「膨張接合」に関連した英語例文の一覧と使い方(4ページ目) - Weblio英語例文検索

ノックピン１３１の熱膨張率が異なる二部品（例えば、鉄系部品（１１１）とアルミ合金系部品（１０１））の接合面１２２に対応する部位を、該接合面１２２と非接触となるくびれ部１３１に形成した。例文帳に追加

A portion of the knock pin 131 corresponding to the joint surface 122 between two components (an iron based component (111) and an aluminum alloy based component (101), e.g.) different in a thermal expansion coefficient is formed as a constricted porion 131 which has no contact with the joint surface 122. - 特許庁

信頼性試験や実装後の時間経過、周囲環境の変化により、接合部材が膨張及び収縮を繰り返した場合でも、光軸ずれや接合部材の剥離が生じない光ヘッドを提供する。例文帳に追加

To provide an optical head in which misalignment of an optical axis and peeling of junction member are not caused even when expansion and contraction of the junction member are repeated due to a reliability test, elapsed time after mounting, and variation of ambient environment. - 特許庁

加熱により、前記球状構造体３を前記開口１２内で前記開口１２の径の大きさまで体積膨張させることによって、前記第１の接合部１と前記第２の接合部２とを自己整合的に位置あわせする。例文帳に追加

The spherical structure body 3 is volumetrically expanded by application of heat to a size as large as the diameter of the opening 12 in the opening 12 to thereby align the first junction part 1 and the second junction part 2 in a self-aligning manner. - 特許庁

接着によってテザーパネルをパネルに接合するための接着片における接合強度を膨張展開に十分に耐え得るものとすることができるエアバッグを提供する。例文帳に追加

To provide an airbag capable of allowing joining strength in an adhesive piece for joining a tether panel to a panel by adhering to sufficiently withstand expansion and deployment. - 特許庁

熱電変換素子及び電極を接合する接合材と熱電変換素子との間に、Ｔｉ_xＣｕ_1-x（ｘ＝０．２〜０．４３）の組成を含み、線膨張係数が１２×１０^-6〜１５×１０^-6［／Ｋ］であるバリア層が配置されている。例文帳に追加

A barrier layer including composition of Ti_xCu_1-x (x=0.2 to 0.43) and having a linear expansion coefficient of 12×10^-6 to 15×10^-6 [/K] is arranged, between a joining material for joining the thermoelectric conversion element to the electrode and the thermoelectric conversion element. - 特許庁

これにより半田接合部１０の半田の熔融による膨張を開口部５で吸収し、半田の固化時には不足分の半田を半田接合部１０に戻し、半田の過不足を自然に調整する。例文帳に追加

By doing this, bulge due to melting of the solder in the part 10 is absorbed by the opening 5, and when the solder is cured, the shortage amount of the solder is fed back to the part 10 and the excess or shortage of the solder is adjusted automatically. - 特許庁

透光性材料である合成樹脂製面材と枠材とを接合した透光部を備えた建材において、熱膨張率の異なる面材と枠材とを締りばめによって接合する。例文帳に追加

This building material having the light transmission part formed of a synthetic resin surface material of a light transmission material and a frame member joined to each other is so formed that the surface material and the frame material with different coefficients of thermal expansion can be joined to each other by interference fit. - 特許庁

また、第２のワークＷ２と第１のワークＷ１とは、摩擦圧接による固相接合力と熱膨張率の差による締め付け力との双方によって接合される。例文帳に追加

Further, the second workpiece W2 and the first workpiece W1 are joined with each other by both the solid state welding force by the friction welding, and the tightening force caused by the difference in the coefficient of thermal expansion. - 特許庁

互いに線膨張係数の異なる複数の基板の接合面に、脆性破壊を起こすアモルファス状の無機物からなるバッファ層を形成し、このバッファ層同士が相対向するように接合する基板同士を積層する。例文帳に追加

