「膨張接合」に関連した英語例文の一覧と使い方(3ページ目) - Weblio英語例文検索

このシル膨張部７１は、左フロアフレーム１２に接合された頂部７６と、後クロスメンバー１４に接合された後傾斜前半部７８と、ガイド収納部９１に接合された後傾斜後半部７９とを有する。例文帳に追加

The sill expansion part 71 has a top part 76 joined with the left floor frame 12, a backwardly-inclined front half part 78 joined with the rear cross member 14, and a backwardly-inclined rear half part 79 joined with a guide storage part 91. - 特許庁

接合（半田）熱によって割れの発生しやすいセラミック製品や部分膨張によって性能の低下が生じる部材の接合において熱影響を最小限に抑える接合方法を提供する。例文帳に追加

To provide a joining method for minimizing the heat effect when joining a ceramic product to be easily cracked by the joining (soldering) heat or a member with its performance being degraded by the partial inflation. - 特許庁

ＷとＣｕやＮｉのように、熱膨張係数の差が大きい異種材料において接合部で熱伝導性有害な欠陥のない密着性に優れ、実用十分な接合強度を有する接合体を提供する。例文帳に追加

To provide a joining member having an excellent adhesion in which a defect harmful to the heat conductivity is eliminated and a practically sufficient joining strength is provided at the joined zone where such different kind of material as W and Cu or Ni whose heat expansion coefficients are largely different are joined. - 特許庁

下プレートにつぶし代の中間高さとなる台座を接合し、上プレートにガラスと同等の熱膨張係数を持った薄板バネを数ヶ所接合し、アライメント後台座と薄板バネを接合する。例文帳に追加

A seating having middle height of a crushing margin is joined to the lower plate, a flat spring having a coefficient of thermal expansion similar to that of glass is joined to the upper plate at several points, and after alignment, the seating and the flat spring are joined. - 特許庁

熱膨張率の異なる金属構成部材を摩擦点接合する際の熱歪み変形を低減できる金属構成部材の接合方法及びその接合構造を提供する。例文帳に追加

To provide a joining method for metal components and its joining structure capable of reducing thermal distortion and deformation when metal components with different thermal expansion coefficients are friction-point-joined. - 特許庁

電子部品に用いられる熱膨張率が異なる２つの被接合材を接合するための非鉛系接合材は、Ｓｎ或いはＳｎ基合金中にへき開性を完全に有し、かつ層状構造を有する鉱石粉を含有してなる。例文帳に追加

The invented lead-free joining material is intended to join two workpieces different in the coefficient of thermal expansion which are used for an electronic component, and has perfect cleavage nature in Sn or Sn alloy, and contains an ore powder having a layer structure. - 特許庁

二つの接合部材１１、１２の間、及びこれら接合部材１１、１２と接合剤３の間における熱膨張係数差は、５.０×１０^−６／℃以下である。例文帳に追加

The difference of the coefficient of thermal expansion between the two bonding members 11, 12 and between the bonding members 11, 12 and the bonding agent 3 is 5.0×10^-6/°C or less. - 特許庁

第１層３１および第２層３２は、ロウ付けまたは拡散接合により互いに接合して一体構造とし、強固な接合界面で、熱膨張係数差による応力を確実に吸収させる。例文帳に追加

The first layer 31 and the second layer 32 are formed in an integral structure by a mutual joining by a soldering or a diffusion junction, and the stress by the difference of the coefficients of thermal expansion is absorbed surely on a firm junction interface. - 特許庁

これにより、接合部に密閉されたガスが残留するおそれがなく、従って、運転時における高温環境下であっても、残留ガスの膨張によって接合部の接合状態に支障をきたすのを回避することができる。例文帳に追加

hereby, there is no fear that gas sealed in the joining portions remains, so that even under a high temperature condition during operation, a hitch in the joining state of the joining portion caused by expansion of the remaining gas is prevented. - 特許庁

