「Conduction」に関連した英語例文の一覧と使い方(147ページ目) - Weblio英語例文検索

To improve the manufacturing yield of a highly thin and thin-machined thin-film transistor device by reliably pattern-forming a metal film on an insulating substrate for preventing wiring failure by short-circuiting between wiring, or preventing the conduction failure due to the remainder of patterns at the contract part of a conductor layer.例文帳に追加

絶縁性基板上にて金属膜を確実にパターン形成して、配線間のショートによる配線不良を防止し、あるいは半導体層のコンタクト部のパターン残りによる導通不良を防止して、高精細、微細加工の薄膜トランジスタ装置の製造歩留まりを向上する。 - 特許庁

To make the control of current conduction to a heating resistor performable with a high precision by compensating the difference between fed voltage to the heating resistor which is the reference for control and/or the resistance value of the heating resistor and the actually fed voltage to the heating resistor and/or the resistance value of the heating resistor.例文帳に追加

制御基準となる発熱抵抗体への給電電圧又は／及び発熱抵抗体の抵抗値と、実際の発熱抵抗体への給電電圧又は／及び発熱抵抗体の抵抗値との差を補正して、発熱抵抗体への通電制御を高精度に行えるようにする。 - 特許庁

While heating the metal film 3 and thereby heating the infrared transmission substrate 2 through heat conduction, an n-type buffer layer 21, an n-type clad layer 22, an active layer 23, a p-type clad layer 24 and a p-type contact layer 25 are formed by epitaxial growth, on the other side of the infrared transmission substrate 2.例文帳に追加

金属膜３を加熱し、それによって、熱伝導で赤外線透過基板２を加熱しながら、赤外線透過基板２の他方の面に、エピタキシャル成長により、ｎ型バッファ層２１、ｎ型クラッド層２２、活性層２３、ｐ型クラッド層２４およびｐ型コンタクト層２５を形成する。 - 特許庁

By design for sandwiching the magnetic poles 103 of the permanent magnet, by using the magnetic poles excited by the conduction winding 100, the magnetic poles 103 of the permanent magnet can be prevented from falling off, and magnetic force can be prevented from becoming weak due to the inverse reverse excitation during the operation of the electric machinery.例文帳に追加

通電巻線１００により励磁される磁極によって永久磁石の磁極１０３を挟む設計によって、永久磁石の磁極１０３は振動により脱落することが避けられ、及び電機作動中に、逆方向励磁により磁力が弱くなることが避けられる。 - 特許庁

Consequently, since the fitting part of the boss part 17B and the drive shaft 31 can be efficiently cooled from inside and section area thereof can be made small at positions of each cooling air passage 5, 26, 41, heat conduction from the boss part 17B to the drive shaft 31 can be suppressed.例文帳に追加

これにより、ボス部１７Ｂと駆動軸３１との嵌合部位を内側から効率よく冷却でき、これらの横断面積を各冷却風通路２５，２６，４１の位置で小さくすることができるので、ボス部１７Ｂから駆動軸３１への熱伝導を抑えることができる。 - 特許庁

To ease designing of a semiconductor chip circuit and operate a semiconductor device normally and stably by controlling the conduction direction of heat which is generated when a plurality of semiconductor chips and circuits mounted in one semiconductor device are operated, and by suppressing mutual influence of the heat.例文帳に追加

１つの半導体装置内に搭載された複数の半導体チップおよび回路の、動作時に発生する熱の伝導方向を制御し、相互に熱の影響を抑制することにより、半導体チップの回路設計を容易にし、また、半導体装置を正常かつ安定に動作させる。 - 特許庁

This solves the problem that the data written in a conventional MFIS transistor vanishes within a day or a little longer mainly because large leakage current from the buffer layer and the ferroelectric prevents electric polarization of the ferroelectric from controlling electric conduction between the source drains of transistors in which electric charges are accumulated around an interface between the ferroelectric and the buffer layer so that they shield electric polarization stored in the ferroelectric.例文帳に追加

本願発明においては、絶縁体バッファ層２をHfO_2+uあるいはHf_1-xAl_2xO_2+x+yで構成することにより、絶縁体バッファ層２と強誘電体３の両方のリーク電流を低く押さえることができ、データ保持時間が真に充分長いメモリトランジスタが実現する。 - 特許庁