Buffer layers made of an amorphous inorganic substance which causes brittle fracture are formed on bonding surfaces of a plurality of substrates having linear expansion coefficients different from each other, and the substrates to be bonded are laminated onto each other such that the buffer layers face each other. - 特許庁

第２の接合部２を有する第２の接合対象物の前記開口１２と対向する位置に、前記開口１２の径よりも小さい径を有し加熱により体積膨張する性質を有する球状構造体３を配置する。例文帳に追加

A spherical structure body 3 that has a diameter smaller than the diameter of the opening 12 and that is volumetrically expandable under heat is arranged at a position of a second junction object having a second junction part 2, the position being opposed to the opening 12. - 特許庁

この接合構造４０は、複数の凹み３１により、第一折返し部１２と第二折返し部２２との接合強度が高められているため、振動や熱膨張等の衝撃を受けた場合であっても緩みが生じにくく、安定である。例文帳に追加

Since the joining strength of the first returning part 12 with the second returning part 22 is increased by the plurality of recesses 31, the joining structure is less liable to be loosened but stable even when it is subjected to shocks such as vibration and thermal expansion. - 特許庁

低膨張係数と高熱伝導率を有し、Ｐｂフリーはんだを用いて半導体装置に接合した場合であっても、接合によるそりの少ない放熱板などの半導体装置部品を提供する。例文帳に追加

To provide a semiconductor device component such as a heat slinger or the like which has low expansion coefficient and high temperature conductivity, and is little in camber caused by bonding even when it is joined to a semiconductor device using Pb free solder. - 特許庁

これにより、再溶融した半田の自由膨張が阻害されることに起因する半田接合部の形状異常を防止して、半田接合部の信頼性を確保することができる。例文帳に追加

Consequently, abnormal shape of the solder joint caused by inhibition of free expansion of remolten solder is prevented and reliability of a solder joint can be ensured. - 特許庁

すなわち、アパーチャグリル（色選別マスク）を接合する前の常温状態において、高膨張材をこれに圧縮応力を発生させた状態でフレームに接合するようにする。例文帳に追加

The high-expansion material is jointed to the frames with compression stress occurring on it in the room temperature state before an aperture grille (color discriminating mask) is jointed. - 特許庁

鋼材に圧粉体を嵌め合わせて焼結して複合焼結機械部品を製造する場合、従来は圧粉体の銅膨張作用を利用して一体に接合していたが、より高い接合強度が求められている。例文帳に追加

To provide a production method capable of obtaining higher joining strength though, at the time of producing a composite sintered machine part by inserting a green compact into steel and performing sintering, heretofore, they have been integrally joined by utilizing the copper expanding action of the green compact. - 特許庁

その効果は、熱膨張量の違いによるプリント基板の変形を抑える事によって、はんだ接合不良やはんだ接合部寿命低下の防止とする事である。例文帳に追加

Since deformation of the printed board due to difference of thermal expansion is suppressed, defective joint or lowering of lifetime at the joint can be prevented. - 特許庁

水膨潤材の夫々の一面が接合面に対向するようにスポンジ材から露出し、更に水膨潤材の膨張方向をスポンジ材によりセグメント接合面方向に限定した。例文帳に追加

One surface of each water-swelling member is exposed from the sponge member so as to face the joining surface, and the swelling direction of the water-swelling members is limited to the direction of the segment joining surface by the sponge member. - 特許庁

これにより、金属片２の端子部２３に巻線をフユ−ジング接合して金属片２が熱膨張しても、金属片２の整流子片接続部２１と整流子片１との接合が剥離することがない。例文帳に追加

As a result, junction between the connecting part 21 of the metal segment 2 and the commutator segment 1 is not peeled when a winding is fusion-bonded to a terminal part 23 of the metal segment 2 and the metal segment 2 is thermally expanded. - 特許庁

(1) 展開膨張可能な二重袋織部の外周に接合帯が形成されたエアバッグ用袋織基布において、該接合帯が風通組織および斜子組織を含むエアバッグ用袋織基布。例文帳に追加

(1) In the circular-weaving ground fabric for an air bag equipped with a connection belt on the outer periphery of a developable and swellable double-weaving part, the connection belt comprises a splashed pattern texture and a basket weave texture. - 特許庁

