「reliability coefficient」に関連した英語例文の一覧と使い方(3ページ目) - Weblio英語例文検索

To provide a resin composition for a solder resist having a low coefficient of linear expansion for a compact and thin high-density circuit board, excellent in the reliability of heat resistance, heat impact shock resistance and moisture resistance, and capable of drilling a fine opening by laser irradiation.例文帳に追加

小型薄型化・高密度化回路基板に対して、低線膨張率を有し、耐熱性、熱衝撃性、耐湿性の信頼性に優れる、レーザー照射により良好な微細開口可能なソルダーレジスト用樹脂組成物を提供する。 - 特許庁

To obtain a composite product having a large amount of shape freedom and a high reliability by bonding solidly heterogeneous materials of a resin having a specific linear coefficient of expansion and a metal subjected to a chemical or electrochemical surface treatment using a laser beam as a heat source.例文帳に追加

レーザ光を熱源として、化学的、電気化学的な表面処理を行った金属と特定の線膨張係数を有する樹脂の異種材同士を強固に接合し、形状の自由度が大きく、信頼性の高い複合製品を得る。 - 特許庁

To provide a vertical fitting female terminal capable of improving reliability by enhancing strength against prying force or the like and by surely preventing excessive deformation of an elastic deformation part, of reducing an elastic coefficient of the elastic deformation part and of enhancing blanking efficiency.例文帳に追加

こじり力等に対する強度を高め、弾性変形部分の過変形を確実に防止して信頼性を向上させ、弾性変形部分の弾性係数を小さくでき、板取効率を高めることができる垂直嵌合雌端子を提供する。 - 特許庁

To provide a mechanical seal having excellent durability and reliability by suppressing increase of a friction coefficient even in severe environment, such as a condition without a sufficient lubricating liquid over a sliding part of a static sealing ring made of an SiC sliding material, or a dry condition.例文帳に追加

ＳｉＣ摺動材製静止密封環の摺動部に十分潤滑液が回り込まない状況やドライ状況等の厳しい環境下でも、摩擦係数が高くなることを抑制して耐久性や信頼性に優れるメカニカルシールを提供する。 - 特許庁

To provide a glass-ceramic sintered compact having a thermal expansion coefficient and a dielectric constant higher than those of alumina and a multilayer circuit board excellent in the mounting reliability for an outer circuit board using the glass-ceramic sintered compact as a layer having a high dielectric constant.例文帳に追加

アルミナよりも高い熱膨張係数および高誘電率を有するガラスセラミック焼結体、およびこのガラスセラミック焼結体を高誘電率層とし、外部回路基板への実装信頼性に優れた多層配線基板を提供する。 - 特許庁

To prevent the peeling of joined portions between an electrode pad and a stud bump and between the stud bump and an inner lead even if external stress caused by a difference of a thermal expansion coefficient is exerted on the joined portions, and to improve reliability.例文帳に追加

熱膨脹係数の差による外的応力が電極パッドとスタッドバンプとの接合部分及びスタッドバンプとインナーリードとの接合部に加わっても、その接合部分の剥れを防止することができ、信頼性を向上させることができる。 - 特許庁

To provide a compressor with improved wear resistance and high reliability for a refrigerating device having a refrigerant mainly composed of hydrofluoroolefin containing no chlorine atom and having a carbon-carbon double bond with low global warming coefficient.例文帳に追加

塩素原子を含まず地球温暖化係数の低い炭素と炭素間に２重結合を有するハイドロフルオロオレフィンを主体とした冷媒とした冷凍装置の圧縮機において、耐摩耗性を向上し信頼性の高い圧縮機を提供すること。 - 特許庁

To improve initial characteristics and the reliability of long-period operation by solving the problem of material deformation due to differences in coefficient of thermal expansion, hardness, etc., between metal for wiring and an insulating film around it, the problem of holing in a wire.例文帳に追加

配線用金属とその周囲の絶縁膜との熱膨張係数、硬度等の違いによる材料変形の問題、配線内に空孔が発生するという問題等の解決を図り、初期特性や長期動作の信頼性の改善を図る。 - 特許庁