To solve the problem wherein disconnection failures are hard to determine, due to an AC detection signal propagated in the capacity coupled state of a disconnected part, if it is in a state of disconnection very close to the cut surfaces of a conduction pattern in an inspection device for inspecting the conductive pattern by a non-contact sensor, using the AC inspection signal.例文帳に追加

交流の検査信号を用いる非接触センサにより導電パターンを検査する検査装置は、導電パターンの切断面同士が極近接して断線であれば、交流の検出信号は断線部分を容量結合した状態で伝搬され、断線不良が判断しづらい。 - 特許庁

A premixed gas flow channel 8 supplying a premixed gas of a fuel gas and an oxidant gas to a combustion chamber 7 and a microcombustor 3 constituted by partitioning a combustion bas flow channel 9 discharging a combustion gas flowing out from the combustion chamber 7 outside of a machine by a heat conduction wall 10 are arranged in the container.例文帳に追加

燃料ガスと酸化剤ガスの予混合ガスを燃焼室７に供給する予混合ガス流路８と、前記燃焼室７から流出する燃焼ガスを機外に排出する燃焼ガス流路９が伝熱壁１０で仕切られて成るマイクロコンバスタ３を設ける。 - 特許庁

To enable an operator/driver/visually handicapped person to perform groping operations by using a sense of hearing, a sensor is provided on the surface of the keybutton and, when the finger or hand of the operator touches the keybutton (when the key button is not depressed yet), name of each keybutton is voiced by using conduction or signals.例文帳に追加

操作者／運転者／視覚障害者、等が聴覚による手探り操作を可能とするため、キーボタン表面にセンサーを設け、操作者の指や手がキーボタンに触れた時（この時、キーボタンはまだ押されない）、導通あるいは信号を用いて、各キーボタン名称の音声を発生させる。 - 特許庁

In a process, where a heating/pressing tool 5 approaches a semiconductor element 1 being locked tentatively for pressing, heat-shielding sections 24a, 24b are interposed between packaging components 1b, 1c adjacent to the semiconductor element 1, and heat conduction from the heating/pressing tool 5 to the packaging components 1b, 1c is shielded for packaging.例文帳に追加

加熱加圧ツール５が仮止め中の半導体素子１に近接して押圧する工程では、半導体素子１に隣接する実装部品１ｂ，１ｃとの間に熱遮蔽部２４ａ，２４ｂを介装して加熱加圧ツール５から前記実装部品１ｂ，１ｃへの熱伝導を遮蔽して実装する。 - 特許庁

Even when the power supply voltage of the circuit is a high voltage of 100 V or more, only such a low voltage as an extent of the voltage between terminals of the LEDs 1-8 which are the light emitting element A or the conduction voltage of the transistor Q1 is applied on the on/off circuit E incorporated in the pilot light.例文帳に追加

このため、回路の電源電圧が１００Ｖ以上の高い電圧であっても、本発明の表示灯に内蔵された点滅回路Ｅには、発光体素子ＡであるＬＥＤ（１−８）の端子間電圧またはトランジスタＱ１の導通電圧程度の低い電圧しか印加されない。 - 特許庁

A spring plate material 35 which supports an operating rod 20 in a case 10 and elastically deforms by action of a pressing force, a center electrode 31 which reaches a conduction state by contacting the spring plate material 35 at the elastic deformation of this spring plate material 35, and a ring electrode 32 are arranged at a position surrounding the operating rod 20.例文帳に追加

ケース１０に操作ロッド２０を支持し、押圧力の作用で弾性変形するバネ板材３５と、このバネ板材３５の弾性変形時にバネ板材３５との接触によって導通状態に達するセンター電極３１と、リング電極３２とを操作ロッド２０を取り囲む位置に配置する。 - 特許庁

The thermal conduction layer 22 is composed of an insulation board 24, a first joining material 26 including an active element for joining the insulation board 24 on the heat sink material 20, a second joining material 28 formed on the insulation board 24, and an electrode 30 formed on the second joining material 28.例文帳に追加

熱伝導層２２は、絶縁基板２４と、該絶縁基板２４をヒートシンク材２０に接合するための活性元素を含む第１の接合材２６と、前記絶縁基板２４上に形成された第２の接合材２８と、該第２の接合材２８上に形成された電極３０とから構成される。 - 特許庁

After an insulating film of the lower part of the external base polycrystalline silicon is etched to form a recess, a polycrystalline silicon layer doped with the impurity of the second conduction type is formed, and then etched back to leave the polycrystalline silicon only in the recess, thus obtainable the bipolar transistor.例文帳に追加