電子部品が実装されるプリント配線板において、線膨張係数の差が大きい電子部品がはんだにより接合されるはんだ接合部の疲労寿命を改善すること。例文帳に追加

To provide a printed wiring board on which an electronic component is mounted, which improves a fatigue life of a solder bonded part at which the electronic component having a large difference in linear expansion coefficient is bonded. - 特許庁

半導体素子２と電極１とを金薄膜３を介して接合した接合体と、線膨張率３０ｐｐｍ以下且つ弾性率５ＧＰａ未満の封止材からなり、接合体の接合部を封止する封止材層５と、を有することを特徴とする。例文帳に追加

The semiconductor device with the electrode comprises: a joining body for which a semiconductor element 2 and the electrode 1 are joined via gold thin film 3; and a sealing material layer 5 composed of a sealing material whose linear expansion coefficient is ≤30 ppm and elastic modulus is <5 GPa, for sealing the joining part of the joining body. - 特許庁

被接合管材２２を発熱抵抗体１ｂにより加熱して膨張させ；ろう材２５，２５’及びそれらを挟持する被接合管材２１，２２，２３の接合端部を高周波加熱コイル２ｃ，３ｃにより目標値温度に加熱することで溶融させ；ろう材２５，２５’及び接合端部を凝固させる。例文帳に追加

A tube 22 to be bonded is heated and inflated by a heating resistor 1b, brazing filler metals 25, 25' and bonding ends of tubes 21, 22, 23 to hold the brazing filler metals are heated at the target temperature by high frequency heating coils 2c, 3c, and melted, and the brazing filler metals 25, 25' and the bonding ends are solidified. - 特許庁

内側接合部８の接着部８ａを外周接合部７の接着部７ａよりも厚く形成したため、エアバッグ１の展開時に、内側接合部８の接着部８ａが十分に伸びて、内側接合部８に集中する膨張圧を吸収することができる。例文帳に追加

A bonding part 8a of an inner joint part 8 is formed to be thicker than a bonding part 7a of an outer circumferential joint part 7, and thereby the bonding part 8a of the inner joint part 8 extends to absorb an inflation pressure concentrated on the inner joint part 8. - 特許庁

また、中間層を傾斜組成材料にすれば、熱膨張係数の異なる異種材料を接合するとともに中間層による接合部の熱残留応力を緩和させる役割も果たすことができるので、接合強度および接合体の耐久性の向上が期待できる。例文帳に追加

When the intermediate layer is a composition-graded material, the improvement of joining strength and durability of the joined body can be expected since materials of different kinds having different coefficients of thermal expansion can be joined and a thermal residual stress of the joined portion can be relaxed because of the intermediate layer. - 特許庁

これにより、プリント回路基板３０及びＩＣチップ２０の熱膨張係数が異なっても、プリント回路基板３０及びＩＣチップ２０を相互に接合している接合部（半田）に加わる応力は、全ての接合部に分散し、接合部が破断し難い。例文帳に追加

Thereby even if the board 30 and chip 20 have different thermal expansion coefficients, stresses on junction parts (solders) between the board 30 and chip 20 can be dispersed to all the junction parts, thus making it difficult for the junction parts to be broken. - 特許庁

接合シートを介して表示パネルとシャーシとが接合されてなるフラットディスプレイから表示パネルを分離するための方法であって、表示パネルとシャーシの間に膨張可能な袋体を挿入し、該袋体の内部に流体を流入させて該袋体を膨張させ、表示パネルとシャーシとを分離する。例文帳に追加

The method for separating the display panel from the flat display joined with the display panel and the chassis through a joining sheet comprises inserting an expandable bag between the display panel and the chassis and admitting fluid into the bag to expand the bag, thereby separating the display panel and the chassis. - 特許庁