To provide a method for processing a polymeric positive temperature coefficient (PPTC) conductive material having uniformly dispersed conductive particles, capable of decreasing contact resistance between an electrode and the conductive material and capable of increasing a lifetime and reliability of the material.例文帳に追加

電極と伝導性物質との間の接触抵抗を減少させ、ならびに寿命および信頼性を増加させるような、均一に分配された伝導性粒子を有するポリマー性で正の温度係数の（ＰＰＴＣ）伝導性物質をプロセスすること。 - 特許庁

To provide a glass composition from which a display panel having a high reliability can be produced and which is free of poisonous lead and has a low dielectric constant, a low softening point, a high glass transition point, a good matching of a thermal expansion coefficient with a substrate, and high water resistance.例文帳に追加

有害な鉛を含まず、誘電率が低く、軟化点が低く、ガラス転移点が高く、基板との熱膨張係数のマッチングが良く、耐水性の高い、信頼性の高いディスプレイパネルを作製可能とするガラス組成物を提供する。 - 特許庁

In this case, the bonding reliability between the base board 1 and the silicon substrate 3 of the semiconductor component 2 can be improved in a temperature cycle test because of the same thermal expansion coefficient of the base board 1 and the silicon substrate 3 of the semiconductor component 3.例文帳に追加

この場合、ベース板１と半導体構成体３のシリコン基板３との熱膨張係数が同一であり、温度サイクル試験を行なっても、ベース板１と半導体構成体２のシリコン基板３との接合の信頼性を向上することができる。 - 特許庁

To provide an epoxy resin composition usable for formation of an optical waveguide used in photo transportation and also advantageously usable as a sealing agent for a photo receiving/emitting element, wherein reliability of a temperature cycling property etc. is increased by reducing CTE (coefficient of thermal expansion) with maintaining transparency.例文帳に追加

透明性を維持したままＣＴＥを低減して温度サイクル性等の信頼性が向上した、光伝送に用いられる光導波路の形成や受発光素子用封止材として好適に用いられるエポキシ樹脂組成物を提供する。 - 特許庁

To provide a technique for suppressing degradation in reliability of a semiconductor device due to damage of solder by preventing the damage of the solder caused by thermal deformation generated on a solder junction of a lead due to difference in linear expansion coefficient between the semiconductor device and a mounting substrate.例文帳に追加

半導体装置と実装基板の線膨張係数差によりリードのはんだ接合部に発生する熱ひずみに起因したはんだの損傷を抑制し、それによる半導体装置の信頼性低下を抑制する技術を提供する。 - 特許庁

To provide the semiconductor device of structure where stress due to the difference of a thermal expansion coefficient between a semiconductor element and a circuit board and the mechanical deformation of the circuit board can securely be relieved and connection reliability between the semiconductor device and the circuit board is superior.例文帳に追加

半導体素子と回路基板の熱膨張率の相違、および回路基板の機械的変形に起因した応力を確実に緩和し、半導体装置と回路基板との接続信頼性に優れた構造の半導体装置を提供する。 - 特許庁

To provide a lubricant which can achieve any of: an effect which can keep a friction coefficient of magnetic recording medium face low; an effect which can reduce evaporation of the lubricant; an effect which can suppress migration of the lubricant by rotation of disk; or an effect which can enhance reliability, especially long-term reliability of the magnetic recording medium by suppressing intrusion of a volatile organic substance or the like.例文帳に追加

磁気記録媒体面の摩擦係数を低く保つことができる、潤滑剤の蒸発を少なくできる、ディスクの回転による潤滑剤のマイグレーションを抑制することができる、揮発性有機物の侵入を抑えて、磁気記録媒体の信頼性、特に長期信頼性、を向上させることができる等の効果のいずれかを実現することができる潤滑剤を提供する。 - 特許庁

To provide a wiring board effectively absorbing stress even when the stress caused by difference of a thermal expansion coefficient between an electronic component to be mounted thereon and itself to improve connection reliability, thereby substantially eliminating warpage of the board after mounting, and contributing to cost reduction.例文帳に追加