接合電極又は耐高エネルギー密度利用機器用部材は、タングステン部材３を中間層なしに直接タングステンよりも熱膨張係数の大きい基材２に圧入接合した接合体１を備えている。例文帳に追加

The joining electrode or a resistant member for using a high energy density is provided with a joining body 1 where a tungsten member 3 is directly press fitted into a base material 2 whose thermal expansion coefficient is larger than that of tungsten without an intermediate layer. - 特許庁

この静電チャック１０は、ともに鏡面研磨された主面を有し、少なくとも一方は非晶質である２枚の低熱膨張材料の間に電極となる金属を挟み込み、所定の温度に加熱すると同時にこの低熱膨張材料の主面に垂直な方向に所定の圧力を加えることにより、これら２枚の低熱膨張材料を熱融着接合させて、製造することができる。例文帳に追加

The electrostatic chuck 10 can be manufactured by sandwiching a metal to be an electrode between two low thermal expansion materials with at least one comprising an amorphous having main surfaces mirror polished, by heating at the predetermined temperature with a predetermined pressure applied in the direction perpendicular to the main surfaces of the low thermal expansion material, and thermally fusion bonding these two low thermal expansion materials. - 特許庁

セラミック基板１とプリント基板２の間に、両者の熱膨張率の中間の熱膨張率を有する金属からなる熱応力吸収部材３を接合し、はんだバンプ４を取り囲むように配置することで、はんだバンプ４によるＢＧＡ接合部に発生する熱応力を緩和し、かつ接合信頼性が高い接合構造。例文帳に追加

A thermal stress-absorbing member 3 made of metal having a coefficient of thermal expansion between coefficients of thermal expansion of the ceramic substrate 1 and printed board 2 is joined between the both, and is disposed so as to surround a solder bump 4, thereby a junction structure has high bonding reliability while relaxing thermal stress generated at a BGA junction part due to the solder bump 4. - 特許庁

本発明によれば、互いに接合されて、第１の直径を有する円筒から第２の直径を有する円筒へ膨張可能である略円筒形の装置を形成する複数の細長形ビームを有する膨張可能な医療装置が提供される。例文帳に追加

An expandable medical device has a plurality of elongated beams which are joined together to form a substantially cylindrical device which is expandable from a cylinder having a first diameter to a cylinder having a second diameter. - 特許庁

仮硬化後は鋼板接合部の間隙に存在する空気が、シーリング剤の加熱時に空気が膨張するとともにシーリング剤が膨張して外観を損なうという問題も発生せず、且つ、焼付け後は充分な延性と強度を確保する。例文帳に追加

To provide an acrylic sol composition hardly causing problems of damaging the appearance by the expansion of a sealing agent accompanied with the expansion of air present in a clearance of a joining part of steel sheets after preliminary curing when heating the sealing agent, and securing sufficient ductility and strength after baking. - 特許庁

中央障壁を挟んで２つのリアクトルが並んで配置されるリアクトル固定構造において、ケース材料の熱膨張係数とコア材料の熱膨張係数の間の相違によってコアの接合部に働く応力を抑制することである。例文帳に追加

To provide a reactor fixing structure that includes two reactors arranged in a row across a central barrier and suppresses a stress that acts on a core junction due to a difference between the thermal expansion coefficient of a case material and a thermal expansion coefficient of a core material. - 特許庁

厚導体基板１００では、少なくとも電子部品１４０の半田接合部１４１間を通る断面において、線膨張係数が所定の基準線膨張係数以下となるように導体の断面積の比率を大きくしている。例文帳に追加

In the thick conductor substrate 100, the ratio of a cross-sectional area of a conductor is enlarged thereby to allow a linear expansion coefficient to be equal to or less than a prescribed reference linear expansion coefficient in the cross section passing at least between the solder joint parts 141 of electronic components 140. - 特許庁