助手席用エアバッグ装置１０は、膨張、展開されることで、乗員Ｐの上体Ｕを車両前側から拘束するメインバッグ２６と、メインバッグ２６よりも小容量とされ膨張、展開されることで乗員Ｐの膝Ｋを車両前側から拘束するサブバッグ２８とが、接合部Ｊにおいて接合されて成るエアバッグ２０を備える。例文帳に追加

This airbag device 10 for a front passenger seat includes an airbag 20 formed by joining the main bag 26 for restraining the upper body U of the occupant P from a vehicle front side while being inflated and deployed and a sub-bag 28 having a smaller capacity than that in the main bag 26 to restrain the knees K of the occupant P from the vehicle front side while being inflated and deployed in a joining part J. - 特許庁

セラミックにろう付け等により全面接合し一体化する接合部品であって、チタンを主材とし、少なくとも１種類以上のチタンと線膨張係数の異なる金属とを含有し、各成分の配合比率を調整する事により、チタン単体の場合と他の金属単体の場合との間の任意の線膨張係数値に制御が可能なこととした。例文帳に追加

This ceramic joining part is joined to the whole face of ceramic and integrated with the ceramic by brazing and comprises titanium as a main material and at least one or more kinds of metals which are different in coefficient of linear expansion from titanium and enables the coefficient of linear expansion to control into an arbitrary value between linear expansion coefficient of titanium and that of other metal by adjusting compounding ratio of each component. - 特許庁

円柱状の空芯部を有した円柱状の熱膨張性スポンジ材の一方の端面と、管状のゴム成形体の一方の端面が接合された防火部品であって、熱膨張性スポンジ材の円柱軸、空芯部の円柱軸及びゴム成形体の管の円柱軸が同一線上にあるように接合されたことを特徴とする防火部品。例文帳に追加

In the fire-proof component composed by connecting an end face of a cylindrical thermally-expansible sponge material having a cylindrical empty core part and an end face of a tubular rubber molded article, the cylindrical axis of the thermally expansible sponge material, the cylindrical axis of the empty core part, and the cylindrical axis of the tube of the rubber molded article are coaxial. - 特許庁

β−ユークリプタイト５０〜９５質量％と炭化珪素５〜５０質量％からなる低熱膨張セラミックス底板材１と箱蓋構造を有する同材質の上板材２とを、該板材よりも溶融温度の低い低熱膨張セラミックスからなる接合材で接合してステージ部材を構成する。例文帳に追加

The stage member is formed by bonding a low heat-expansion ceramic bottom plate material 1 made of β-eucryptite of 50-95 mass% and silicon carbide of 5-50 mass% and an upper plate material 2 made of the same material having a box cover structure by means of a bonding material made of a low heat-expansion ceramic with lower melting temperature than the plate material. - 特許庁

ガラス基板１７及び背面基板１５の各厚さ、弾性率及び熱膨張係数と、同ガラス基板１７及び背面基板１５を加熱して接合するときの加熱温度と、接合された両基板１５，１７の曲率半径との関係に基づき、所望の曲率半径に応じて、前記各基板の厚さ、弾性率及び熱膨張係数と、前記加熱温度とを設定する。例文帳に追加

Thicknesses, elastic moduli, and coefficients of thermal expansion of a glass substrate 17 and a back substrate 15 and a heating temperature at which the glass substrate 17 and back substrate 15 are heated to be joined together are set according to a desired radius of curvature on the basis of the relation among the respective thicknesses, elastic moduli, and coefficients of thermal expansion of the glass substrate 17 and back substrate 15, and the heating temperature. - 特許庁

本発明によれば、接合材４の内部に空隙６が存在するために、体積膨張分４１が封止樹脂５に対して損傷を与える前に、空隙６内に接合材４の体積膨張分４１が流れ込み、空隙６内に存在する気体の圧力は高まるものの、樹脂５に亀裂を発生させることがなくなる。例文帳に追加