実装する電子部品との間に熱膨張係数の違いに起因した応力が発生した場合でもその応力を有効に吸収し、接続信頼性の向上を図ると共に、実装後の基板の反りを実質的に無くし、コスト低減に寄与すること。 - 特許庁

To provide an earthquake-resistant manhole protective construction method capable of slippage and preventing stress of a connecting part even in an earthquake more than a specified seismic coefficient, setting the conventional connecting part of a product and product strength as they are and economy reliability of which are greatly expectative.例文帳に追加

一定の震度以上の時にも接合部のズレ及び応力の分散を図れ、製品の接合部、製品強度は従来のまゝ設置することが可能となる経済性、信頼性が大いに期待し得る地震対応マンホール保護工法を提供する。 - 特許庁

To provide a positive displacement expansion machine of a simple construction excellent in reliability/assembly characteristics and a positive displacement fluid machine with a refrigeration system having an enhanced COP (coefficient of performance) by efficiently converting expansion energy into mechanical energy.例文帳に追加

構造が簡単で、信頼性・組立性に優れた低コストの容積形膨張機の提供と膨張エネルギを機械エネルギに効率よく変換し、冷凍システムのＣＯＰ（成績係数）向上が可能な容積形流体機械（膨張／圧縮システム）の提供。 - 特許庁

To provide an athermal resin optical waveguide device which is provided with all of such properties of low cost, easy manufacturing, heat resistance, low propagation loss and long-term reliability, and is eliminated in temperature dependence by using fluorinated polyimide for the substrate and by controlling the coefficient of linear thermal expansion of the substrate.例文帳に追加

基板にフッ素化ポリイミドを使用し、その線熱膨張係数を制御することにより低コスト性、製作の容易性、耐熱性、低伝搬損失性、長期信頼性を兼ね備え、温度依存性を解消したアサーマル樹脂光導波路デバイスを提供する。 - 特許庁

To provide a circuit module having high connection reliability between a bare chip IC and a wiring board by making a thermal expansion coefficient of a filling resin between the bare chip IC and the wiring board in the vicinity of a bare chip IC protection film different from that in the vicinity of the wiring board.例文帳に追加

ベアチップＩＣと配線基板の間の充填樹脂の熱膨張係数をベアチップＩＣ保護膜近傍と配線基板近傍とで異なる状態とすることで、ベアチップＩＣと配線基板の接続信頼性の高い回路モジュールを提供する。 - 特許庁

To prevent degradation of light emitting efficiency and deterioration of reliability when a semiconductor light emitting element is further formed on a continuous film semiconductor layer formed so as to differ in the substrate, lattice constant, or thermal expansion coefficient, using a partial growth suppressing structure.例文帳に追加

部分的成長抑制構造を利用して、基板と格子定数または熱膨張係数が異なる連続膜半導体層を形成した上に、さらに半導体発光素子を形成する場合の発光効率の低下および信頼性の悪化を防止する。 - 特許庁

To reduce the manufacturing cost of a piezoelectric element and increase the reliability thereof by suppressing the occurrence of cracks in a piezoelectric thin film layer 16 when forming, on a substrate 11, the piezoelectric thin film layer 16 having a coefficient of linear expansion larger than that of the substrate 11.例文帳に追加

基板１１上に、該基板１１よりも線膨張係数が大きい圧電体薄膜層１６を形成する場合に、その圧電体薄膜層１６にクラックが生じるのを抑制して、圧電素子の製造コストを低減しつつ、その信頼性を向上させる。 - 特許庁

To provide an inkjet recording head which can perform image recording of a high quality for a long period of time and is high in reliability, by using a material which has a small coefficient of linear expansion and can be highly precisely patterned as a channel forming member in the liquid ejecting head.例文帳に追加

液体吐出ヘッドにおいて、流路形成部材として、線膨張係数が小さく、高精度のパターニングが可能な材料を用いることによって、長期にわたって高品位の画像記録が可能な信頼性の高いインクジェット記録ヘッドを提供する。 - 特許庁