接合材３の、一対の基材のうち熱容量の小さい方の基材１４に面する部位の熱膨張係数は、１０×１０^-7／℃以内の差で、熱容量の大きい方の基材１２（１３）に面する部位の熱膨張係数よりも小さくされている。例文帳に追加

The thermal expansion coefficient of a part of the jointing material 3 facing the base material 14 having a smaller heat capacity out of the pair of the base material is made smaller than the thermal expansion coefficient of the part facing the base material 12 (13) having a larger heat capacity by a difference within 10x10^-7. - 特許庁

スペーサ５が形成された透明基板２０（第２工程）に、透明基板２０の熱膨張係数よりも小さく、かつウエハ３１と略同等の熱膨張係数を有する赤外線カットフィルタ（ＩＲＣＦ）基板２７を接合する（第３工程）。例文帳に追加

An infrared ray cutting filter (IRCF) substrate 27 having a thermal expansion coefficient smaller than the thermal expansion coefficient of a transparent substrate 20 and substantially the same as that of a wafer 31 is joined (third step) to the transparent substrate 20 (second step) having a spacer 5 formed thereon. - 特許庁

土木や建築における現場での打込コンクリートやコンクリート二次製品の接合端に埋設される鉄筋等の被締着物をプレストレスおよびプレスにより定着させる膨張材を迅速かつ確実に混合させ、また膨張継手の固定容器内部に円滑かつ確実に注入する。例文帳に追加

To rapidly and surely mix an expansion material anchoring a substance to be fastened such as a reinforcement buried at the joining end of placing concrete or a concrete secondary product at a site in civil engineering and construction by prestress and a press, and to smoothly and surely inject the expansion material into a fixing vessel for an expansion joint. - 特許庁

このため、筒状シャフト３０自身の気密化や筒状シャフト３０とセラミック基板２０との接合部位の気密化を図ったり、筒状シャフト３０のうちセラミック基板側の端部の熱膨張係数をセラミック基板２０の熱膨張係数に近付けたりすることが可能となる。例文帳に追加

For that reason, it is possible to air-tighten the cylindrical shaft 30 itself and the junction site of the cylindrical shaft 30 and the ceramic substrate 20, and to make a thermal expansion coefficient of the end part of the ceramic substrate side out of the cylindrical shaft 30 closer to that of the ceramic substrate 20. - 特許庁

本発明は、床材間の膨張吸収隙間を均一に一定に形成しながらの床材敷設作業を効率よく行うことができ、且つ、床材が収縮せんとした場合においては、該膨張吸収隙間が一定以上に広がらないようにした床材接合構造を提供する。例文帳に追加

To provide a flooring material joining structure which enables flooring material laying work to be efficiently performed along with the uniform and constant formation of an expansion absorbing gap between flooring materials, and which prevents the size of the expansion absorbing gap from being as large as/larger than a fixed size, when the flooring material is about to shrink. - 特許庁

膜電極接合体１０において、電解質膜１２は、燃料電池に適用して発電を行ったときに、他の領域よりも含水量が多くなる空気出口側の一部の領域のみに、含水したときの電解質膜の膨張を抑制するための膨張抑制材１２ｒを備える。例文帳に追加

In the membrane electrode assembly 10, the electrolyte membrane 12, when performing power generation applied in a fuel cell, includes an expansion control material 12r which suppresses expansion of the electrolyte membrane when water is included, only in a part of the region on the air exit side where water content becomes larger than that of the other region. - 特許庁

２０〜６００℃の平均熱膨張率が１２×１０^−６／℃以下である耐食性セラミックス又はガラスよりなる保護体２を、当該平均熱膨張率との差が３×１０^−６／℃以内である金属よりなる熱電対素線１の表面に接合させて一体化した熱電対を作る。例文帳に追加

The thermocouple is manufactured by connecting and integrating a protective body 2, comprising corrosion resistant ceramic or glass whose average thermal expansion coefficient at 20-600°C is 12×10^-6/°C or smaller, with the surface of a thermocouple element wire 1 comprising a metal whose difference with the average thermal expansion coefficient is within 3×10^-6/°C. - 特許庁