According to the present invention, because the cavity 6 exists inside the bonding material 4, the amount of volume expansion 41 of the bonding material 4 flows into the cavity 6 before the amount of volume expansion 41 causes damage to the packaging resin 5, and although the pressure of gas existing in the cavity 6 rises, the occurrence of cracks in the resin 5 is prevented. - 特許庁

２枚の低熱膨張セラミックス母材から構成されたチャック本体と、このチャック本体に埋設された電極とを具備する静電チャックであって、前記チャック本体が前記電極を挟んで、該母材よりも溶融温度の低い低熱膨張セラミックスからなる接合材で接合してなる静電チャック。例文帳に追加

The electrostatic chuck is provided with two chuck bodies comprised of low-thermal-expansion ceramics base material and an electrode buried in the chuck body, and the chuck bodies pinch the electrode and they are bonded with a bonding material made of low-thermal-expansion ceramics with a melting point lower than that of the base material. - 特許庁

複数の電気的な第一伝送線路を有し、第一熱膨張率を有するプリント基板と、複数の第一伝送線路のそれぞれに接合する複数の電気的な第二伝送線路を有し、プリント基板に対向して配置され、第一熱膨張率より小さい第二熱膨張率を有するプローブ基板と、複数の第二伝送線路のそれぞれに接合し、電子デバイスの電極にそれぞれ接触する複数の第一接触子とを備えることを特徴とするプローブカードを提供する。例文帳に追加

The probe card is provided with a printed substrate having a plurality of electric fist transmission lines, a probe substrate having a plurality of electric second transmission lines connecting respectively to a plurality of the first transmission lines, arranged facing to the printed substrate and having a secondary thermal expansion coefficient smaller than a primary thermal expansion coefficient and a plurality of first contacts coming into contact with each of electrodes of the electric device. - 特許庁

熱膨張率の異なる第１及び第２の基板が接合された基板接合体の製造方法であって、反り量を容易に制御でき、かつ、第１の基板の厚さと第２の基板の厚さとが近い場合にも適用できる基板接合体の製造方法を提供する。例文帳に追加

To provide a method of producing a bonded substrate assembly of first and second substrates having different coefficients of thermal expansion, capable of controlling the amount of warpage easily and is applicable, even if the thickness of the first substrate is close to the thickness of the second substrate. - 特許庁

ツール末端部に摩擦攪拌接合に必要な摩擦熱を確保しつつ、ツールの冷却を効果的に行い、ツールの軸方向への熱膨張を防止し、良好な摩擦攪拌接合を行い得るようにした摩擦攪拌接合方法を提供したい。例文帳に追加

To provide a friction stir welding method by which good friction stir welding can be performed by preventing the thermal expansion in the axial direction of a tool by performing the cooling of a tool effectively while securing frictional heat required to the friction stir welding in the terminal part of the tool. - 特許庁

板ガラスと金属製の板材とを接着剤により強固に接合することができ、たとえ雰囲気温度が上昇しても、金属製の板材の熱膨張に伴う応力が板ガラス側に作用するのを抑制して強固な接合を維持し得る板ガラス接合構造の提供。例文帳に追加

To provide a plate glass join structure capable of firmly joining the plate glass and a metallic plate material by adhesive, and keeping the firm joining by preventing the stress in accompany with the thermal expansion of the metallic plate material, from acting on a plate glass side even when an atmospheric temperature is raised. - 特許庁

各膜の熱膨張によるしわの発生防止、搬送中の位置ずれ防止、処理時間の短縮等を実現できる固体高分子型燃料電池用の膜に電極接合体を接合させる際の３層のＭＴＡ膜を固定保持する方法および接合方法を提供することを目的とする。例文帳に追加

To provide a method of fixing and holding a three-layer MEA film at the time of jointing an electrode junction to a membrane of a solid polymer fuel cell, in which the prevention of wrinkles due to thermal expansion of each membrane and position slippage during transfer, and the reduction of treatment time or the like is achieved, and a jointing method. - 特許庁