Then, the stress caused by a difference in coefficient of thermal expansion between the printed board 1 and the LSI chip can be dispersed (relaxed) by the pump pad 11 and the solder ball 13, so the high reliability of the junction part can be ensured in the LSI chip mounting.例文帳に追加

従って、プリント基板１とＬＳＩチップとの熱膨張率差によって生じ得る応力をバンプ型パッド１１及び半田ボール１３により分散（緩和）することにより、ＬＳＩチップ実装の接合部における高信頼性を確保することができる。 - 特許庁

In shifting to the mode for improving the turning response, if the friction coefficient of a road surface is low, a road condition ahead of the vehicle 1 is slippery, or information on a road ahead is not good, entering in the mode is prohibited, to improve reliability.例文帳に追加

回頭性向上のモードに移行する際は、路面μが小さい場合、走行路前方の道路状態が滑りやすい場合、或いは前方道路情報が良好ではない場合は、このモードに入ることを禁止して制御の信頼性を向上する。 - 特許庁

To provide a method for producing a resin composition for use as the resin layer of wiring boards, good in filler dispersibility, low in coefficient of linear expansion and high in reliability, to provide the resultant resin composition, and to provide wiring boards using the resin composition.例文帳に追加

本発明は、配線基板の樹脂層に用いる樹脂組成物であって、フィラーの分散性が良好で線膨張率が低く、信頼性に優れた樹脂組成物の製造方法、及びそれにより得られる樹脂組成物、及びそれを用いた配線基板を提供する。 - 特許庁

To provide a power semiconductor module having superior heat radiation efficiency and high reliability without causing crack at a joint part, even when a stress due to difference of thermal expansion coefficient is applied to the joint part such as a heat radiation base 1, an insulating substrate 2 and a power semiconductor element 6, etc.例文帳に追加

放熱ベース１，絶縁基板２，パワー半導体素子６などの接合部に、熱膨張係数の相違による応力が印加されても、接合部にクラックを発生させることなく、放熱効率が良く信頼性の高いパワー半導体モジュールを提供すること。 - 特許庁

To provide a semiconductor device, etc., having bump gaps sealed with a resin so as to facilitate replacing works and an electronic circuit device, where stresses caused by the thermal expansion coefficient difference between a semiconductor chip and a mounting board can be relaxed to improve the connection reliability.例文帳に追加

交換作業が容易となるようにバンプの間隙部を樹脂で封止された半導体装置などにおいて、半導体チップと実装基板の熱膨張率差に起因するストレスを緩和して接続信頼性を向上することができる半導体装置と電子回路装置を提供する。 - 特許庁

To provide an air conditioner excellent in reliability which ensures the optimum air conditioning ability properly conformable to an air conditioning load having a large changing width, while solving a trouble in a compressor such as wear of sliding part, overheat of suction side, or reduction in coefficient of performance.例文帳に追加

圧縮機の摺動部の磨耗、圧縮機の吸込側の過熱、圧縮機の成績係数の低下などの不具合を解消しながら、大きな変化幅の空調負荷に適切に対応し得る最適な空調能力を確保できる信頼性にすぐれた空気調和機を提供する。 - 特許庁

Thereby, because a strong contact between the poppet and the sleeve 2 is prevented and an inner peripheral face 2a of the sleeve 2 is reinforced, seizure of the poppet and the sleeve 2 is prevented, and a coefficient of friction is reduced for improving operation accuracy and reliability of the gas flow control valve.例文帳に追加

これにより、ポペットとスリーブ２との強い接触が起こらなくなるとともにスリーブ２の内周面２ａが強化されるので、ポペットとスリーブ２との焼き付きを防止するとともに摩擦係数の低減を図ることができ、ガス流量制御弁の作動精度と信頼性が高められる。 - 特許庁

An evaluation part 58 evaluates the reliability of the temporary interference residue estimation signal e'n,m in specific timing, the temporary interference residue estimation signal e'n,m is multiplied by a weight coefficient α according to the evaluation result, and the resulting signal is outputted as an interference residue estimation signal en,m.例文帳に追加