これらのスプリングのうち、少なくとも上下の２つ１２Ａ，１２Ｂは、帯状の高熱膨張率金属１４と帯状の低熱膨張率金属１５との長手側縁部同士が接合されたバイメタルからなり、しかも互いに異なった湾曲率とされている。例文帳に追加

At least the top and bottom two 12A, 12B out of these springs are made of a bimetal in which the longitudinal side edge parts of a belt-shape metal 14 having high coefficient of thermal expansion and a belt- shape metal 15 having low coefficient of thermal expansion are jointed, and have a mutually different bending ratio. - 特許庁

既存の回路部品と回路基板を用いて、低コスト・高信頼性で部品を内蔵し高密度実装を実現すると共に、適切な熱膨張係数が選択できる矯正材と接合することで適切に熱膨張係数を制御した部品内蔵基板を提供する。例文帳に追加

To provide a board with built-in components in which, using existing circuits and circuit boards, reliable parts are incorporated at a low cost to realize high-density mounting, and a thermal expansion coefficient is properly controlled by jointing to a correction materia of which appropriate thermal expansion coefficient can be selected. - 特許庁

このろう付け方法により、天板２８が幅方向の外側に熱膨張せずに、底板３２が幅方向の外側に熱膨張するので、天板２８の内部の側面２８ａと底板３２の側面３２ａとが接触して確実に接合することができる。例文帳に追加

By the brazing method, the bottom plate 32 thermally expands outside in the width direction without allowing the top board to thermally expand outside in the width direction, thus allowing the side 28a inside the top board 28 to abut against the side 32a of the bottom plate 32 and make it a reliable junction. - 特許庁

Ｘ線光導電体層４との熱膨張率差がＸ線光導電体層４とＴＦＴ回路基板３との熱膨張率差よりも小さい金属板25を、ＴＦＴ回路基板３のＸ線光導電体層４と反対側に接合する。例文帳に追加

A metal plate 25, whose thermal expansion coefficient difference from an X-ray photoconductor layer 4 is smaller than that from the X-ray photoconductor layer 4 and a TFT circuit board 3, is jointed to the opposite side of the TFT circuit board 3 to the X-ray photoconductor layer 4. - 特許庁

建築物の仕切り部に設けられた防火区画を貫通して施工される合成樹脂配管１の外側に挿通された鞘管２と鞘管２とが接合する目地部３に、熱膨張によって耐火断熱層５を形成する熱膨張性パッキン４が挿入された配管構造。例文帳に追加

In this piping structure, a thermally expansible packing 4 which forms a fire resisting heat insulating layer 5 by thermal expansion is inserted to the joint part 3 where the sheath pipes 2 and 2 inserted onto the synthetic resin pipe 1 constructed through the fire preventive area provided on the partitioning part of the building. - 特許庁

はんだ接合部の破断寿命の短い部品が実装された周囲部分に対し、部品とプリント基板２の熱膨張量を同程度にするため、プリント基板２の熱膨張を調節するための器具１をプリント基板上に装着する。例文帳に追加

In order to set the thermal expansion amount difference between the component and the printed board 2 to the same degree with respect to the peripheral part in which a component having a short fracture lifetime of the solder junction is mounted, an instrument 1 for regulating the thermal expansion of the board 1 is mounted on the board. - 特許庁

土木や建築における現場での打込コンクリートやコンクリート二次製品の接合端に埋設される鉄筋等の被締着物をプレストレスおよびプレスにより定着させる膨張材を迅速かつ確実に混合させ、また膨張継手の固定容器内部に円滑かつ確実に注入する。例文帳に追加

To promptly and surely mix an expansion material for fixing a subject to be tightened such as a reinforcement which is buried in a joint end of a cast-in concrete or concrete secondary product at a worksite in a civil work or building construction, and to smoothly and surely inject it inside of a fixed container of an expansion joint. - 特許庁