これに加え、両領域２１，２２の接合面を板厚方向に対して所定の角度θを設けて接合することにより、熱応力による低熱膨張領域２２と高靭性領域２１との接合面における熱応力集中を緩和させ、熱応力によるベース２０の破損を防止する。例文帳に追加

In addition, the junction surface between the regions 21 and 22 is joined at a specific angle θ to a plate-thickness direction, thus relieving the concentration of thermal stress on the junction surface between the low thermal expansion and high-toughness regions 22 and 21 caused by the thermal stress, and preventing the damage of a base 20 due to the thermal stress. - 特許庁

熱膨張係数が異なるシリコンとガラスの陽極接合の際に、反りを低減することで、接合されたシリコンとガラスからなる半導体センサ等のオフセット電圧の変動を小さくしデバイス特性の改善を図るための陽極接合方法を提供する。例文帳に追加

To provide an anode bonding method, which is used in anode-bonding silicon to glass different in thermal expansion coefficient, for reducing the fluctuations of offset voltage of a semiconductor sensor, or the like, made of the bonded silicon and glass and improving characteristics of such a device by reducing a warp of the bonded silicon and glass. - 特許庁

線膨張係数の異なる複数の部材を接合してなる接合体の全体としての剛性を高めると共に、小型・薄型であっても熱応力に対する剥離が生じにくくした接合体の提供と、流体機器の提供とを図る。例文帳に追加

To provide a jointed body constituted by jointing a plurality of members with different linear expansion coefficients to each other, having enhanced rigidity as a whole and preventing peeling with respect to thermal stress even if the jointed body is small and thin, and a fluid device. - 特許庁

感圧ダイヤフラムを形成するシリコンチップ１１、およびこれと近似の線膨張係数を有しシリコンチップ１１と接合されるガラス台座１２により成る接合体１０と、ガラス台座１２とはんだ１３で接合される金属台座１４とで部品を構成する。例文帳に追加

The semiconductor pressure sensor comprises a joint part 10 including a silicon chip 11 forming a pressure-sensitive diaphragm and a glass base 12 having a coefficient of linear expansion approximate to that of the silicon chip 11 and being bonded thereto, and a metal base 14 being bonded to the glass base 12 through a solder 13. - 特許庁

コンクリート構造物間を接合する方法であって、線膨張率が異なる少なくとも二種の繊維を複合してなる継手部材を接合部コンクリートに設け（ステップＳ１）、継手部材を加熱することにより（ステップＳ２）、接合部コンクリートにプレストレスを付与するようにする（ステップＳ３）。例文帳に追加

In a junction method between concrete structures, a joint member, which is formed by combining at least two kinds of fiber with different linear expansion coefficients, is provided in a junction concrete (step S1), and the joint member is heated (step S2) so as to apply pre-stress to the junction concrete (step S3). - 特許庁

それぞれ水晶からなり線膨張係数の異なる第一光学部材１１及び第二光学部材１２と、これらの第一光学部材１１と第二光学部材１２とを分子接合する接合層１３とを備え、接合層１３をプラズマ重合膜１３１から構成した。例文帳に追加

The optical article comprises a first optical member 11 and a second optical member 12 each formed of quartz and differed in linear expansion coefficient, and a junction layer 13 molecularly joining the first optical member 11 and the second optical member 12 together, the junction layer 13 being formed of a plasma polymerization film 131. - 特許庁

この接合部は、温度Ｔｏ（℃）より高い温度Ｔ１（℃）で使用に供されたときは、スリーブ１５が熱膨張するので、光学部品１１および１３の接合面に引っ張り張力を発生させ、接合面間隔が広がるが、その分だけ弾性樹脂が伸びて対応する。例文帳に追加

Since the sleeve 15 is thermally expanded when it is used at a temperature T1 (°C) higher than the temperature To (°C), this joining part generates tension on the joining faces of the optical parts 11 and 13, and the distance between the joining faces increases, however, the elastic resin stretches by the portion correspondingly. - 特許庁