外部ベース多結晶シリコンの下部の絶縁膜をエッチングして窪みを作った後、第２導電型不純物をドープした多結晶シリコン層を形成し、エッチバックして窪み内にのみ第２導電型不純物をドープした多結晶シリコを残すことにより得られる。 - 特許庁

The optical component contains a first region which has water repellency and a second region which is provided in contact with the first region and has water repellency lower than that of the first region and further the optical component has a transmission section with light transmissivity and an electric conduction section for conducting electricity in the second region.例文帳に追加

撥水性を有する第１領域と、前記第１領域に接して備えられ前記第１領域よりも撥水性が低い第２領域とを含み、光透過性を有する透過部と、前記第２領域の電気を導通させる電気導通部とを有する光学部品。 - 特許庁

It is provided with a rack-and-pinion mechanism 20 as a mechanism for converting rotation of an elevating motor 19 into the straight line movement of the first and second unit movable members of the straight line movement supporting mechanism 9, and the contact conduction section of the pinion 22 and the rack 23 is positioned nearer to the lower end of the arm 4.例文帳に追加

また、昇降用モータ１９の回転を直線移動支持機構９の第１，第２の単位可動部材１４，１５を直線移動に変換させるための機構をラック・ピニオン機構２０とし、そのピニオン２２とラック２３との接触伝導部分をアーム４の下端寄りに位置させる。 - 特許庁

A rectifying current, which imparts large differences to capacitances in rectifying current paths during the commercial AC power is inverted in positive/negative polarities and concurrently flows each of the rectifying current paths, is divided into two in terms of time, and an conduction angle of the rectifying current is increased, thus improving the power factor.例文帳に追加

商用交流電源が正／負極性となる期間、それぞれの整流電流経路における静電容量に大きな差を与える、整流電流経路に同時に流れる整流電流を時間的に二分し、整流電流の導通角を拡大し、力率改善を図る。 - 特許庁

To provide a magnetic core which is used as a countermeasure against conduction noises and effective in reducing noises in a comparatively low-frequency domain such as 150 kHz or so and an electric cord wire which has magnetic characteristics to reduce noises of 150 kHz or so by the use of the above magnetic core.例文帳に追加

１５０ｋＨｚ付近の比較的低周波領域でもノイズ低減に効果のある伝導ノイズ対策用の磁性体コア及びこの磁性体コアを使用して１５０ｋＨｚ付近でノイズ低減に影響する磁気特性を持つ電気コード線の提供を目的とする。 - 特許庁

To achieve a wound component with substantially high reliability by simultaneously solving all problems of wire break caused by application of an external force to a terminal, wire disconnections caused by solder dip heat, improvement in reliability of the contact conduction of a terminal with a winding, improvement in workability in process for binding a winding end and the like.例文帳に追加

端子への外力印加に伴う断線、半田ディップ熱による断線、及び端子と巻線線材との接触導通の信頼性向上、巻線端末絡げ処理の作業性改善などの問題を全て同時に解決でき、本質的に信頼性の高い巻線部品を実現する。 - 特許庁

The image forming apparatus includes a ground terminal 61 disposed in contact with the heat roller 52 and connected electrically, via a ground path 63, with respect to a housing frame 70 provided for a ground potential; and a ground check circuit 72 that checks the electrical conduction between the ground terminal 61 and heat roller 52.例文帳に追加

ヒートローラ５２に接触するように構成されるとともに、アース電位の筐体フレーム７０に対しアース路６３を介して電気的に接続されているアース端子６１と、前記アース端子６１と前記ヒートローラ５２との間の電気的な導通をチェックするアースチェック回路７２と、を備える。 - 特許庁

To provide a circuit structure which can improve an efficiency of a DC-DC converter by reducing the conduction loss (on loss) of a synchronous rectification switch, in the DC-DC converter for supplying electric power to electronic circuits requiring a low operation voltage in particular for an LSI such as a micro-processor or the like.例文帳に追加

マイクロプロセッサ等ＬＳＩの特に低い動作電圧を必要とする電子回路に電力を供給するためのＤＣ−ＤＣコンバータにおいて、同期整流スイッチの導通損失（オン損失）を低減し、ＤＣ−ＤＣコンバータの効率向上が図れる回路構成を提供する。 - 特許庁