高靭性領域２１と低熱膨張領域２２とを冶金的に接合することにより、低熱膨張領域２２によりハンダ層５ｂの熱疲労寿命を延長させると共に、高靭性領域２１により半導体チップ４の冷却特性をも向上させる。例文帳に追加

A high-toughness region 21 is metallurgically joined to a low thermal expansion region 22, thus extending the thermal fatigue life of a soldering layer 5b by the low thermal expansion region 22, and improving the cooling characteristics of a semiconductor chip 4 by the high toughness region 21. - 特許庁

熱膨張率の異なる２つのインクジェットヘッド用部材を熱硬化性型接着剤で接合して製造するインクジェットヘッドの製造方法において、前記熱膨張率の低い方のインクジェットヘッド用部材の側から加熱する。例文帳に追加

In the method for manufacturing an ink jet head by bonding two members for the ink jet head having different coefficients of thermal expansion through thermosetting adhesive, they are heated from the side of a member having a lower coefficient of thermal expansion. - 特許庁

基部１０５の上方に光学素子１０３が設けられた光学素子パッケージ１１０は、前記基部１０５と前記光学素子１０３との間に、熱膨張係数が異なる材料の層２１０、２２０が複数接合されて成る熱膨張緩和構造体２００が配設されていることを特徴とする。例文帳に追加

The optical element package 110 provided with an optical element 103 in an upper side of a base part 105 is arranged with a thermal expansion moderating structure 200 joined with material layers 210, 220 having different thermal expansion coefficients, between the base part 105 and the optical element 103. - 特許庁

このことにより、外部回路等への半田接合時にリードフレーム３Ａ、３Ｂに熱負荷が加えられても、熱膨張率の小なるリード固定部６によってリードフレーム３Ａ、３Ｂ間の間隔が熱膨張によって大になることを防げる。例文帳に追加

As a result, it can prevent that spacing between the lead frames 3A, 3B becomes large due to thermal expansion by using the lead fixing part 6 whose thermal expansion is small even if thermal load is applied to the lead frames 3A, 3B at the time of solder bonding to an external circuit etc. - 特許庁

台座３を、センサチップ１と同等の熱膨張係数を有しセンサチップ１が接合される第１層３１と、センサチップ１と同等の熱膨張係数を有しかつ第１層３１よりも高い弾性係数を有する第２層３２とを含む多層構造にする。例文帳に追加

A pedestal 3 of a multilayer structure comprises a first layer 31 which is, having a thermal expansion factor equal to a sensor chip 1, jointed to the sensor chip 1, and a second layer 32 which has a thermal expansion factor equal to the sensor chip 1 while having an elastic factor higher than the first layer 31. - 特許庁

半導体チップと回路チップとの間に樹脂フィルムを設けて半導体チップおよび回路チップを一体化する際、膨張した樹脂フィルムが半導体チップのセンシング部に付着することを防止し、膨張した樹脂フィルムの応力による各バンプの接合強度の低下を抑制する。例文帳に追加

To prevent a bulged resin film from adhering to a sensor of a semiconductor chip when the resin film is provided between the semiconductor chip and a circuit chip to integrate the semiconductor chip with the circuit chip, and to suppress a reduction of a bonding strength of each bump due to a stress of the bulged resin film. - 特許庁

熱伝導率が高く、熱膨張率がＬＥＤチップ１０５の熱膨張率に近いセラミック基板１０２に銅合金材のリードフレーム１０１を銀ロー１０３で接合することにより、高い熱伝導と熱応力の少ないパッケージを実現する。例文帳に追加

A lead frame 101 made of copper alloy material is connected to a ceramic substrate 102 having high thermal conductivity and coefficient of thermal expansion close to that of an LED chip 105 with a silver solder 103, to obtain a package of high thermal conductivity and low thermal stress. - 特許庁