仮干渉残差推定信号ｅ’_n,mの信頼性は評価部５８により所定タイミングで評価され、その評価結果に従って仮干渉残差推定信号ｅ’_n,mに重み係数αが乗算され、その信号が干渉残差推定信号ｅ_n,mとして出力される。 - 特許庁

To provide an inexpensive, simple and high-reliability constitution, including a leakage detection IC in addition to a function as a conventional insulation monitoring device, wherein a conventional leakage relay device is integrated with the conventional insulation monitoring device to form an inexpensive and simple constitution, and each output characteristic coefficient is used in common.例文帳に追加

従来の絶縁監視装置としての機能の他に、漏電検出用ＩＣを備え、従来の漏電リレー装置と従来の絶縁監視装置を一体化して安価で簡単な構成とし、出力特性係数を共用し、安価で簡単で、より信頼性の高い構成とする。 - 特許庁

The image quality improvement method is characterized in calculating an amount of correction noise on the basis of an amount of noise estimated relative to each of at least two or more resolution levels and a reliability of the noise amount estimation, and transforming the intensity of a decomposition coefficient obtained by multi-resolution decomposition using the correction noise amount.例文帳に追加

少なくとも二つ以上の解像度レベルの各々に対して推定したノイズ量およびノイズ量推定の信頼度に基づいて補正ノイズ量を算出し、前記補正ノイズ量を用いて多重解像度分解処理により得られた分解係数に対して強度変換を行う。 - 特許庁

To provide a mechanical seal excellent in durability or reliability, by lessening or solving inconvenience of increasing a friction coefficient even in severe environment such as a condition of insufficient lubrication of a sliding part with lubricating liquid or a dry condition, although the mechanical seal has a static seal ring made of an SiC sliding member.例文帳に追加

ＳｉＣ摺動材製の静止密封環を持ちながら、摺動部に十分な潤滑液が回り込まない状況やドライ状況といった厳しい環境下においても、摩擦係数が高くなる不都合を抑制又は解消して、耐久性や信頼性に優れるメカニカルシールを提供する。 - 特許庁

To provide a wiring board which can be burned at ≤1,000°C, and in which a wiring layer containing low resistance metal can simultaneously be formed by burning, and which has a thermal expansion coefficient suitable for the packaging of GaAs chips, and a low Young's modulus, and ensures the long term reliability of connecting pats can.例文帳に追加

１０００℃以下で焼成可能で、低抵抗金属を含有する配線層を同時焼成にて形成することができ、ＧａＡｓチップの実装に適した熱膨張係数を有し、ヤング率が低く、接続部の長期信頼性が確保できる配線基板を提供する。 - 特許庁

To provide an epoxy resin composition for molding a multi-chip package, having excellent molding properties and reliability through enhancing adhering force, lowering a moisture-absorbing ratio and a thermal expansion coefficient and improving mechanical elasticity, together with suppressing generation of voids at molding the multi-chip package.例文帳に追加

付着力を向上し、吸湿率及び熱膨張係数を低減し、機械的弾性を向上させると共に、マルチチップパッケージ成形の際に発生するボイド(Void)の発生を抑制することによって、成形特性及び信頼性に優れたマルチチップパッケージ成形用エポキシ樹脂組成物の提供。 - 特許庁

This image quality improvement method is characterized in calculating an amount of correction noise based on an amount of noise estimated relative to each of at least two or more resolution levels and a reliability of the noise amount estimation (S103) and transforming the intensity of a decomposition coefficient obtained by multi-resolution decomposition using the correction noise amount.例文帳に追加

少なくとも二つ以上の解像度レベルの各々に対して推定したノイズ量およびノイズ量推定の信頼度に基づいて補正ノイズ量を算出し、前記補正ノイズ量を用いて多重解像度分解処理により得られた分解係数に対して強度変換を行う。 - 特許庁

To provide a glass plate for a solar cell having 60-100×10^-7/°C thermal expansion coefficient, high strain point and small alkali metal oxide content to improve the reliability or the characteristics of the solar cell and to reduce the manufacture cost of the solar cell.例文帳に追加

