 90°C, the stirring rate of the plating liquid is 5 to 300 m/min, and cathode current density is 5 to 200 A/dm^2.例文帳に追加

本発明は、めっき液温度：３０〜９０℃、めっき液の攪拌速度：５〜３００ｍ／ｍｉｎ及び陰極電流密度：５〜２００Ａ／ｄｍ^2の条件下で錫−亜鉛合金電気めっきを行う方法を提供する。 - 特許庁

To provide a tin- and copper-containing plating bath which hardly gives rise to substitution deposition of copper to a tin anode, is low in the dependence of a plating film composition on current density, is good in bath stability and hardly gives rise to clouding.例文帳に追加

スズ陽極への銅の置換析出が生じ難く、メッキ皮膜組成の電流密度依存性が低く、浴安定性が良好で濁りが生じ難い、スズ及び銅を含有するメッキ浴を提供する。 - 特許庁

To provide a plating device where the passivation of an anode electrode can be prevented, and the reduction of current efficiency and the reduction of the film deposition rate in a plating film can be prevented; and to provide a method for producing a semiconductor device.例文帳に追加

アノード電極の不動態化を防止することができ、電流効率の低下およびめっき皮膜の成膜速度の低下を防止することができるめっき装置および半導体装置の製造方法を提供する。 - 特許庁

The electrode for the non-aqueous electrolyte secondary battery is obtained by filling a positive electrode active material in a current collector which is obtained by laminating a nickel plating layer and a chrome plating layer in order on a porous non-woven fabric.例文帳に追加

多孔質不織布にニッケルめっき層及びクロムめっき層を順次積層して得られる集電体に、正極活物質を充填することにより得られる、ことを特徴とする非水電解質二次電池用正極。 - 特許庁

The deposit height measuring instrument includes current applying electrodes 11, 12 for applying a current within a plating bath and voltage measuring electrodes 21, 22 for measuring the voltage generated by the applied current; and estimates the deposition height of the deposits precipitated within the plating bath based on the voltage value measured between the voltage measuring electrodes 21, 22.例文帳に追加

堆積物高さ測定装置は、めっき浴内に電流を印加する電流印加用電極１１，１２と、その印加された電流によって発生する電圧を測定する電圧測定用電極２１，２２とを備え、電圧測定用電極２１，２２間で測定される電圧値に基づいて、めっき浴内に沈殿する堆積物の堆積高さを推定する。 - 特許庁

In a step of forming the plating film (for instance, an Ni film) on a surface of an electrode pad 7a by an electrolytic plating method, a first layer 12a is formed on the surface of the electrode pad 7a at a first current density, and thereafter a second layer 12b is formed on a surface of the first layer at a second current density higher than the first current density.例文帳に追加

電極パッド７ａの表面に電解メッキ法でメッキ膜（例えばＮｉ膜）を形成する工程において、前記電極パッド７ａの表面に第１の電流密度で第１の層１２ａを形成し、その後、前記第１の層の表面に前記第１の電流密度よりも高い第２の電流密度で第２の層１２ｂを形成する。 - 特許庁

To solve the problem where a current density is dispersed during welding due to buzzer terminals (solder plating) being flat with the weld faces of battery terminals, whereby welding strength cannot be obtained.例文帳に追加

ブザー端子（半田メッキ）と電池端子の溶接面が平坦のため溶接時に電流密度が分散し溶接強度が得られない。 - 特許庁