半導体チップと回路基板とをフリップチップ接合するに際し、前記半導体チップを所定の温度で加熱する一方、前記所定の温度に対する半導体チップの熱膨張量と略同量熱膨張するように、前記回路基板を加熱するようにした。例文帳に追加

When the semiconductor chip and the circuit board are subjected to flip-chip bonding, the semiconductor chip is heated at a predetermined temperature, while the circuit board is heated such that it is thermally expanded by a substantially same amount as that of the semiconductor chip at the predetermined temperature. - 特許庁

表板１の裏側に接合されている裏板２を、表板１の材料の線膨張係数よりも高い線膨張係数を有する材料により構成し、加熱時にける表板１と裏板２との伸び量の差を小さくするようにした。例文帳に追加

A back board 2 bonded to a rear side of a front board 1 is made of a material having a coefficient of linear expansion higher than that of a material of the front board 1 for reducing the difference in elongation amount between the front board 1 and the back board 2 in being heated. - 特許庁

エアの給排気によって膨張・収縮自在な平坦状のエアシート材２の両端部に着脱部材６を設け、このエアシート材２を丸めて着脱部材６を接合して筒型にするとともに、エアを充填して膨張させ周壁２ｓとする。例文帳に追加

Fitting and removing members 6 are set on both ends of a flat air sheet material to be expanded and contracted freely by the air feeding and exhausting in this liquid tank, and the air sheet material is rolled and joined with the fitting and removing members 6 to form the cylindrical shape and air is filled and expanded to form the peripheral wall 2s. - 特許庁

コア材４により接合材３の熱膨張係数を低減でき、接合強度を向上できるため、接合材３に作用する熱応力を小さくして接合材３の破壊を抑制することができるので、接合の信頼性が高いものとなる。例文帳に追加

Since the thermal expansion coefficient of the binding agent 3 is reduced by the core material 4 to improve the bonding strength, thermal stress acting on the bonding agent 3 is made small and breakage of the bonding agent 3 is suppressed, resulting in highly reliable bonding. - 特許庁

半導体装置が、基板と、基板上に配置された半導体素子と、半導体素子に、所定の接合面で接合された接合部を有するリボンワイヤとを含み、接合部上に、リボンワイヤより線膨張係数の小さな固体層が接合される。例文帳に追加

The semiconductor device includes: a substrate; the semiconductor element disposed on the substrate; and a ribbon wire having the joint portion joined to the semiconductor element on a predetermined junction surface, and a solid layer having a smaller coefficient of linear expansion than that of the ribbon wire is joined onto the joined portion. - 特許庁

互いに異なる熱膨張係数の第１の部材２５と第２の部材２３ａとを接合した接合層２４を有する半導体装置において、接合層２４の周辺部を第１の部材２５と共に挟むように配置され、第２の部材２３ａに比べて第１の部材２５との熱膨張差の小さい第３の部材２３ｂを備える。例文帳に追加

In the semiconductor device having bonding layers 24 constituted by bonding a primary member 25 and a secondary member 23a which have mutually different thermal expansion coefficients, peripheries of the bonding layers 24 are arranged so as to be pinched together with the primary member 25, and there is provided a tertiary member 23b having a small thermal expansion difference with the primary member 25 as compared with the secondary member 23a. - 特許庁

温度変化に伴う接着層の膨張、収縮に起因して貫通電極または２つの貫通電極を接合する接合部に亀裂が生じることを防止する。例文帳に追加

To prevent cracks caused expansion and contraction of an adhesive layer accompanied by temperature change from being generated at a through electrode or a bonding part bonding two through electrodes. - 特許庁

線膨張係数に差がある２つの管材をろう付接合する場合であっても、必要なろう付間隙を保持できるろう付継手構造、および金属配管の接合方法を提供する。例文帳に追加

To provide a brazing joint structure, and a joining method for metal piping capable of maintaining a necessary brazing clearance even when brazing two pipe materials with a difference in linear expansion coefficients. - 特許庁