６０〜１００×１０^−７／℃の熱膨張係数を有するとともに、歪点が高く、且つアルカリ金属酸化物の含有量が少ない太陽電池用ガラス板を創案することにより、太陽電池の信頼性や特性を高めつつ、太陽電池の製造コストを低廉化すること。 - 特許庁

To provide a seal ring for a mechanical seal made of an SiC sliding member excellent in durability and reliability, by lessening or solving inconvenience of increasing a friction coefficient even in severe environment such as a condition of insufficient lubrication of a sliding part with lubricating liquid or a dry condition.例文帳に追加

摺動部に十分な潤滑液が回り込まない状況やドライ状況といった厳しい環境下においても、摩擦係数が高くなる不都合を抑制又は解消して、耐久性や信頼性に優れるＳｉＣ摺動材製のメカニカルシール用密封環を実現させる。 - 特許庁

The organic EL displays having high reliability are manufactured by creating a sealing material for the organic EL displays, which is suitable for local heating by an irradiation light such as laser light, and has low softening property, high water resistance, and a low coefficient of thermal expansion.例文帳に追加

レーザー光等の照射光による局所加熱に好適であるとともに、低軟化特性と高耐水性を有し、しかも熱膨張係数が低い有機ＥＬディスプレイ用封着材料を創案することにより、信頼性が高い有機ＥＬディスプレイを作製すること。 - 特許庁

To provide a semiconductor device with excellent connecting reliability by having a cushioning material which absorbs the difference of the coefficient of thermal expansion between a semiconductor element and a package substrate, even when an organic material is used as a packaging substrate in the semiconductor package structure.例文帳に追加

本発明は半導体パッケージ構造において、実装基板として有機材料を用いた場合も、実装基板と半導体素子の熱膨張率差を吸収する緩衝体を有することにより優れた接続信頼性をもつ半導体装置を提供することを目的とする。 - 特許庁

To provide a method of manufacturing a laminated piezoelectric device whose conductivity of an external electrode layer formed of an external electrode material is high and coefficient of linear expansion of it is low, and which has superior conductivity and reliability, and to provide an applying device of the external electrode material.例文帳に追加

外部電極材料により形成した外部電極層の導電性が高いと共に線膨張係数が低く、優れた導電性・信頼性を有する積層型圧電体素子の製造方法及び外部電極材料の塗布装置を提供しようとするものである。 - 特許庁

A cyclic coefficient setting section 133 sets cyclic coefficients KA, KB for each of pixels of an image P1 of a progressive system obtained by IP-converting an image I1, on the basis of a fact that the pixels are positioned in the image I1 before IP conversion, the size of a vertical motion movement, and the reliability of the motion vector.例文帳に追加

巡回係数設定部１３３は、画像I1をIP変換したプログレッシブ方式の画像P1の各画素に対して、IP変換前の画像I1に存在する位置にある画素か否か、垂直動き量の大きさ、および、動きベクトルの信頼度に基づいて、巡回係数KA、KBを設定する。 - 特許庁

To provide a high-density mounting printed circuit board which is optimum for rapid high density mounting and having heat resistance, low permittivity, low water absorption ratio, low thermal expansion coefficient, high adhesive properties of conductors and insulating films to each other, superior film strength, elongation percentage at breakage and reliability durable against stresses in semiconductor device mounting.例文帳に追加

耐熱性、低誘電率、低吸水率、低熱膨張率、導体や絶縁膜相互の高密着性、優れた膜強度や破断伸び率、半導体デバイス実装における応力にも耐え、信頼性を有し、高速、高密度実装に最適な高密度実装用配線基板を提供する。 - 特許庁

To obtain a dense sintered composite material having high thermal conductivity, high in mechanical properties, particularly in toughness, having reliability even under an environment with a heat cycle, vibration, or the like, moreover excellent in workability and small in a thermal expansion coefficient and to provide a method for producing the same.例文帳に追加

緻密かつ機械的性質、特に靭性が大きく、熱サイクルや振動が加わるなどの環境下にあっても信頼性があり、さらには被加工性に優れた熱膨張係数の小さい高熱伝導性の焼結複合材料及びその製造方法を得ること。 - 特許庁