The connection of a first substrate with a second substrate is performed by an anisotropic conduction sheet 5 which includes laminating: a first resin 3 which does not contain conductive particles 6; and a second resin 4 which contains the conductive particles 6 and has a higher curing temperature than that of the first resin 3 and has a smaller shape than that of the first resin 3.例文帳に追加

導電粒子６を含まない第１樹脂３と、導電粒子６を含み、第１樹脂３よりも硬化温度が高く且つ第１樹脂３より小さい形状の第２樹脂４とを積層してなる異方性導電シート５にて第１基板と第２基板の接続を行う。 - 特許庁

An electrical connection part 30a1 made electrically conductive by the contact with the media 52 or the material 50 to be plated and an insulated part 30b1 formed between the electrical connection part 30a1 and the mesh 24 and causing no electrical conduction are formed on the head part 30a of the cathode electrode 30.例文帳に追加

カソード電極の頭部３０ａには、メディア５２または被めっき物５０が接触して電気的導通可能な可能な電気接続部分３０ａ１と、電気接続部分３０ａ１とメッシュ２４との間に形成され電気的導通が生じない絶縁部分３０ｂ１と、が形成されている。 - 特許庁

A heat conduction member 100 is disposed, to adhere close to a heat dissipating device for transmitting heat generated when the heat dissipating device is operated, to a cooling part side, and has a graphite sheet 200; and a diamond-like carbon thin film 300 having electrical insulating properties, formed on the surface of the graphite sheet 200.例文帳に追加

発熱素子に密着して配置され、発熱素子が動作時に発生する熱を冷却部側へ伝達するための熱伝導部材１００であり、グラファイトシート２００と、グラファイトシート２００の表面に形成された電気絶縁性のダイヤモンドライクカーボン薄膜３００を有する。 - 特許庁

The connector comprises an insulating substrate 20 interposed between a circuit board 1 and a semiconductor package 10, and a plurality of conductive contact elements 22 penetrated and supported by being arranged in a row in the XY direction of the insulating substrate 20, conduction capably and elastically contacting with the circuit board 1, and the electrodes 2, 11 of the semiconductor package 10.例文帳に追加

回路基板１と半導体パッケージ１０の間に介在する絶縁基板２０と、絶縁基板２０のＸＹ方向に並べて貫通支持され、回路基板１と半導体パッケージ１０の電極２・１１に導通可能に弾接する複数の導電接点素子２２とを備える。 - 特許庁

The coil 6 comprises printed wiring 61 formed on both surfaces of a coil support stand 66, a through-hole 62 penetrating these both surfaces, and an electrical conduction passage formed continuously in a loop shape with a pin 63 that is inserted into this through hole 62 and is electrically connected with the printed wiring 61.例文帳に追加

このコイル６はコイル支持台６６の両面に形成したプリント配線６１と、この両面を貫通するスルーホール６２と、このスルーホール６２に挿入してプリント配線６１と電気的に接続するピン６３で連続的にループ状に構成された電導路とを備える。 - 特許庁

As a result, appropriate thermal and electric conduction is realized between the heat collecting substrate 1 and the high-temperature ends of the respective thermoelectric power generation elements N and P, and the generation of thermal stress between the electrode plate 5 and the high-temperature ends of the respective thermoelectric power generation elements N and P can be prevented in advance.例文帳に追加

その結果、集熱基板１から各熱電発電素子Ｎ，Ｐの高温端部への熱伝導および電気伝導が良好に行われるようになり、しかも、電極板５と各熱電発電素子Ｎ，Ｐの高温端部との間の熱応力の発生が未然に防止される。 - 特許庁

To provide an anisotropic conductive member in which installment density of a conduction path is improved, which can be used as an electrical connection member of electrical parts such as a semiconductor element, and a connector for inspection or the like even today further advanced in high integration, and which is superior in flexibility.例文帳に追加

導通路の設置密度を飛躍的に向上させ、高集積化が一層進んだ現在においても半導体素子等の電子部品の電気的接続部材や検査用コネクタ等として使用することができ、かつ、柔軟性に優れる異方導電性部材を提供する。 - 特許庁

This manufacturing method is designed to determine whether or not an oxide film 13 in a portion A is completely removed by checking electrical conduction between checking conducting films (non-doped polysilicon film 17) 17b and 17c in portions B and C which have not been dry-etched, whereby dry etching can be performed in an appropriate amount.例文帳に追加

ドライエッチングされなかったＢ、Ｃ部分のチェック用導電膜（ノンドープポリシリコン膜）１７ｂと１７ｃ間の電気的な導通をチェックすれことにより、Ａ部分のノンドープポリシリコン膜１７が完全に除去されたか否かを正確に判断し、適量のドライエッチングを施す。 - 特許庁

When frozen food is mounted on a tray 23 in a thawing chamber 3 and a thawing switch 35a is turned on, heat generated in a heat radiating part 8b by driving a Stirling refrigerating machine 8 is transferred to a heat pipe 31 and guided to the thawing chamber 3 under thermal conduction to heat air in the thawing chamber 3.例文帳に追加

冷凍された食品を解凍室３内のトレー２３に載せて解凍スイッチ３５ａをＯＮすると、スターリング冷凍機８の駆動により放熱部８ｂで発生する熱がヒートパイプ３１に伝えられ、熱伝導によって解凍室３内に導かれて該解凍室３内の空気を加熱する。 - 特許庁

Since a surface contacting food is covered by plastic with lower thermal conductivity than metal, thermal conduction is reduced, a sharp temperature rise of the food in a heat exchange part surface is prevented, and as a result, adherence of food residues become harder even in the same heating temperature as a conventional one.例文帳に追加

金属よりも熱伝導性の低いプラスチックで食品と接触する表面を被覆したため、熱伝導が緩和され、熱交換部表面での食品の急激な温度上昇が防止され、この結果、従来と同じ加熱温度においても、食品残渣が付着しにくいものとなる。 - 特許庁

To reduce threshold voltage by bringing the work function of a P channel transistor's gate electrode close to the work function value of silicon valence band's upper end as well as by bringing the work function of the P channel transistor's gate electrode close to the work function value of silicon conduction band's lower end.例文帳に追加

Ｐチャネルトランジスタのゲート電極の仕事関数をシリコンの価電子帯上端の仕事関数値に近づけるとともに、Ｐチャネルトランジスタのゲート電極の仕事関数をシリコンの伝導帯下端の仕事関数値に近づけることで、しきい値電圧の低減を図る。 - 特許庁

When a heating body, i.e., a semiconductor element 3, is fixed with a first large heat sink 1 and a second small heat sink 2 in order to dissipate generated heat into the atmosphere, the heat sinks are interconnected through a soaking plate 11 of good thermal conduction.例文帳に追加

発熱体である半導体素子３が発生する熱を大気中に放散させるべく大きな第１放熱体１と小さな第２放熱体２を前記半導体素子３に取付ける場合に、これら各放熱体同士を熱伝導が良好な均熱板１１で接続する。 - 特許庁

According to this inspection method, when an inspection wiring 26 of TCP is arranged between an inspection terminal 14b and a power supply terminal 14a of a liquid crystal display panel 11 but is not connected with both of them, the inspection wiring 26 is brought into non-conduction with a power supply wiring 25.例文帳に追加

ＴＣＰ２１の検査用配線２６が液晶表示パネル１１の検査用端子１４ｂと電源用端子１４ａとの間に配置されてそのいずれとも接続されていない場合には、検査用配線２６と電源用配線２５との間は非導通状態となる。 - 特許庁

The flexible circuit board 5 comprises a sensor connection section 5a electrically connected to the sensor element 4, a terminal section 5d for transmitting the electric signal to an external conduction path 6, and an arrangement section 5b for arranging an amplification circuit section 7 for amplifying at least an electric signal from the sensor element 4.例文帳に追加

回路基板５は、センサ素子４と電気的に接続されるセンサ接続部５ａと、前記電気信号を外部通電路６に伝達する端子部５ｄと、センサ素子４からの電気信号を少なくとも増幅する増幅回路部７を配設する配設部５ｂとを備え、柔軟性を有する。 - 特許庁

In a method of manufacturing the heat conduction material, the material is prepared by a chemical vapor deposition process, a physical vapor deposition process, a melting process, or other material manufacturing methods, and the carbon having the tetrahedron structure may be provided covering the surface of the metal material, or may be mixed into the metal material.例文帳に追加

熱伝導材料の製造方法は、化学気相成長法、物理気相成長法、溶融、またはその他の材料製造方法で完成し、且つ正四面体構造の炭素は金属材料表面を覆ってもよく、金属材料中に混入してもよい。 - 特許庁

A bidirectional switch includes a field-effect transistor 10 having a first ohmic electrode 16, a second ohmic electrode 17 and a gate electrode 18, and a control circuit 20 for controlling between a conduction state and a cut-off state by applying a bias voltage to the gate electrode 18.例文帳に追加

双方向スイッチは、第１のオーミック電極１６、第２のオーミック電極１７及びゲート電極１８を有する電界効果トランジスタ１０と、ゲート電極１８にバイアス電圧を印加することにより導通状態と遮断状態とを制御する制御回路２０とを備えている。 - 特許庁

The circuit board structure is configured in such a manner that the semiconductor 22 is mounted on the circuit board 20 in a flip chip mounting mode, the underfill resin 28 is injected into a space between the semiconductor 22 and the circuit board 20, and a metal pattern 23 of high thermal conduction efficiency is arranged about the center of the semiconductor 22.例文帳に追加

回路基板２０に半導体部品２２をフリップチップ実装し、半導体部品２２と回路基板２０の間にアンダーフィル樹脂２８を注入する回路基板構造において、半導体部品２２の略中心に、熱伝導効率の高い金属パターン２３を配置した。 - 特許庁

To solve the problem that manufacturing a resonator of natural acoustic frequency is difficult due to shakiness by a fluctuation of inside surface, therefor by a fluctuation in cross-sectional area, of a conduction pipe depending on molding conditions, etc. of blow molding; in the blow molding of the resonator.例文帳に追加

解決しようとする課題は、レゾネータの中空成形において、導伝管部内面が中空成形時の成形条件等により変動して一定せず、従って該導伝管部の断面積も変動するため固有音響周波数が一定の該レゾネータを製造することができないという点である。 - 特許庁

A common conductive film 18 for making conduction with all the contact portions 16 positioned on a surface of the sheet-shaped base material 12 is formed on the surface and leg portions 19 higher than the contact portions 17 positioned on a rear face of the sheet-shaped base material 12 are provided.例文帳に追加

そして、前記シート状基材１２の表面に位置する接点部１６すべてを導通させる共通導電膜１８を、前記表面に形成するとともに、前記シート状基材１２の裏面に位置する接点部１７よりも高い脚部１９を、前記裏面に突設した。 - 特許庁

In the tape-like substrate 6 on which individual piece substrate sections on which electronic parts Pa, Pb and Pc are mounted are continuously formed in the lengthwise direction, heat insulating notches 21 which suppress the heat conduction between the substrate sections 6b are provided in the connecting section between the substrate sections 6b.例文帳に追加

電子部品Ｐａ，Ｐｂ，Ｐｃが実装される個片基板部６ｂが長手方向に連続して形成された電子部品実装用のテープ状基板６において、個片基板部６ｂ間を隔てる連結部に、個片基板相互間の熱伝導を抑制する断熱用の切り欠き２１を設ける。 - 特許庁

Via holes (3) for forming conduction paths between the surfaces of a double-sided copper-plated board (1) are formed in the slot form so as to be used in common by the wiring patterns of semiconductor packages, and the copper-plated board (1) is divided into the semiconductor packages along lines dividing the via holes into halves.例文帳に追加

両面銅張基板（１）の両面間の導通路を形成するためのビアホールを（３）、半導体パッケージ（２）の配線パターン間で共有させるようにかつその開孔形を長孔状に形成し、半裁する線上で切り分けて半導体パッケージを製造する。 - 特許庁

The method for manufacturing the substrate with the flow through electrode stably obtainable with the excellent electrical conduction can be provided by a simple method only for controlling the quantity of the paste protruded and the quantity of working and a driving-in without requiring the special device such as a pressure compression after the filling of the paste.例文帳に追加

ペースト充填後に加圧圧縮するなどの特別な装置を必要とせず、ペーストはみ出し量と加工追い込み量を制御するだけの簡単な方法により、電気的導通に優れた電極を安定的に得ることが可能な、貫通電極つき基板を製造する方法が提供できる。 - 特許庁

In this driving method of an AC type PDP(plasma display panel), in an address period TA when addressing is performed, scanning electrodes Y are made to be in states, in which their electric conduction with a power source line become high impedance over at least the time of one parts of selection waite periods, prior to the time when they are biased to a selection potential Vya1.例文帳に追加

アドレッシングを行うアドレス期間ＴＡにおいて、スキャン電極Ｙを、当該スキャン電極Ｙが選択電位Ｖｙａ１にバイアスされる以前である選択待ち期間内の少なくとも一部の時間にわたって、電源ラインとの通電が高インピーダンスとなる状態にする。 - 特許庁